International Rectifier IRGBC20S
International Rectifier IRGBC20S
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International Rectifier IRGBC20S

Manufacturer No:

IRGBC20S

Utmel No:

1240-IRGBC20S

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-

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IRGBC20S datasheet pdf and Unclassified product details from International Rectifier stock available at Utmel

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IRGBC20S information

Specifications
International Rectifier IRGBC20S technical specifications, attributes, parameters and parts with similar specifications to International Rectifier IRGBC20S.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Terminals
    3
  • Transistor Element Material

    The "Transistor Element Material" parameter in electronic components refers to the material used to construct the transistor within the component. Transistors are semiconductor devices that amplify or switch electronic signals and are a fundamental building block in electronic circuits. The material used for the transistor element can significantly impact the performance and characteristics of the component. Common materials used for transistor elements include silicon, germanium, and gallium arsenide, each with its own unique properties and suitability for different applications. The choice of transistor element material is crucial in designing electronic components to meet specific performance requirements such as speed, power efficiency, and temperature tolerance.

    SILICON
  • Package Description
    FLANGE MOUNT, R-PSFM-T3
  • Package Style
    FLANGE MOUNT
  • Package Body Material
    PLASTIC/EPOXY
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Operating Temperature-Max
    150 °C
  • Rohs Code
    No
  • Manufacturer Part Number
    IRGBC20S
  • Package Shape
    RECTANGULAR
  • Manufacturer
    International Rectifier
  • Number of Elements
    1
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    INTERNATIONAL RECTIFIER CORP
  • Risk Rank
    5.67
  • Part Package Code
    TO-220AB
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e0
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin/Lead (Sn/Pb)
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    STANDARD SPEED
  • Subcategory
    Insulated Gate BIP Transistors
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    SINGLE
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    NOT SPECIFIED
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    3
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PSFM-T3
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    SINGLE
  • Case Connection

    Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.

    COLLECTOR
  • Transistor Application

    In the context of electronic components, the parameter "Transistor Application" refers to the specific purpose or function for which a transistor is designed and used. Transistors are semiconductor devices that can amplify or switch electronic signals and are commonly used in various electronic circuits. The application of a transistor can vary widely depending on its design and characteristics, such as whether it is intended for audio amplification, digital logic, power control, or radio frequency applications. Understanding the transistor application is important for selecting the right type of transistor for a particular circuit or system to ensure optimal performance and functionality.

    GENERAL PURPOSE
  • Polarity/Channel Type

    In electronic components, the parameter "Polarity/Channel Type" refers to the characteristic that determines the direction of current flow or the type of signal that can be accommodated by the component. For components like diodes and transistors, polarity indicates the direction in which current can flow through the component, such as forward bias or reverse bias for diodes. For components like MOSFETs or JFETs, the channel type refers to whether the component is an N-channel or P-channel device, which determines the type of charge carriers that carry current through the component. Understanding the polarity or channel type of a component is crucial for proper circuit design and ensuring that the component is connected correctly to achieve the desired functionality.

    N-CHANNEL
  • JEDEC-95 Code

    JEDEC-95 Code is a standardized identification system used by the Joint Electron Device Engineering Council to categorize and describe semiconductor devices. This code provides a unique alphanumeric identifier for various memory components, ensuring consistency in documentation and communication across the electronics industry. The format includes information about the type, capacity, and technology of the device, facilitating easier specification and understanding for manufacturers and engineers.

    TO-220AB
  • Power Dissipation-Max (Abs)

    Power Dissipation-Max (Abs) refers to the maximum amount of power that an electronic component can dissipate without undergoing thermal damage or degradation. This value is crucial for ensuring reliable operation, as exceeding it can result in overheating and failure. It is typically specified in watts and serves as a critical parameter for designers to determine proper heat management strategies in circuits. Properly managing the power dissipation is essential for the longevity and performance of electronic devices.

