Infineon Technologies BGS12SL6E6327XTSA1
Infineon Technologies BGS12SL6E6327XTSA1
BGS12SL6 Series  Pinout Diagram_1
BGS12SL6 Series  Pinout Diagram_2
BGS12SL6 Series  Pinout Diagram_3
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Infineon Technologies BGS12SL6E6327XTSA1

Manufacturer No:

BGS12SL6E6327XTSA1

Utmel No:

1211-BGS12SL6E6327XTSA1

Package:

6-XFDFN

Datasheet:

BGS12SL6 Series

ECAD Model:

Description:

GSM, LTE, W-CDMA RF Type SPDT -30°C~85°C 100MHz~6GHz Isolation:15dB Insertion Loss:1.5dB Reflective 50Ohm 2.4V~3.6V

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BGS12SL6E6327XTSA1 information

Specifications
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Product Details
Infineon Technologies BGS12SL6E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies BGS12SL6E6327XTSA1.
  • Type
    Parameter
  • Factory Lead Time
    17 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    6-XFDFN
  • Number of Pins
    6
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -30°C~85°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2013
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    6
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.4V~3.6V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    BOTTOM
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    BUTT
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.4mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    6GHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    NOT SPECIFIED
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    3V
  • Circuit

    The parameter "Circuit" in electronic components refers to the interconnected arrangement of various electronic elements such as resistors, capacitors, inductors, and active devices like transistors. It defines the path through which electric current flows and establishes the operational behavior of the components within that system. Circuits can be classified as analog or digital, depending on the type of signals they handle, and can vary in complexity from simple series or parallel configurations to intricate designs used in advanced applications.

    SPDT
  • Operating Supply Current

    Operating Supply Current, also known as supply current or quiescent current, is a crucial parameter in electronic components that indicates the amount of current required for the device to operate under normal conditions. It represents the current drawn by the component from the power supply while it is functioning. This parameter is important for determining the power consumption of the component and is typically specified in datasheets to help designers calculate the overall power requirements of their circuits. Understanding the operating supply current is essential for ensuring proper functionality and efficiency of electronic systems.

    150μA
  • Impedance

    In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

    50Ohm
  • Topology

    In the context of electronic components, "topology" refers to the arrangement or configuration of the components within a circuit or system. It defines how the components are connected to each other and how signals flow between them. The choice of topology can significantly impact the performance, efficiency, and functionality of the electronic system. Common topologies include series, parallel, star, mesh, and hybrid configurations, each with its own advantages and limitations. Designers carefully select the appropriate topology based on the specific requirements of the circuit to achieve the desired performance and functionality.

    Reflective
  • Frequency Range

    A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

    100MHz~6GHz
  • Insertion Loss

    the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

    1.5dB
  • Telecom IC Type

    Telecom IC Type refers to integrated circuits specifically designed for telecommunications applications. These components facilitate various functions such as signal processing, data modulation and demodulation, and communication protocol handling. They can be used in devices like mobile phones, modems, and network equipment, ensuring reliable data transmission and reception. Telecom ICs support different standards and technologies, making them essential for modern communication systems.

    TELECOM CIRCUIT
  • Isolation

    Isolation in electronic components refers to the ability of a component to prevent the flow of electrical current between two points that are at different potentials. It is crucial for ensuring safety and preventing electrical hazards in electronic circuits. Isolation can be achieved through various methods such as using insulating materials, physical barriers, or optical isolation techniques. Proper isolation helps to protect sensitive components and circuits from damage due to voltage spikes, noise, or short circuits. It is particularly important in high-voltage applications and when dealing with components that are connected to different power sources.

    15dB
  • Insertion Loss (dB)

    Insertion Loss (dB) is a parameter used to measure the amount of signal loss that occurs when a component is inserted into a transmission line or circuit. It is typically expressed in decibels (dB) and represents the difference in signal power before and after the insertion of the component. A higher insertion loss value indicates greater signal attenuation or reduction in signal strength. Insertion loss is an important consideration in electronic components such as filters, amplifiers, and connectors, as it can impact the overall performance and efficiency of a system. Minimizing insertion loss is often a key design goal to ensure optimal signal integrity and transmission quality.

    0.25 dB
  • RF Type

    The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

    GSM, LTE, W-CDMA
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    Single Line Control
  • Length
    1.1mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    0.32mm
  • Width
    0.7mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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Download datasheets and manufacturer documentation for Infineon Technologies BGS12SL6E6327XTSA1.

BGS12SL6E6327XTSA1 Overview

For optimal performance, this RF Switch makes use of the Tape & Reel (TR) package.In this RF Switch, there are a total of 6 terminations.The operating temperature should be kept at -30°C~85°C when the RF Switch is in operation.There are 6 pins that are used for the operation of the high power RF switch.A supply current of 150μAmps is required to operate this RF switch ic.GSM, LTE, W-CDMA RF Type from the RF switch ic.2.4V~3.6V voltage can be supplied by the RF Switch.

BGS12SL6E6327XTSA1 Features

Tape & Reel (TR) package
6 terminations
6 pins
GSM, LTE, W-CDMA RF Type

BGS12SL6E6327XTSA1 Applications

There are a lot of Infineon Technologies
BGS12SL6E6327XTSA1 RF Switches applications.


  • General-purpose RF switching
  • Dual-band applications
  • High speed filter selection
  • Digital transceiver front end switch
  • IF switching
  • Tuner modules
  • Antenna diversity switching
  • Cellular/PCS Base Stations
  • ISM
  • Wireless Local Loop
BGS12SL6E6327XTSA1 Relevant information

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