Honeywell SC3D-5.6K

The resistance-change factor per degree Celsius of temperature change is called the temperature coefficient of resistance. This factor is represented by the Greek lower-case letter “alpha” (α). A positive coefficient for a material means that its resistance increases with an increase in temperature.

Resistance is a fundamental property of electronic components that measures their opposition to the flow of electric current. It is denoted by the symbol "R" and is measured in ohms (Ω). Resistance is caused by the collisions of electrons with atoms in a material, which generates heat and reduces the flow of current. Components with higher resistance will impede the flow of current more than those with lower resistance. Resistance plays a crucial role in determining the behavior and functionality of electronic circuits, such as limiting current flow, voltage division, and controlling power dissipation.

Construction in electronic components refers to the design and materials used in the manufacturing of the components. It encompasses the physical structure, arrangement, and integration of various parts like substrates, conductors, and insulators. The construction impacts the performance, reliability, and thermal properties of the component, influencing how it interacts with electrical signals and other components in a circuit. Different construction techniques can also affect the size, weight, and cost of the electronic component.

Military Standard in electronic components refers to a set of guidelines and specifications established by the military for the design, manufacturing, and testing of electronic devices used in military applications. These standards ensure that the components meet specific requirements for reliability, durability, performance, and environmental conditions. Components that meet military standards are often more rugged and capable of withstanding harsh operating conditions such as extreme temperatures, vibrations, and electromagnetic interference. Adhering to military standards helps to ensure the quality and consistency of electronic components used in critical military systems and applications.

"Termination style" in electronic components refers to the method used to connect the component to a circuit board or other electronic devices. It determines how the component's leads or terminals are designed for soldering or mounting onto the circuit board. Common termination styles include through-hole, surface mount, and wire lead terminations.Through-hole components have leads that are inserted through holes in the circuit board and soldered on the other side. Surface mount components have flat terminals that are soldered directly onto the surface of the circuit board. Wire lead terminations involve attaching wires to the component for connection.The choice of termination style depends on factors such as the type of component, the manufacturing process, and the space available on the circuit board. Different termination styles offer various advantages in terms of ease of assembly, reliability, and space efficiency in electronic designs.

the frequency with which an engineered system or component fails, expressed in failures per unit of time. It is usually denoted by the Greek letter λ (lambda) and is often used in reliability engineering.

The parameter "Product Length (mm)" in electronic components refers to the physical length of the component, typically measured in millimeters. This measurement is important for determining the size and dimensions of the component, which is crucial for fitting it into a circuit board or enclosure. It helps in ensuring proper alignment and spacing within the overall design of the electronic system. Manufacturers provide this specification to assist engineers and designers in selecting components that will fit and function correctly within their intended application.

Product Height (mm) in electronic components refers to the measurement of the component's vertical dimension. It indicates how tall the component is when installed in a circuit or system. This parameter is crucial for determining compatibility with enclosures, ensuring adequate space for components on printed circuit boards, and facilitating proper airflow and cooling in electronic designs.