

Harris IH5016MDE
Manufacturer No:
IH5016MDE
Tiny WHSLManufacturer:
Utmel No:
1050-IH5016MDE
Package:
16-CDIP (0.300, 7.62mm)
Description:
SPST
Quantity:
Unit Price: $9.005222
Ext Price: $9.01
Delivery:





Payment:











In Stock : 178
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$9.005222
$9.01
10
$8.495492
$84.95
100
$8.014615
$801.46
500
$7.560958
$3,780.48
1000
$7.132979
$7,132.98
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- TypeParameter
- Mounting Type
The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.
Through Hole - Package / Case
refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.
16-CDIP (0.300, 7.62mm) - Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO - Supplier Device Package
The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.
16-CDIP - Number of Terminals16
- RoHSNon-Compliant
- PackageBulk
- MfrHarris Corporation
- Channel-to-Channel Matching (ΔRon)-
- Product StatusActive
- Package Description,
- Package StyleIN-LINE
- Moisture Sensitivity LevelsNOT SPECIFIED
- Package Body MaterialCERAMIC, METAL-SEALED COFIRED
- On-state Resistance-Max (Ron)150 Ω
- Operating Temperature-Min-55 °C
- Reflow Temperature-Max (s)NOT SPECIFIED
- Operating Temperature-Max125 °C
- Rohs CodeNo
- Manufacturer Part NumberIH5016MDE
- Package ShapeRECTANGULAR
- ManufacturerRochester Electronics LLC
- Part Life Cycle CodeActive
- Ihs ManufacturerROCHESTER ELECTRONICS INC
- Risk Rank5.36
- Operating Temperature
The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.
-55°C ~ 125°C - Series
In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.
- - JESD-609 Code
The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.
e0 - Pbfree Code
The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.
No - Terminal Finish
Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.
TIN LEAD - Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
THROUGH-HOLE - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Number of Functions3
- Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
unknown - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
R-CDIP-T16 - Qualification Status
An indicator of formal certification of qualifications.
COMMERCIAL - Temperature Grade
Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.
MILITARY - Number of Channels1
- Number of Circuits3
- Analog IC - Other Type
Analog IC - Other Type is a parameter used to categorize electronic components that are integrated circuits (ICs) designed for analog signal processing but do not fall into more specific subcategories such as amplifiers, comparators, or voltage regulators. These ICs may include specialized analog functions such as analog-to-digital converters (ADCs), digital-to-analog converters (DACs), voltage references, or signal conditioning circuits. They are typically used in various applications where precise analog signal processing is required, such as in audio equipment, instrumentation, communication systems, and industrial control systems. Manufacturers provide detailed specifications for these components to help engineers select the most suitable IC for their specific design requirements.
SPST - -3db Bandwidth
The "-3dB bandwidth" of an electronic component refers to the frequency range over which the component's output signal power is reduced by 3 decibels (dB) compared to its maximum output power. This parameter is commonly used to describe the frequency response of components such as amplifiers, filters, and other signal processing devices. The -3dB point is significant because it represents the half-power point, where the output signal power is reduced to half of its maximum value. Understanding the -3dB bandwidth is important for designing and analyzing electronic circuits to ensure that signals are accurately processed within the desired frequency range.
- - On-State Resistance (Max)
The "On-State Resistance (Max)" parameter in electronic components refers to the maximum resistance exhibited by the component when it is in the fully conducting state. This resistance is typically measured when the component is carrying the maximum specified current. A lower on-state resistance indicates better conductivity and efficiency of the component when it is in the on-state. It is an important parameter to consider when selecting components for applications where low power dissipation and high efficiency are critical factors.
100Ohm - Multiplexer/Demultiplexer Circuit
A Multiplexer/Demultiplexer Circuit is an electronic component used in digital circuits to select one of several input signals and route it to a single output. A multiplexer, also known as a "mux," is used to combine multiple input signals into a single output, while a demultiplexer, also known as a "demux," is used to take a single input and route it to one of several possible outputs. These circuits are commonly used in data transmission, communication systems, and digital signal processing applications to efficiently manage and control the flow of data. Multiplexers and demultiplexers play a crucial role in optimizing the use of resources and improving the overall performance of electronic systems.
1:1 - Current - Leakage (IS(off)) (Max)