    60 W
  • Collector Current-Max (IC)

    The parameter "Collector Current-Max (IC)" in electronic components refers to the maximum amount of current that can safely flow through the collector terminal of a transistor without causing damage to the component. It is an important specification that indicates the upper limit of current that the transistor can handle under normal operating conditions. Exceeding this maximum current rating can lead to overheating and potentially result in the failure of the transistor. Designers must ensure that the collector current does not exceed this specified limit to prevent damage to the component and ensure reliable operation of the circuit.

    19 A
  • Collector-Emitter Voltage-Max

    Collector-Emitter Voltage-Max, often abbreviated as Vce(max), is a key specification in bipolar junction transistors (BJTs). It represents the maximum voltage that can be applied between the collector and emitter terminals without risking damage to the transistor. Exceeding this voltage can lead to breakdown conditions, resulting in device failure or reliability issues. This parameter is crucial for ensuring safe operation within the specified design limits of electronic circuits using transistors.

    600 V
  • Gate-Emitter Voltage-Max

    The "Gate-Emitter Voltage-Max" parameter is a specification commonly found in field-effect transistors (FETs) and insulated gate bipolar transistors (IGBTs). It refers to the maximum allowable voltage that can be applied between the gate and emitter terminals of the device without causing damage. Exceeding this voltage limit can lead to breakdown of the gate oxide layer or other critical components, resulting in potential device failure.This parameter is crucial for ensuring the reliable operation of the transistor and preventing overvoltage conditions that could compromise its performance or longevity. Designers must carefully consider the Gate-Emitter Voltage-Max specification when selecting and using these components in electronic circuits to avoid exceeding the specified limits and causing damage to the device. It is typically provided in the datasheet of the component and serves as a key parameter for proper device operation within safe operating conditions.

    20 V
  • VCEsat-Max

    VCEsat-Max refers to the maximum collector-emitter saturation voltage of a bipolar junction transistor (BJT) or an insulated gate bipolar transistor (IGBT). It is a crucial parameter that indicates the minimum voltage drop across the collector-emitter junction when the transistor is in saturation mode. This parameter is important for determining the efficiency and performance of the transistor in switching applications. A lower VCEsat-Max value indicates better performance and reduced power losses in the transistor during operation. Designers often consider this parameter when selecting transistors for applications where minimizing power dissipation is critical.

    2.4 V
  • Gate-Emitter Thr Voltage-Max

    Gate-Emitter Threshold Voltage-Max refers to the maximum voltage required between the gate and emitter terminals of a transistor to begin conducting. It is a critical parameter in defining the operating characteristics of transistors, particularly in field-effect transistors and bipolar junction transistors. This threshold voltage indicates the point at which the transistor will start to turn on and allows current to flow from the collector to the emitter. Understanding this parameter is essential for ensuring proper biasing and operation in electronic circuits.

    5.5 V
  • Power Dissipation Ambient-Max

    Power Dissipation Ambient-Max is a parameter that specifies the maximum amount of power that an electronic component can safely dissipate while operating within a specified ambient temperature range. This parameter is crucial for determining the thermal management requirements of the component to prevent overheating and ensure reliable operation. It is typically provided by the component manufacturer and helps designers select appropriate cooling solutions and operating conditions to maintain the component within its safe temperature limits. Exceeding the specified maximum power dissipation in a high-temperature environment can lead to performance degradation, premature failure, or even permanent damage to the component.

    60 W
  • Fall Time-Max (tf)

    The parameter "Fall Time-Max (tf)" in electronic components refers to the maximum time it takes for a signal to transition from a high level to a low level. It is a crucial specification in digital circuits as it determines the speed at which the output signal can change states. Fall time is influenced by various factors such as the internal capacitance of the component, the load connected to the output, and the driving capability of the circuit. A shorter fall time indicates faster signal transitions and can be important for ensuring proper operation and timing in electronic systems.

    1600 ns
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