BI Technologies L051S132FLF

Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

Contact shape in electronic components refers to the physical geometry of the interface where electrical connections are made. It plays a critical role in determining the quality and reliability of the connection, impacting factors such as resistance, current density, and heat dissipation. Various shapes, such as flat, cylindrical, or custom profiles, influence the contact area, enabling designers to optimize performance for specific applications. The contact shape also affects the mechanical stability of the connection, influencing wear and longevity.

The "Shell Material" parameter in electronic components refers to the material used to encase or cover the internal components of the device. This material is chosen based on various factors such as durability, heat resistance, electrical insulation properties, and environmental considerations. Common shell materials include plastics, metals, and ceramics, each offering different levels of protection and performance characteristics. The choice of shell material can impact the overall reliability, safety, and functionality of the electronic component in different operating conditions.

The parameter "Housing Material" in electronic components refers to the material used to encase or protect the internal circuitry of the component. The housing material plays a crucial role in providing physical protection, insulation, and environmental resistance to the electronic component. Common housing materials include plastics, metals, ceramics, and composites, each offering different levels of durability, heat resistance, and electrical properties. The choice of housing material is important in determining the overall performance, reliability, and longevity of the electronic component in various operating conditions.

The PCB Mounting Orientation refers to the specific position or alignment in which an electronic component is mounted onto a printed circuit board (PCB). This parameter is crucial for ensuring proper functionality and performance of the component within the electronic system. The orientation can include factors such as the physical placement, angle, and direction in which the component is mounted on the PCB. It is important to follow the manufacturer's guidelines and specifications for the correct PCB Mounting Orientation to avoid potential issues such as electrical shorts, mechanical stress, or interference with other components on the board.

PCB Mount Retention refers to the ability of an electronic component to securely attach to a printed circuit board (PCB) and remain in place during operation and handling. This parameter is crucial for ensuring the reliability and stability of the component within the electronic system. Components with good PCB mount retention are less likely to become dislodged or detached from the PCB due to factors such as vibration, thermal cycling, or mechanical stress. Manufacturers often provide specifications or guidelines for PCB mount retention to help designers and engineers select the appropriate components for their applications.

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

Connector Type in electronic components refers to the specific design and configuration of the connector used to establish electrical connections between different devices or components. This parameter describes the physical shape, size, and layout of the connector, as well as the number and arrangement of pins or contacts. Common connector types include USB, HDMI, RJ45, and D-sub connectors, each serving different purposes and applications. Understanding the connector type is crucial for ensuring compatibility and proper functionality when connecting electronic devices together.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

In electronic components, "Pitch" refers to the distance between the center of one pin or lead to the center of the adjacent pin or lead on a component, such as an integrated circuit (IC) or a connector. It is a crucial parameter as it determines the spacing and alignment of the pins or leads on a component, which in turn affects how the component can be mounted on a circuit board or connected to other components.The pitch measurement is typically expressed in millimeters (mm) or inches (in) and plays a significant role in determining the overall size and layout of a circuit board. Components with different pitches may require specific types of circuit boards or connectors to ensure proper alignment and connection. Designers must carefully consider the pitch of components when designing circuit layouts to ensure compatibility and proper functionality of the electronic system.

In electronic components, the parameter "Orientation" refers to the specific alignment or positioning of the component with respect to its intended installation or operation. This parameter is crucial for ensuring proper functionality and performance of the component within a circuit or system. Orientation may include factors such as the physical orientation of the component on a circuit board, the direction of current flow through the component, or the alignment of specific features or terminals for correct connection. Manufacturers often provide orientation guidelines in datasheets or technical specifications to help users correctly install and use the component. Paying attention to the orientation of electronic components is essential to prevent errors, ensure reliability, and optimize the overall performance of electronic devices.

In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

Housing color in electronic components refers to the color of the protective casing or enclosure that surrounds the component. It can play a role in visual identification, aiding in easy recognition during assembly or maintenance. Additionally, the housing color may also have implications for heat dissipation, aesthetic considerations, or regulatory compliance depending on the application or industry standards.

