Ledil CA17283_ELLA-30-WW

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

the angle at which a display can be viewed with acceptable visual performance.

a group of products which fulfill a similar need for a market segment or market as a whole.

Optical Pattern in electronic components refers to a specific design or arrangement of optical elements within a device. These elements can include lenses, mirrors, filters, and other components that manipulate light in various ways. The optical pattern is crucial for determining how light is transmitted, reflected, or filtered within the component, ultimately affecting its performance and functionality. Engineers and designers carefully consider the optical pattern to achieve desired outcomes such as focusing light, reducing glare, or enhancing image quality in devices like cameras, sensors, and displays.

In electronic components, the parameter "Style/Size" refers to the physical dimensions and form factor of the component. This parameter describes the overall size, shape, and configuration of the component, which is important for determining how it will fit into a circuit or system. Different components come in various styles and sizes, such as through-hole, surface mount, or package types like DIP, SOIC, or SMD. Understanding the Style/Size parameter is crucial for selecting the right component that will properly fit and function within the intended application.

a particular group of related products.