Current - Leakage (IS(off)) (Max) refers to the maximum amount of current that flows through a device when it is in its off state, meaning it is not conducting or not intended to be active. This parameter is crucial in determining the efficiency of electronic components, especially in battery-operated devices, as higher leakage currents can lead to increased power consumption and reduced battery life. It is typically measured in microamperes (µA) or milliamperes (mA) and helps engineers assess the suitability of a component for low-power applications.
500pA - Channel Capacitance (CS(off), CD(off))
Channel capacitance (CS(off), CD(off)) in electronic components refers to the capacitance associated with the channel of a field-effect transistor (FET) when it is turned off. CS(off) represents the capacitance between the source and the gate of the FET, while CD(off) represents the capacitance between the drain and the gate. These capacitances play a crucial role in determining the high-frequency performance and switching characteristics of the FET. Understanding and controlling these capacitances is essential for optimizing the performance of electronic circuits, especially in high-speed applications where minimizing parasitic capacitances is critical for achieving desired signal integrity and efficiency.
- - Switch Circuit
establishes connections between links, on demand and as available, in order to establish an end-to-end circuit between devices.
SPDT - Switch Time (Ton, Toff) (Max)
The parameter "Switch Time (Ton, Toff) (Max)" in electronic components refers to the maximum time it takes for a device to transition between its on and off states. Ton represents the turn-on time, which is the time taken for the device to switch from the off state to the on state, while Toff represents the turn-off time, which is the time taken for the device to switch from the on state to the off state. This parameter is crucial in determining the speed and efficiency of the device's switching operation. A shorter switch time generally indicates faster switching speeds and better performance of the electronic component.
500ns, 500ns - Charge Injection
A Charge injection in analog switches and multiplexers is a level change caused by stray capacitance associated with the NMOS and PMOS transistors that make up the analog switch.
- - Crosstalk
Crosstalk is a phenomenon in electronic components where signals unintentionally interact with each other, leading to interference or noise. It occurs when signals from one circuit or channel unintentionally couple into another nearby circuit or channel. This interference can result in signal degradation, data errors, or even complete failure of the electronic system. Crosstalk is a common issue in high-speed digital circuits, communication systems, and other electronic devices where multiple signals are present in close proximity. Design techniques such as proper signal routing, shielding, and signal isolation are often employed to minimize crosstalk and ensure reliable operation of electronic components.
-120dB @ 100Hz - Switch-on Time-Max
Switch-on Time-Max is a parameter in electronic components that refers to the maximum time it takes for a device to turn on completely after receiving a signal or command. This parameter is crucial in determining the responsiveness and efficiency of the component in various applications. A shorter switch-on time-max indicates a faster response time, which is important in applications where quick activation is required. Manufacturers provide this specification to help users understand the performance characteristics of the component and ensure it meets the requirements of their specific application.
500 ns - Switch-off Time-Max
Switch-off Time-Max is a parameter in electronic components that refers to the maximum time it takes for a device to turn off completely after a control signal is applied to switch it off. This parameter is crucial in determining the response time and efficiency of the component in various applications. A shorter switch-off time-max indicates a faster response and better performance of the component. It is important to consider this parameter when designing circuits or systems where precise timing and control are required.
500 ns - Voltage - Supply, Single (V+)
Voltage - Supply, Single (V+) refers to the positive voltage supply needed for an electronic component to operate. It indicates the range of voltage levels that can be applied to the component from a single power source. This parameter is crucial for determining compatibility with other components in a circuit and ensuring proper functionality. It typically defines the minimum and maximum voltage limits within which the device can safely and effectively operate.
30V - Voltage - Supply, Dual (V±)
The parameter "Voltage - Supply, Dual (V±)" refers to the range of dual supply voltages required for the operation of an electronic component. This specification indicates that the component can operate with both positive and negative voltage levels, typically represented as V+ for the positive voltage and V- for the negative voltage. It is commonly used in analog devices and operational amplifiers to facilitate signal processing that requires a reference point at ground level, allowing for both upwards and downwards signal variations. A typical example would be V+ = +15V and V- = -15V, indicating the component can operate effectively within that voltage range.
30V