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In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

The center distance from one pole to the next.

In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

The parameter "Voltage - Forward (Vf) (Typ)" in electronic components refers to the typical forward voltage drop across the component when it is conducting current in the forward direction. It is a crucial characteristic of components like diodes and LEDs, indicating the minimum voltage required for the component to start conducting current. The forward voltage drop is typically specified as a typical value because it can vary slightly based on factors such as temperature and manufacturing tolerances. Designers use this parameter to ensure that the component operates within its specified voltage range and to calculate power dissipation in the component.

the angle at which a display can be viewed with acceptable visual performance.

Optoelectronic Device Type refers to the classification of electronic components that can both detect and emit light. These devices convert electrical signals into light or vice versa, making them essential for applications such as optical communication, sensing, and display technologies. Common types of optoelectronic devices include light-emitting diodes (LEDs), photodiodes, phototransistors, and laser diodes. Understanding the optoelectronic device type is crucial for selecting the appropriate component for a specific application based on factors such as wavelength, power output, and sensitivity.

Current which flows upon application of forward voltage.

Current - Test is a parameter in electronic components that refers to the maximum current that the component can handle during testing without being damaged. This parameter is crucial for determining the operational limits of the component and ensuring its reliability under specified conditions. It is typically specified in the component's datasheet and is important for designers and engineers to consider when designing circuits to prevent overloading the component. Testing the component at or below the specified "Current - Test" value helps ensure its proper functioning and longevity in the intended application.

In the context of electronic components, the parameter "Lens Style" typically refers to the design or shape of the lens used in optical components such as LEDs, photodiodes, or sensors. The lens style can affect the light output, beam angle, and overall performance of the component. Common lens styles include flat top, dome, narrow beam, wide beam, and diffused lenses. Choosing the appropriate lens style is important for achieving the desired light distribution and optical characteristics in electronic devices. Manufacturers often provide specifications on the lens style to help users select the most suitable component for their application.

In electronic components, the parameter "Lens Size" typically refers to the physical size of the lens used in optical components such as cameras, sensors, or optical devices. The lens size is an important specification as it determines the field of view, focal length, and light-gathering capabilities of the optical system. A larger lens size generally allows for more light to enter the system, resulting in better image quality and improved performance in low-light conditions. Manufacturers often provide the lens size in millimeters, indicating the diameter of the lens element. It is important to consider the lens size when selecting optical components to ensure they meet the requirements of the intended application.

In photometry, luminous intensity is a measure of the wavelength-weighted power emitted by a light source in a particular direction per unit solid angle, based on the luminosity function, a standardized model of the sensitivity of the human eye.

Lens Transparency in electronic components refers to the ability of a lens to allow light to pass through it without significant absorption or scattering. It is a measure of how much light is transmitted through the lens material, impacting the performance of optical devices such as sensors and cameras. High lens transparency is crucial for ensuring clear images and accurate data capture in various applications.

The parameter "Wavelength - Peak" in electronic components refers to the specific wavelength at which the component's performance or characteristics reach their peak efficiency or effectiveness. This parameter is commonly used in devices such as LEDs, photodiodes, and laser diodes to indicate the optimal operating wavelength for maximum output or sensitivity. Understanding the peak wavelength is crucial for selecting the right component for a particular application, as it directly impacts the performance and functionality of the device. Manufacturers typically provide this information in datasheets to help engineers and designers make informed decisions when choosing electronic components for their projects.

the voltage drop across the diode if the voltage at the cathode is more positive than the voltage at the anode

Forward Voltage-Max refers to the maximum voltage that can be applied to a semiconductor device, such as a diode or LED, in the forward-biased condition without causing damage. It indicates the highest voltage level that allows the device to operate efficiently while conducting current. Exceeding this parameter may lead to thermal runaway or failure of the component. This value is crucial for ensuring proper circuit design and reliability.

In the context of electronic components, "T-code" refers to a temperature code that indicates the maximum operating temperature of the component. This code is typically represented by a letter followed by a number, such as T1, T2, T3, etc. The letter signifies the temperature range within which the component can operate safely, while the number indicates the specific maximum temperature in degrees Celsius.Understanding the T-code of electronic components is crucial for ensuring their proper functioning and longevity in various operating conditions. It helps engineers and designers select components that can withstand the temperature requirements of their specific applications. By adhering to the recommended temperature codes, the risk of overheating and potential damage to the components can be minimized, ultimately contributing to the reliability and performance of electronic systems.

In electronic components, the parameter "Diameter" typically refers to the measurement of the width of a circular component, such as a resistor, capacitor, or inductor. It is a crucial dimension that helps determine the physical size and fit of the component within a circuit or on a circuit board. The diameter is usually measured in millimeters (mm) or inches (in) and is important for ensuring proper placement and soldering of the component during assembly. Understanding the diameter of electronic components is essential for selecting the right size for a specific application and ensuring compatibility with other components and the overall design of the circuit.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.