Bourns Inc. TISP4300M3BJR
Bourns Inc. TISP4300M3BJR
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Bourns Inc. TISP4300M3BJR

Manufacturer No:

TISP4300M3BJR

Manufacturer:

Bourns Inc.

Utmel No:

337-TISP4300M3BJR

Package:

DO-214AA, SMB

Datasheet:

TISP4yyyM3BJ

ECAD Model:

Description:

SURGE SUPP 230V BIDIR DO-214AA

Quantity:

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

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In Stock : Please Inquire

Please send RFQ , we will respond immediately.

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
TISP4300M3BJR information

Specifications
Documents & Media
Bourns Inc. TISP4300M3BJR technical specifications, attributes, parameters and parts with similar specifications to Bourns Inc. TISP4300M3BJR.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    DO-214AA, SMB
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Elements
    1
  • Voltage-Off State
    230V
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2005
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    2
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Lead (Sn/Pb)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    85°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40°C
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    UL RECOGNIZED
  • Capacitance

    Capacitance is a fundamental electrical property of electronic components that describes their ability to store electrical energy in the form of an electric field. It is measured in farads (F) and represents the ratio of the amount of electric charge stored on a component to the voltage across it. Capacitors are passive components that exhibit capacitance and are commonly used in electronic circuits for various purposes such as filtering, energy storage, timing, and coupling. Capacitance plays a crucial role in determining the behavior and performance of electronic systems by influencing factors like signal propagation, frequency response, and power consumption.

    83pF
  • Voltage - Rated DC

    Voltage - Rated DC is a parameter that specifies the maximum direct current (DC) voltage that an electronic component can safely handle without being damaged. This rating is crucial for ensuring the proper functioning and longevity of the component in a circuit. Exceeding the rated DC voltage can lead to overheating, breakdown, or even permanent damage to the component. It is important to carefully consider this parameter when designing or selecting components for a circuit to prevent any potential issues related to voltage overload.

    230V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    C BEND
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    not_compliant
  • Current Rating

    Current rating is the maximum current that a fuse will carry for an indefinite period without too much deterioration of the fuse element.

    5A
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    TISP4300
  • Pin Count

    a count of all of the component leads (or pins)

    2
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDSO-C2
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    SINGLE
  • Current - Peak Pulse (10/1000μs)

    The parameter "Current - Peak Pulse (10/1000μs)" in electronic components refers to the maximum current that a device can handle during a transient overvoltage event with a specific waveform, typically a 10/1000μs pulse. This parameter is important for surge protection devices such as transient voltage suppressors (TVS) and varistors, as it indicates the device's ability to divert excess current away from sensitive components and protect them from damage. A higher peak pulse current rating signifies better surge protection capability, making the component more suitable for applications exposed to high-voltage transients or lightning strikes. Designers should carefully consider this parameter when selecting surge protection components to ensure reliable operation and protection of their electronic circuits.

    50A
  • Peak Pulse Current

    The peak pulse power rating of a TVS diode is defined as the instantaneous power dissipated by a device for a given pulse condition, and is a measure of the power that is dissipated in the TVS junction during a given transient event.

    220A
  • Hold Current

    the minimum current which must pass through a circuit in order for it to remain in the 'ON' state.

    150mA
  • Trigger Device Type

    Trigger Device Type is a parameter in electronic components that refers to the type of device or mechanism used to initiate a specific action or function within the component. This parameter specifies the specific trigger device, such as a sensor, switch, or signal input, that is required to activate or control the operation of the component. Understanding the trigger device type is crucial for proper integration and operation of the electronic component within a larger system or circuit. By specifying the appropriate trigger device type, engineers and designers can ensure that the component functions correctly and responds to the intended input signals or conditions.

    SILICON SURGE PROTECTOR
  • Non-Repetitive Pk On-state Cur

    Non-Repetitive Pk On-state Current, often abbreviated as Non-Repetitive Pk On-state Cur, is a parameter that defines the maximum current that a semiconductor device, such as a thyristor or triac, can withstand for a short duration without sustaining damage. This current level is typically specified under particular conditions and is meant to represent transient events rather than continuous operation. It indicates the device's ability to handle sudden surges in current, which may occur due to load changes or fault conditions, while ensuring that the component does not suffer thermal or electrical breakdown during this brief period.

    32 A
  • Voltage - Breakover

    Voltage - Breakover is a parameter that refers to the voltage level at which a specific electronic component, such as a thyristor or a gas discharge tube, transitions from a high-resistance state to a low-resistance state. This transition is known as the breakover voltage, and it is a critical characteristic in determining the operating conditions and performance of the component. When the breakover voltage is reached, the component essentially "breaks over" and allows a significant current to flow through it. Understanding the breakover voltage is essential for designing and using electronic circuits effectively, as it helps ensure proper functionality and protection against voltage surges or overloads.

    300V
  • Voltage - On State

    Voltage - On State is a parameter used to describe the voltage drop across an electronic component when it is in the conducting state. In simple terms, it refers to the voltage required to turn on the component and allow current to flow through it. This parameter is crucial in determining the efficiency and performance of the component in a circuit. A lower voltage-on state typically indicates a more efficient and desirable component for certain applications. It is important to consider this parameter when selecting components for a circuit to ensure proper functionality and optimal performance.

    3V
  • Holding Current-Max

    The parameter "Holding Current-Max" in electronic components refers to the maximum current required to maintain the component in its ON state once it has been triggered or turned on. This holding current is necessary to prevent the component from turning off unintentionally due to fluctuations in the input signal or other external factors. It is an important specification for components such as thyristors, triacs, and other semiconductor devices that require a continuous current to remain in the conducting state. Understanding the Holding Current-Max value is crucial for ensuring the reliable operation of the component within its specified parameters.

    350mA
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
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