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In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Adhesive in electronic components refers to materials used to bond various parts together within an electronic assembly. These adhesives can provide structural integrity and durability to components such as circuit boards, connectors, and housing. They may also offer protective properties against environmental factors, such as moisture and heat, and can enhance electrical insulation. The selection of a suitable adhesive is critical to the performance and reliability of the final electronic product.

Thickness - Overall is a parameter that refers to the total thickness of an electronic component, typically measured from the bottom of the component to the highest point on top. This measurement is important for determining the overall size and profile of the component, which can impact its compatibility with other components or its fit within a specific device or circuit board. Manufacturers provide this specification to help designers and engineers ensure proper spacing and clearance when integrating the component into their electronic systems. Understanding the overall thickness of a component is crucial for proper installation and functionality within an electronic device.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.