Chip Quik Inc. CQT1-20.000

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Shelf life in electronic components refers to the duration that a component can remain in storage under recommended conditions without significant degradation in its performance or reliability. It is an important factor for manufacturers and users, as prolonged storage may lead to changes in the material properties or functionality of the component. Typically, shelf life is specified for components such as capacitors, resistors, and semiconductors to ensure they perform as intended when implemented in electronic systems. Proper storage conditions, including temperature and humidity control, are crucial to preserving the shelf life of electronic components.

Adhesive in electronic components refers to materials used to bond various parts together within an electronic assembly. These adhesives can provide structural integrity and durability to components such as circuit boards, connectors, and housing. They may also offer protective properties against environmental factors, such as moisture and heat, and can enhance electrical insulation. The selection of a suitable adhesive is critical to the performance and reliability of the final electronic product.

Shelf Life Start refers to the point in time when the shelf life of an electronic component begins. The shelf life is the duration for which a component can be stored under specific conditions and still meet its performance specifications. The Shelf Life Start is typically marked by the date of manufacture or the date when the component is packaged and sealed. It is important to adhere to the specified shelf life guidelines to ensure the reliability and functionality of electronic components, especially in critical applications where performance is crucial.

Backing, Carrier in electronic components refers to a material or structure that provides support or a base for the component. It is often used to enhance the mechanical stability, thermal performance, or electrical properties of the component. The backing or carrier can be made of various materials such as ceramics, metals, or polymers, depending on the specific requirements of the component and its intended application. Overall, the backing or carrier plays a crucial role in ensuring the reliability and functionality of the electronic component.

Tape Type in electronic components refers to the classification of adhesive tape used for various purposes in electronics assembly and manufacturing. It encompasses different types such as insulating tape, electrical tape, and masking tape, each designed for specific functions like insulation, protection, or securing components. The tape type is crucial for ensuring reliability and performance in electronic applications by providing appropriate adhesion, temperature resistance, and mechanical strength.

The difference between the maximum and minimum temperatures or between the highest and lowest mean temperatures during a specified time interval.

Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

The parameter "Thickness - Adhesive" in electronic components refers to the measurement of the thickness of the adhesive material used to bond different layers or components together within the electronic device. This adhesive layer is crucial for providing structural integrity, insulation, and protection to the components. The thickness of the adhesive can impact the overall performance and reliability of the electronic component, as it can affect factors such as thermal conductivity, mechanical strength, and electrical insulation. Manufacturers specify the thickness of the adhesive to ensure proper bonding and functionality of the electronic component.

The parameter "Thickness - Backing, Carrier" in electronic components refers to the measurement of the thickness of the material that supports or carries the main component. This backing or carrier material provides structural support and may also serve as a medium for mounting or connecting the component within a larger system. The thickness of the backing or carrier is an important consideration in the design and assembly of electronic components as it can impact the overall dimensions, mechanical stability, and thermal performance of the component. Manufacturers typically provide this parameter to help engineers and designers select the appropriate components for their specific application requirements.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.