Diodes Incorporated D34V0H1U2LP-7B

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

During fault, the only circuit breaker closest to the fault point should be tripped. The operating time of relay associated with protection of line should be as minimum as possible in order to prevent unnecessary tripping of circuit breakers associated with other healthy parts of power system.

Voltage - Breakdown (Min) is a parameter used to specify the minimum voltage level at which an electronic component, such as a diode or capacitor, will break down and allow current to flow through it uncontrollably. This breakdown voltage is a critical characteristic that determines the maximum voltage the component can withstand before failing. It is important to ensure that the applied voltage does not exceed this minimum breakdown voltage to prevent damage to the component and maintain proper functionality. Manufacturers provide this specification to help engineers and designers select components that are suitable for their intended applications and operating conditions.

Power - Peak Pulse refers to the maximum transient power level that an electronic component, such as a diode or a transzorber, can safely dissipate during a short-duration pulse. This parameter is critical in determining the component's ability to withstand voltage spikes or surges without failure. It is typically expressed in watts and is measured over a specific duration, usually in microseconds or nanoseconds, to reflect the component's performance under peak conditions. Understanding this parameter helps designers select appropriate components for applications where transient conditions are expected.

The parameter "Current - Peak Pulse (10/1000μs)" in electronic components refers to the maximum current that a device can handle during a transient overvoltage event with a specific waveform, typically a 10/1000μs pulse. This parameter is important for surge protection devices such as transient voltage suppressors (TVS) and varistors, as it indicates the device's ability to divert excess current away from sensitive components and protect them from damage. A higher peak pulse current rating signifies better surge protection capability, making the component more suitable for applications exposed to high-voltage transients or lightning strikes. Designers should carefully consider this parameter when selecting surge protection components to ensure reliable operation and protection of their electronic circuits.

Voltage - Clamping (Max) @ Ipp refers to the maximum voltage that a component, such as a transient voltage suppressor or diode, can clamp when subjected to a specific peak current (Ipp). It indicates the upper limit of voltage that the component will allow to pass through, effectively protecting sensitive circuits from overvoltage conditions. This parameter is crucial for ensuring that devices are safeguarded against voltage spikes without being damaged. Designers use this specification to select appropriate components for overvoltage protection in their applications.

Voltage - Reverse Standoff (Typ) refers to the maximum reverse voltage that a semiconductor device, such as a diode or a transient voltage suppressor, can withstand without entering into breakdown. It is typically specified as a nominal value and indicates the voltage level at which the device transitions from its non-conducting state to a conducting state when reverse-biased. Exceeding this voltage can lead to permanent damage or failure of the component. This parameter is crucial for ensuring the safe operating limits of electronic circuits, particularly in protecting sensitive components from voltage spikes.

Unidirectional channels in electronic components refer to pathways that allow the flow of electrical current in only one direction. These channels are essential in devices like diodes, which permit current to pass through while blocking any reverse flow. Their primary function is to control and direct the flow of electricity, ensuring that circuit operation remains efficient and protects components from potential damage due to reverse currents. Unidirectional channels are commonly used in power supply circuits, signal rectification, and various electronic applications where controlled current flow is crucial.

Rep Pk Reverse Voltage-Max refers to the maximum reverse voltage that an electronic component, such as a diode, can withstand during a specified period of time without failing. This parameter is crucial in determining the safe operating limits of components in circuits where reverse voltage conditions may occur. Exceeding this value can lead to breakdown or permanent damage to the component. It is typically expressed in volts and is a key specification in signal and power applications.

Capacitance @ Frequency refers to the value of capacitance that a capacitor exhibits when subjected to an alternating current (AC) signal at a specific frequency. This parameter highlights how the capacitor's behavior changes with frequency, as capacitance can vary due to effects like equivalent series resistance (ESR) and loss factors. Typically measured in microfarads (µF) or picofarads (pF), this value is crucial for applications involving signal coupling, filtering, and timing where AC signals are prevalent. Understanding capacitance at different frequencies helps in selecting the right capacitor for specific circuit functions.

Non-rep Peak Rev Power Dis-Max is a parameter that refers to the maximum amount of power that an electronic component can handle in a non-repetitive peak reverse power dissipation scenario. This parameter is crucial in determining the component's ability to withstand sudden spikes or surges in power that may occur in the circuit. It is typically specified in datasheets for components such as diodes, transistors, and other semiconductor devices. Understanding this parameter is important for ensuring the reliability and longevity of the component in various operating conditions. It is essential to consider this parameter when designing circuits to prevent damage to the component due to excessive power dissipation.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.