Essentra Components RBF-6.4-15-16

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The "Hole Diameter" parameter in electronic components refers to the size of the hole that is designed to accommodate a lead or pin of another component for soldering or connection purposes. It is a critical dimension that ensures proper alignment and fit between components during assembly. The hole diameter is typically specified in millimeters or inches and plays a crucial role in determining the mechanical stability and electrical connectivity of the overall circuit or device. Manufacturers provide specific hole diameter requirements to ensure compatibility and reliability in electronic assemblies.

The outer diameter (OD) of a hollow circular pipe is the measurement of the outside edges of the pipe passing through its center.

The "Head Diameter" parameter in electronic components refers to the measurement of the diameter of the head or top portion of the component. This measurement is important for determining the physical size and compatibility of the component with other parts or equipment. The head diameter is typically specified in millimeters or inches and is used to ensure proper fit and alignment during installation or assembly. It is a critical dimension to consider when designing circuits or selecting components for a project to ensure proper functionality and mechanical compatibility.

In electronic components, "Rivet Length" refers to the measurement of the length of a rivet used in the construction of the component. Rivets are often used to securely fasten different parts of electronic components together. The length of the rivet is an important parameter as it determines how securely the parts are joined and can impact the overall durability and reliability of the component. Manufacturers specify the rivet length based on the design requirements and the intended application of the electronic component. It is crucial to ensure that the rivet length meets the specifications to maintain the structural integrity and functionality of the component.

Grip Range in electronic components refers to the range of thicknesses or diameters of materials that can be securely held or gripped by a component such as a connector, clamp, or fastener. It is an important parameter to consider when selecting components for a specific application to ensure a proper and secure fit. The grip range typically specifies the minimum and maximum dimensions of the material that the component can effectively grip without causing damage or compromising the connection. Understanding the grip range of electronic components is crucial for ensuring reliable and stable connections in electronic assemblies.

Panel thickness in electronic components refers to the measurement of the thickness of the material used in the construction of a panel, such as a printed circuit board or housing enclosure. This parameter is crucial as it influences the mechanical stability, thermal conductivity, and overall durability of the component. Thicker panels can provide enhanced structural integrity and resistance to bending or warping, while thinner panels might be preferred for lightweight applications. The specific thickness needed often depends on the intended application and design requirements.

Head Height refers to the vertical distance from the highest point of a surface-mounted electronic component to the substrate or circuit board it is mounted on. This parameter is crucial for ensuring proper clearance and compatibility with other components in a design, as well as for maintaining effective heat dissipation. A suitable head height helps prevent physical interferences and facilitates the assembly and soldering processes in surface mount technology.

The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.