Laird Technologies EMI 0097055017
Laird Technologies EMI 0097055017
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Laird Technologies EMI 0097055017

Manufacturer No:

0097055017

Utmel No:

1412-0097055017

Package:

-

ECAD Model:

Description:

0097055017 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Laird Technologies EMI stock available at Utmel

Quantity:

Unit Price: $15.305653

Ext Price: $15.31

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In Stock : 292

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $15.305653

    $15.31

  • 10

    $14.439295

    $144.39

  • 100

    $13.621977

    $1,362.20

  • 500

    $12.850921

    $6,425.46

  • 1000

    $12.123511

    $12,123.51

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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0097055017 information

Specifications
Documents & Media
Product Details
Laird Technologies EMI 0097055017 technical specifications, attributes, parameters and parts with similar specifications to Laird Technologies EMI 0097055017.
  • Type
    Parameter
  • Factory Lead Time
    4 Weeks
  • Material

    In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

    Beryllium Copper
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    121°C
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    Twist
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Type
    Fingerstock
  • Plating

    In the context of electronic components, "Plating" refers to a process of depositing a thin layer of metal onto a substrate material. This plating is often used to enhance the component's performance, durability, and conductivity. The plating material can vary depending on the specific requirements of the component, with common choices including gold, silver, tin, and nickel. Plating can also be used for corrosion resistance, solderability, and to improve the overall appearance of the component. Overall, plating plays a crucial role in ensuring the reliability and functionality of electronic components in various applications.

    Tin
  • Attachment Method

    The attachment method in electronic components refers to the technique used to connect a component to a circuit board or assembly. This can include methods such as soldering, bonding, or using connectors. The choice of attachment method can affect the reliability, performance, and manufacturability of the electronic device. Different methods may be suited for specific applications based on factors like mechanical stress, thermal conductivity, and ease of assembly.

    Adhesive
  • Height
    0.030 0.76mm
  • Length
    24.000 609.60mm
  • Width
    0.230 5.84mm
  • Plating Thickness

    Plating thickness in electronic components refers to the measurement of the thickness of the metal plating applied to various surfaces of the component. This plating is typically done to enhance the component's conductivity, corrosion resistance, and solderability. The plating thickness is an important parameter as it directly affects the performance and reliability of the electronic component. Manufacturers specify the required plating thickness to ensure that the component meets the desired electrical and mechanical properties for its intended application. Testing and quality control measures are often employed to verify that the plating thickness meets the specified requirements.

    299.21μin 7.60μm
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    76.2μm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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Download datasheets and manufacturer documentation for Laird Technologies EMI 0097055017.

Product Description: Laird Technologies EMI Fingerstock (Part Number: 0097055017)

1. Description

The Laird Technologies EMI Fingerstock (Part Number: 0097055017) is a high-performance, RoHS-compliant component designed to provide effective electromagnetic interference (EMI) shielding in various applications. Made from beryllium copper, this fingerstock offers excellent electrical conductivity and durability. Its unique twist series design ensures optimal performance in a wide range of environments.

2. Features

  • Material: Beryllium Copper - Known for its high electrical conductivity and strength.
  • Thickness: 76.2μm - Provides a robust barrier against EMI.
  • Width: 0.2305 inches (5.84mm) - Compact size for easy integration into devices.
  • Length: 24.000 inches (609.60mm) - Long length for extensive coverage.
  • Height: 0.030 inches (0.76mm) - Thin profile for minimal space usage.
  • Plating: Tin - Ensures reliable electrical connections with a thickness of 7.60μm.
  • Attachment Method: Adhesive - Easy installation with a strong adhesive backing.
  • Operating Temperature: Up to 121°C - Suitable for high-temperature applications.
  • Moisture Sensitivity Level (MSL): 1 (Unlimited) - No special handling required during manufacturing processes.

3. Applications

The Laird Technologies EMI Fingerstock is primarily used in applications where EMI shielding is crucial:

  1. RF/IF Components: To shield radio frequency and intermediate frequency components from electromagnetic interference.
  2. RFID Systems: In radio frequency identification systems to prevent signal degradation due to EMI.
  3. Electronics Enclosures: For enclosures of electronic devices such as antennas, transceivers, and other sensitive components.
  4. Medical Devices: In medical devices where EMI could interfere with critical signals or cause malfunctions.

4. Alternative Parts

If the Laird Technologies EMI Fingerstock is not available or if you need alternative solutions, consider the following options:

  1. Laird Technologies EMI Fingerstock (Part Number: 0097055027) - Similar specifications but with a different part number.
  2. Other Beryllium Copper Fingerstocks from various manufacturers - Such as those from Würth Elektronik or TE Connectivity.

5. Embedded Modules

The Laird Technologies EMI Fingerstock is commonly used in various embedded modules:

  1. RF Transceivers: Modules designed for wireless communication such as Wi-Fi or Bluetooth.
  2. RFID Readers/Writer Modules: Modules used in RFID systems for identification purposes.
  3. Antenna Modules: Modules containing antennas that require EMI shielding for optimal performance.

By choosing the Laird Technologies EMI Fingerstock (Part Number: 0097055017), you can ensure reliable EMI shielding in your electronic devices, enhancing their performance and longevity in challenging environments.