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having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

The center distance from one pole to the next.

Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

An indicator of formal certification of qualifications.

Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

Memory width refers to the number of bits that can be read or written to memory at one time. It is an important specification in electronic components, particularly in memory devices like RAM and cache. A wider memory width allows for greater data throughput, enabling faster performance as more data can be processed simultaneously. Memory width can vary among different types of memory and can impact both the complexity and efficiency of data handling within electronic systems.

Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

Memory density in electronic components refers to the amount of data that can be stored in a given physical space or memory module. It is typically measured in bits or bytes per unit area, such as bits per square inch. Higher memory density means that more data can be stored in a smaller space, which is important for devices with limited physical size or power constraints. Memory density is a key factor in determining the capacity and performance of memory devices, such as RAM, ROM, and flash memory, and is a critical consideration in the design and manufacturing of electronic products.

The parameter "Parallel/Serial" in electronic components refers to the method of data transmission or communication within the component. In parallel communication, multiple bits of data are transmitted simultaneously over multiple channels or wires. This allows for faster data transfer rates but requires more physical connections and can be more susceptible to signal interference.On the other hand, in serial communication, data is transmitted sequentially over a single channel or wire. While serial communication may have slower data transfer rates compared to parallel communication, it is more cost-effective, requires fewer connections, and is less prone to signal interference.The choice between parallel and serial communication depends on the specific requirements of the electronic component and the overall system design, balancing factors such as speed, cost, complexity, and reliability.

Memory IC Type refers to the specific type of integrated circuit (IC) used for storing data in electronic devices. Memory ICs are essential components in computers, smartphones, and other digital devices, as they provide temporary or permanent storage for data and instructions. Common types of memory ICs include dynamic random-access memory (DRAM), static random-access memory (SRAM), flash memory, and electrically erasable programmable read-only memory (EEPROM). Each type of memory IC has unique characteristics in terms of speed, capacity, power consumption, and data retention, making it suitable for different applications. Understanding the memory IC type is crucial for designing and selecting the appropriate memory solution for a specific electronic device or system.

Alternate Memory Width is a parameter in electronic components that refers to the ability of a memory device to operate with different data bus widths. This means that the memory device can support various configurations of data bus widths, allowing for flexibility in system design and compatibility with different applications. By offering alternate memory widths, the device can be used in a wider range of systems without requiring significant changes to the overall design. This parameter is important for optimizing performance and efficiency in electronic systems by providing options for data transfer and storage based on specific requirements.

Data Polling is a process used in electronic components to retrieve data at regular intervals from a sensor or device. It involves checking or querying the device for updated information, ensuring that the most current data is accessible for processing or analysis. This technique is commonly used in systems where continuous monitoring is necessary, allowing for timely responses based on the latest data collected. Data Polling can impact system performance, as it may introduce delays or consume resources depending on the polling frequency and the efficiency of the implemented protocol.

The toggle bit is a control mechanism in electronic components that allows a circuit to switch between two states, typically representing binary values of 0 and 1. It is commonly used in digital systems to change the status of a device or memory cell each time it is activated. The toggle bit maintains its state until it receives a new signal that alters its value, making it essential for operations such as counters and flip-flops. This functionality enables efficient data storage, retrieval, and manipulation in various electronic applications.

Sector size in electronic components refers to the minimum unit of data that can be read or written to the storage device, such as a hard drive or solid-state drive. It represents the smallest amount of data that can be accessed at a time within a storage device. The sector size is typically measured in bytes, with common sizes being 512 bytes or 4 kilobytes.Having a larger sector size can improve the efficiency of data storage and retrieval processes, as it reduces the overhead associated with accessing and managing smaller units of data. However, the choice of sector size can also impact the overall performance and compatibility of the storage device with different systems and applications. It is important to consider the sector size when configuring storage devices and optimizing data access speeds.

The "Ready/Busy" parameter in electronic components typically refers to a signal or status indicator that indicates whether a device is ready to accept new commands or data ("Ready") or is currently processing information and unavailable for new tasks ("Busy"). This parameter is commonly found in devices such as microcontrollers, memory modules, and storage devices.When the device is in the "Ready" state, it means that it is idle and can accept new instructions or data inputs. On the other hand, when the device is in the "Busy" state, it indicates that the device is currently engaged in a task and cannot accept new commands until it completes its current operation.Monitoring the "Ready/Busy" status is important for ensuring proper communication and coordination between different components in a system, especially in scenarios where multiple devices need to interact with each other. By checking the "Ready/Busy" status, a system can avoid conflicts and ensure that tasks are executed in a synchronized manner.

The "Boot Block" in electronic components refers to a specific section of memory that is typically used in flash memory devices. It is a small portion of memory that contains essential code and data required for the device to boot up or initialize properly. The Boot Block is usually located at the beginning of the memory space and is designed to be read-only to ensure its integrity and prevent accidental corruption.During the boot-up process, the microcontroller or processor accesses the Boot Block to execute the initial instructions needed to start the device. This section often contains bootloader code, configuration settings, and other critical information necessary for the device to function correctly. By isolating this essential data in a dedicated Boot Block, manufacturers can ensure the reliability and security of the boot process in electronic components.

Common Flash Interface is a standardized interface for accessing flash memory devices. It enables interoperability between different flash memory types and controllers, allowing for easier integration into various electronic systems. This parameter defines the electrical and protocol specifications needed for communication, facilitating faster data transfer and enhanced performance in applications such as embedded systems and consumer electronics.