Lead length refers to the distance from the body of an electronic component to the end of its leads or terminals. It is an important specification in component design and packaging, as it affects the ease of soldering, the overall fit within a circuit board, and the electrical performance. Longer leads can facilitate easier connections but may also introduce increased resistance or inductance in high-frequency applications. Proper lead length is crucial for ensuring reliable connections and optimal performance in electronic circuits.

the space needed between rows to allow room for people or farm equipment to get through.

ELV stands for Extra-Low Voltage, which refers to a specific voltage range used in electronic components and systems. This voltage range typically falls below 50 volts AC or 120 volts DC. ELV systems are designed to operate at lower voltages for safety reasons, as they pose a reduced risk of electric shock compared to higher voltage systems. Components and devices operating within the ELV range are commonly used in various applications, such as telecommunications, data centers, and low-power electronics. Adhering to ELV standards helps ensure the safety of both users and equipment in these systems.

In the context of electronic components, "Plating" refers to a process of depositing a thin layer of metal onto a substrate material. This plating is often used to enhance the component's performance, durability, and conductivity. The plating material can vary depending on the specific requirements of the component, with common choices including gold, silver, tin, and nickel. Plating can also be used for corrosion resistance, solderability, and to improve the overall appearance of the component. Overall, plating plays a crucial role in ensuring the reliability and functionality of electronic components in various applications.

A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

The parameter "Sealable" in electronic components refers to the ability of the component to be securely sealed or enclosed to protect it from environmental factors such as moisture, dust, and other contaminants. Components that are sealable are designed to prevent damage or malfunction caused by exposure to these external elements. This sealing can be achieved through various methods such as encapsulation, potting, or conformal coating. Ensuring that electronic components are sealable is important for maintaining their reliability and longevity in various operating conditions.

The "Hole Diameter" parameter in electronic components refers to the size of the hole that is designed to accommodate a lead or pin of another component for soldering or connection purposes. It is a critical dimension that ensures proper alignment and fit between components during assembly. The hole diameter is typically specified in millimeters or inches and plays a crucial role in determining the mechanical stability and electrical connectivity of the overall circuit or device. Manufacturers provide specific hole diameter requirements to ensure compatibility and reliability in electronic assemblies.

The parameter "Preloaded" in electronic components refers to a state where a certain amount of force or tension is applied to the component before it is put into use. This preloading helps to ensure that the component remains secure and stable during operation, especially in applications where there may be vibrations or other external forces acting on the component.Preloading can be achieved through various methods such as using springs, screws, or other mechanical means to apply the necessary force or tension to the component. By preloading the component, it can help to prevent issues such as loosening, shifting, or failure during operation, ultimately improving the reliability and performance of the electronic system.Overall, the preloaded parameter is an important consideration in the design and installation of electronic components, particularly in applications where stability and security are critical requirements. Proper preloading can help to enhance the overall durability and functionality of the electronic system.

The parameter "Mating Connector Lock" in electronic components refers to a feature that ensures a secure and stable connection between two connectors. This lock mechanism is designed to prevent accidental disconnection or loosening of the connectors during operation, which can lead to signal loss or malfunction. The mating connector lock can come in various forms, such as locking tabs, screws, or latches, depending on the specific design of the connectors. Overall, this feature enhances the reliability and durability of the connection, making it suitable for applications where vibration, movement, or external forces may impact the connection stability.

PCB thickness refers to the measurement of the thickness of a printed circuit board, typically expressed in millimeters or mils. It plays a crucial role in determining the mechanical strength, flexibility, and thermal performance of the PCB. Standard thicknesses commonly range from 0.2 mm to 3.2 mm, with the most common thickness being 1.6 mm. The choice of PCB thickness affects the overall design and functionality of electronic devices, influencing factors such as signal integrity and power management.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

The Flammability Rating of electronic components refers to the material's ability to resist catching fire or burning when exposed to heat or flames. It is an important safety consideration in electronic design and manufacturing, especially for components that may be used in environments where fire hazards are a concern. The rating is typically expressed using a standardized scale, such as UL94, which classifies materials based on their flammability characteristics. Components with higher flammability ratings are more resistant to ignition and contribute to overall fire safety in electronic devices. It is crucial to select components with appropriate flammability ratings to ensure the reliability and safety of electronic products.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.