Broadcom Limited HSMD-C197

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

The "Power Rating" of an electronic component refers to the maximum amount of power that the component can handle or dissipate without being damaged. It is typically measured in watts and is an important specification to consider when designing or selecting components for a circuit. Exceeding the power rating of a component can lead to overheating, malfunction, or even permanent damage. It is crucial to ensure that the power rating of each component in a circuit is sufficient to handle the power levels expected during normal operation to maintain the reliability and longevity of the electronic system.

The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

Case Code (Metric) in electronic components refers to a standardized system that specifies the dimensions of surface-mount devices (SMD) in millimeters, consisting of a four-digit number where the first two digits represent the width and the last two digits represent the height of the component, measured in tenths of a millimeter. The metric case codes are standardized by organizations such as the EIA and IEC, and are often compared to the Imperial code which uses inches, allowing for easier identification and selection of components across different regions and industries. This coding system is widely used in the design and manufacturing of electronic devices, particularly in applications requiring compact and efficient component layouts, and is essential for engineers and designers to ensure proper component selection and facilitate the assembly process in electronic manufacturing.

The term "Case Code (Imperial)" in electronic components refers to a standardized system used to specify the physical dimensions and package types of components, particularly capacitors and resistors. This code helps manufacturers and engineers identify the size and form factor of the component, ensuring compatibility with circuit designs and PCB layouts. In the context of electronic components, the Case Code (Imperial) typically follows a numerical format that indicates the length and width of the component in inches. For example, a Case Code of 1206 signifies a component that measures 0.12 inches by 0.06 inches. This coding system is essential for selecting the correct components for specific applications, as it provides a quick reference to the physical characteristics of the part, including its footprint and mounting style.

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

The parameter "Voltage - Forward (Vf) (Typ)" in electronic components refers to the typical forward voltage drop across the component when it is conducting current in the forward direction. It is a crucial characteristic of components like diodes and LEDs, indicating the minimum voltage required for the component to start conducting current. The forward voltage drop is typically specified as a typical value because it can vary slightly based on factors such as temperature and manufacturing tolerances. Designers use this parameter to ensure that the component operates within its specified voltage range and to calculate power dissipation in the component.

the angle at which a display can be viewed with acceptable visual performance.

Optoelectronic Device Type refers to the classification of electronic components that can both detect and emit light. These devices convert electrical signals into light or vice versa, making them essential for applications such as optical communication, sensing, and display technologies. Common types of optoelectronic devices include light-emitting diodes (LEDs), photodiodes, phototransistors, and laser diodes. Understanding the optoelectronic device type is crucial for selecting the appropriate component for a specific application based on factors such as wavelength, power output, and sensitivity.

Current which flows upon application of forward voltage.

In the context of electronic components, the parameter "Lens Style" typically refers to the design or shape of the lens used in optical components such as LEDs, photodiodes, or sensors. The lens style can affect the light output, beam angle, and overall performance of the component. Common lens styles include flat top, dome, narrow beam, wide beam, and diffused lenses. Choosing the appropriate lens style is important for achieving the desired light distribution and optical characteristics in electronic devices. Manufacturers often provide specifications on the lens style to help users select the most suitable component for their application.

In electronic components, the parameter "Lens Size" typically refers to the physical size of the lens used in optical components such as cameras, sensors, or optical devices. The lens size is an important specification as it determines the field of view, focal length, and light-gathering capabilities of the optical system. A larger lens size generally allows for more light to enter the system, resulting in better image quality and improved performance in low-light conditions. Manufacturers often provide the lens size in millimeters, indicating the diameter of the lens element. It is important to consider the lens size when selecting optical components to ensure they meet the requirements of the intended application.

In photometry, luminous intensity is a measure of the wavelength-weighted power emitted by a light source in a particular direction per unit solid angle, based on the luminosity function, a standardized model of the sensitivity of the human eye.

The Millicandela Rating is a measurement unit used to quantify the luminous intensity of a light-emitting diode (LED) or other light sources. It indicates how bright the light emitted by the component will be in a specific direction. The Millicandela Rating is typically expressed in millicandelas (mcd), with higher values indicating a brighter light output. This parameter is important for determining the visibility and brightness of LEDs in various applications, such as displays, indicators, and lighting systems. Manufacturers provide Millicandela Ratings to help users select the appropriate components for their specific lighting needs.

Lens Transparency in electronic components refers to the ability of a lens to allow light to pass through it without significant absorption or scattering. It is a measure of how much light is transmitted through the lens material, impacting the performance of optical devices such as sensors and cameras. High lens transparency is crucial for ensuring clear images and accurate data capture in various applications.

The parameter "Wavelength - Peak" in electronic components refers to the specific wavelength at which the component's performance or characteristics reach their peak efficiency or effectiveness. This parameter is commonly used in devices such as LEDs, photodiodes, and laser diodes to indicate the optimal operating wavelength for maximum output or sensitivity. Understanding the peak wavelength is crucial for selecting the right component for a particular application, as it directly impacts the performance and functionality of the device. Manufacturers typically provide this information in datasheets to help engineers and designers make informed decisions when choosing electronic components for their projects.

affect how much visible light reaches people's eyes, how well people see other colors and how well they see contrasts.

the voltage drop across the diode if the voltage at the cathode is more positive than the voltage at the anode

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.