Diodes Incorporated SMBJ43A-13

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

The "Power Rating" of an electronic component refers to the maximum amount of power that the component can handle or dissipate without being damaged. It is typically measured in watts and is an important specification to consider when designing or selecting components for a circuit. Exceeding the power rating of a component can lead to overheating, malfunction, or even permanent damage. It is crucial to ensure that the power rating of each component in a circuit is sufficient to handle the power levels expected during normal operation to maintain the reliability and longevity of the electronic system.

Voltage - Rated DC is a parameter that specifies the maximum direct current (DC) voltage that an electronic component can safely handle without being damaged. This rating is crucial for ensuring the proper functioning and longevity of the component in a circuit. Exceeding the rated DC voltage can lead to overheating, breakdown, or even permanent damage to the component. It is important to carefully consider this parameter when designing or selecting components for a circuit to prevent any potential issues related to voltage overload.

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

a count of all of the component leads (or pins)

The "Working Voltage" parameter in electronic components refers to the maximum voltage that the component can safely handle while operating within its specified parameters. It is a crucial specification to consider when designing or selecting components for a circuit to prevent damage or failure. Exceeding the working voltage can lead to breakdown or insulation failure, potentially causing the component to malfunction or even become permanently damaged. It is important to always operate electronic components within their specified working voltage range to ensure reliable and safe operation of the circuit.

In electronic components, polarity refers to the orientation or direction in which the component must be connected in a circuit to function properly. Components such as diodes, capacitors, and LEDs have polarity markings to indicate which terminal should be connected to the positive or negative side of the circuit. Connecting a component with incorrect polarity can lead to malfunction or damage. It is important to pay attention to polarity markings and follow the manufacturer's instructions to ensure proper operation of electronic components.

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

Leakage current is a term used in electronics to describe the small amount of current that flows through a component when it is supposed to be in a non-conductive state. This current can occur due to imperfections in the materials used to manufacture the component, as well as other factors such as temperature and voltage. Leakage current can lead to power loss, reduced efficiency, and potential reliability issues in electronic devices. It is important to consider and minimize leakage current in electronic components to ensure proper functionality and performance.

During fault, the only circuit breaker closest to the fault point should be tripped. The operating time of relay associated with protection of line should be as minimum as possible in order to prevent unnecessary tripping of circuit breakers associated with other healthy parts of power system.

The parameter "Current - Peak Pulse (10/1000μs)" in electronic components refers to the maximum current that a device can handle during a transient overvoltage event with a specific waveform, typically a 10/1000μs pulse. This parameter is important for surge protection devices such as transient voltage suppressors (TVS) and varistors, as it indicates the device's ability to divert excess current away from sensitive components and protect them from damage. A higher peak pulse current rating signifies better surge protection capability, making the component more suitable for applications exposed to high-voltage transients or lightning strikes. Designers should carefully consider this parameter when selecting surge protection components to ensure reliable operation and protection of their electronic circuits.

Clamping voltage is a term used in electronic components, particularly in devices like diodes and transient voltage suppressors. It refers to the maximum voltage level at which the component can effectively limit or clamp the voltage across its terminals. When the voltage across the component exceeds the clamping voltage, the component conducts and effectively limits the voltage to that level, protecting the circuit from overvoltage conditions. Clamping voltage is an important parameter to consider when selecting components for applications where voltage spikes or surges may occur, as it determines the level at which the component will start to protect the circuit.

The peak pulse power rating of a TVS diode is defined as the instantaneous power dissipated by a device for a given pulse condition, and is a measure of the power that is dissipated in the TVS junction during a given transient event.

Surge current is a peak non repetitive current. Maximum (peak or surge) forward current = IFSM or if(surge), the maximum peak amount of current the diode is able to conduct in forward bias mode.

Peak Pulse Power is a parameter used to specify the maximum amount of power that an electronic component can handle during a transient event, such as a surge or spike in voltage or current. It indicates the maximum power dissipation capability of the component for a short duration. This parameter is important for protecting electronic circuits from damage caused by sudden high-energy events. Peak Pulse Power is typically expressed in watts and is crucial for selecting components that can withstand transient overloads without failing. It helps ensure the reliability and longevity of electronic systems in various applications.

Test Current refers to a specified amount of electrical current applied to an electronic component during testing to evaluate its performance and characteristics. This current is typically defined by manufacturers to ensure that the component operates within its designed parameters. By measuring how the component reacts to this test current, engineers can determine its reliability, efficiency, and suitability for specific applications.

Reverse Breakdown Voltage is the maximum reverse voltage a semiconductor device can withstand before it starts to conduct heavily in the reverse direction. It is a critical parameter in diodes and other components, indicating the threshold at which the material's insulating properties fail. Beyond this voltage, the device may enter a breakdown region, leading to potential damage if not properly managed. This parameter is essential for ensuring safe operation and reliability in electronic circuits.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.