Bourns Inc. CD214A-T43CALF

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

a count of all of the component leads (or pins)

The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

Leakage current is a term used in electronics to describe the small amount of current that flows through a component when it is supposed to be in a non-conductive state. This current can occur due to imperfections in the materials used to manufacture the component, as well as other factors such as temperature and voltage. Leakage current can lead to power loss, reduced efficiency, and potential reliability issues in electronic devices. It is important to consider and minimize leakage current in electronic components to ensure proper functionality and performance.

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

During fault, the only circuit breaker closest to the fault point should be tripped. The operating time of relay associated with protection of line should be as minimum as possible in order to prevent unnecessary tripping of circuit breakers associated with other healthy parts of power system.

Max Reverse Leakage Current refers to the maximum amount of current that can flow through a semiconductor device, such as a diode or transistor, when it is reverse biased. This current is an important parameter as it indicates the level of unintended current that can flow when the device is not conducting in the forward direction. High values of reverse leakage current can lead to power loss, reduced efficiency, and may affect the performance and reliability of electronic circuits. It is particularly critical in applications where precise current control and low power consumption are necessary.

Voltage - Clamping (Max) @ Ipp refers to the maximum voltage that a component, such as a transient voltage suppressor or diode, can clamp when subjected to a specific peak current (Ipp). It indicates the upper limit of voltage that the component will allow to pass through, effectively protecting sensitive circuits from overvoltage conditions. This parameter is crucial for ensuring that devices are safeguarded against voltage spikes without being damaged. Designers use this specification to select appropriate components for overvoltage protection in their applications.

Clamping voltage is a term used in electronic components, particularly in devices like diodes and transient voltage suppressors. It refers to the maximum voltage level at which the component can effectively limit or clamp the voltage across its terminals. When the voltage across the component exceeds the clamping voltage, the component conducts and effectively limits the voltage to that level, protecting the circuit from overvoltage conditions. Clamping voltage is an important parameter to consider when selecting components for applications where voltage spikes or surges may occur, as it determines the level at which the component will start to protect the circuit.

The peak pulse power rating of a TVS diode is defined as the instantaneous power dissipated by a device for a given pulse condition, and is a measure of the power that is dissipated in the TVS junction during a given transient event.

Surge current is a peak non repetitive current. Maximum (peak or surge) forward current = IFSM or if(surge), the maximum peak amount of current the diode is able to conduct in forward bias mode.

Peak Pulse Power is a parameter used to specify the maximum amount of power that an electronic component can handle during a transient event, such as a surge or spike in voltage or current. It indicates the maximum power dissipation capability of the component for a short duration. This parameter is important for protecting electronic circuits from damage caused by sudden high-energy events. Peak Pulse Power is typically expressed in watts and is crucial for selecting components that can withstand transient overloads without failing. It helps ensure the reliability and longevity of electronic systems in various applications.

In electronic components, the parameter "Direction" refers to the orientation or alignment in which the component is designed to operate effectively. This parameter is particularly important for components such as diodes, transistors, and capacitors, which have specific polarity or orientation requirements for proper functionality. For example, diodes allow current flow in one direction only, so their direction parameter indicates the correct orientation for current flow. Similarly, polarized capacitors have a positive and negative terminal, requiring proper alignment for correct operation. Understanding and adhering to the direction parameter is crucial for ensuring the reliable and efficient performance of electronic components in a circuit.

Test Current refers to a specified amount of electrical current applied to an electronic component during testing to evaluate its performance and characteristics. This current is typically defined by manufacturers to ensure that the component operates within its designed parameters. By measuring how the component reacts to this test current, engineers can determine its reliability, efficiency, and suitability for specific applications.

Bidirectional channels in electronic components refer to pathways or connections that allow signal transmission in both directions. This means that data can flow from one device to another and back again, enabling two-way communication. Such channels are essential in applications like data buses, communication interfaces, and certain types of network protocols, facilitating efficient and dynamic interactions between components.

Reverse Breakdown Voltage is the maximum reverse voltage a semiconductor device can withstand before it starts to conduct heavily in the reverse direction. It is a critical parameter in diodes and other components, indicating the threshold at which the material's insulating properties fail. Beyond this voltage, the device may enter a breakdown region, leading to potential damage if not properly managed. This parameter is essential for ensuring safe operation and reliability in electronic circuits.

ESD protection, or Electrostatic Discharge protection, is a feature in electronic components designed to prevent damage caused by sudden electrostatic discharges. These discharges can occur when a person or object with an electric charge comes into contact with a sensitive electronic component, leading to a rapid flow of static electricity that can damage or destroy the component. ESD protection mechanisms in electronic components typically involve the use of special materials or circuitry that can safely dissipate or divert the excess charge away from the sensitive components, thus safeguarding the device from potential harm. Implementing effective ESD protection is crucial in ensuring the reliability and longevity of electronic devices, especially in environments where static electricity buildup is common, such as in manufacturing facilities or areas with low humidity.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.