Bourns Inc. PTVS10-058C-SH

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

The "Working Voltage" parameter in electronic components refers to the maximum voltage that the component can safely handle while operating within its specified parameters. It is a crucial specification to consider when designing or selecting components for a circuit to prevent damage or failure. Exceeding the working voltage can lead to breakdown or insulation failure, potentially causing the component to malfunction or even become permanently damaged. It is important to always operate electronic components within their specified working voltage range to ensure reliable and safe operation of the circuit.

In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

During fault, the only circuit breaker closest to the fault point should be tripped. The operating time of relay associated with protection of line should be as minimum as possible in order to prevent unnecessary tripping of circuit breakers associated with other healthy parts of power system.

Voltage - Breakdown (Min) is a parameter used to specify the minimum voltage level at which an electronic component, such as a diode or capacitor, will break down and allow current to flow through it uncontrollably. This breakdown voltage is a critical characteristic that determines the maximum voltage the component can withstand before failing. It is important to ensure that the applied voltage does not exceed this minimum breakdown voltage to prevent damage to the component and maintain proper functionality. Manufacturers provide this specification to help engineers and designers select components that are suitable for their intended applications and operating conditions.

The parameter "Current - Peak Pulse (10/1000μs)" in electronic components refers to the maximum current that a device can handle during a transient overvoltage event with a specific waveform, typically a 10/1000μs pulse. This parameter is important for surge protection devices such as transient voltage suppressors (TVS) and varistors, as it indicates the device's ability to divert excess current away from sensitive components and protect them from damage. A higher peak pulse current rating signifies better surge protection capability, making the component more suitable for applications exposed to high-voltage transients or lightning strikes. Designers should carefully consider this parameter when selecting surge protection components to ensure reliable operation and protection of their electronic circuits.

Max Reverse Leakage Current refers to the maximum amount of current that can flow through a semiconductor device, such as a diode or transistor, when it is reverse biased. This current is an important parameter as it indicates the level of unintended current that can flow when the device is not conducting in the forward direction. High values of reverse leakage current can lead to power loss, reduced efficiency, and may affect the performance and reliability of electronic circuits. It is particularly critical in applications where precise current control and low power consumption are necessary.

Clamping voltage is a term used in electronic components, particularly in devices like diodes and transient voltage suppressors. It refers to the maximum voltage level at which the component can effectively limit or clamp the voltage across its terminals. When the voltage across the component exceeds the clamping voltage, the component conducts and effectively limits the voltage to that level, protecting the circuit from overvoltage conditions. Clamping voltage is an important parameter to consider when selecting components for applications where voltage spikes or surges may occur, as it determines the level at which the component will start to protect the circuit.

The peak pulse power rating of a TVS diode is defined as the instantaneous power dissipated by a device for a given pulse condition, and is a measure of the power that is dissipated in the TVS junction during a given transient event.

Surge current is a peak non repetitive current. Maximum (peak or surge) forward current = IFSM or if(surge), the maximum peak amount of current the diode is able to conduct in forward bias mode.

Test Current refers to a specified amount of electrical current applied to an electronic component during testing to evaluate its performance and characteristics. This current is typically defined by manufacturers to ensure that the component operates within its designed parameters. By measuring how the component reacts to this test current, engineers can determine its reliability, efficiency, and suitability for specific applications.

Bidirectional channels in electronic components refer to pathways or connections that allow signal transmission in both directions. This means that data can flow from one device to another and back again, enabling two-way communication. Such channels are essential in applications like data buses, communication interfaces, and certain types of network protocols, facilitating efficient and dynamic interactions between components.

ESD protection, or Electrostatic Discharge protection, is a feature in electronic components designed to prevent damage caused by sudden electrostatic discharges. These discharges can occur when a person or object with an electric charge comes into contact with a sensitive electronic component, leading to a rapid flow of static electricity that can damage or destroy the component. ESD protection mechanisms in electronic components typically involve the use of special materials or circuitry that can safely dissipate or divert the excess charge away from the sensitive components, thus safeguarding the device from potential harm. Implementing effective ESD protection is crucial in ensuring the reliability and longevity of electronic devices, especially in environments where static electricity buildup is common, such as in manufacturing facilities or areas with low humidity.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.