Micron Technology Inc. MT16HTF25664AZ-800H1
Micron Technology Inc. MT16HTF25664AZ-800H1
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Micron Technology Inc. MT16HTF25664AZ-800H1

Manufacturer No:

MT16HTF25664AZ-800H1

Utmel No:

1616-MT16HTF25664AZ-800H1

Package:

240-UDIMM

Datasheet:

MT16HTFzzz64AZ

ECAD Model:

Description:

MODULE DDR2 SDRAM 2GB 240UDIMM

Quantity:

Unit Price: $13.344557

Ext Price: $13.34

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

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In Stock : 24

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $13.344557

    $13.34

  • 10

    $12.589205

    $125.89

  • 100

    $11.876608

    $1,187.66

  • 500

    $11.204347

    $5,602.17

  • 1000

    $10.570139

    $10,570.14

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MT16HTF25664AZ-800H1 information

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Micron Technology Inc. MT16HTF25664AZ-800H1 technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT16HTF25664AZ-800H1.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Socket
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    240-UDIMM
  • Number of Pins
    240
  • Memory Types
    DDR2 SDRAM
  • Number of Elements
    16
  • Published
    2011
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    240
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    70°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    0°C
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.8V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.8V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Max Supply Voltage

    In general, the absolute maximum common-mode voltage is VEE-0.3V and VCC+0.3V, but for products without a protection element at the VCC side, voltages up to the absolute maximum rated supply voltage (i.e. VEE+36V) can be supplied, regardless of supply voltage.

    1.9V
  • Min Supply Voltage

    The minimum supply voltage (V min ) is explored for sequential logic circuits by statistically simulating the impact of within-die process variations and gate-dielectric soft breakdown on data retention and hold time.

    1.7V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    2GB
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    800MT/s
  • Clock Frequency

    Clock frequency, also known as clock speed, refers to the rate at which a processor or electronic component can execute instructions. It is measured in hertz (Hz) and represents the number of cycles per second that the component can perform. A higher clock frequency typically indicates a faster processing speed and better performance. However, it is important to note that other factors such as architecture, efficiency, and workload also play a significant role in determining the overall performance of a component. In summary, clock frequency is a crucial parameter that influences the speed and efficiency of electronic components in processing data and executing tasks.

    400MHz
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    64b
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    256MX64
  • Output Characteristics

    Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.

    3-STATE
  • Memory Width

    Memory width refers to the number of bits that can be read or written to memory at one time. It is an important specification in electronic components, particularly in memory devices like RAM and cache. A wider memory width allows for greater data throughput, enabling faster performance as more data can be processed simultaneously. Memory width can vary among different types of memory and can impact both the complexity and efficiency of data handling within electronic systems.

    64
  • Standby Current-Max

    Standby Current-Max refers to the maximum amount of current that an electronic component or device consumes while in a low-power standby mode. This parameter is critical for power management, especially in battery-operated devices, as it indicates how efficiently the device can conserve energy when not actively in use. A lower Standby Current-Max value is typically desirable, as it contributes to longer battery life and reduced energy consumption. Manufacturers specify this value to help engineers select components that meet specific power efficiency requirements in their designs.

    0.112A
  • Memory Density

    Memory density in electronic components refers to the amount of data that can be stored in a given physical space or memory module. It is typically measured in bits or bytes per unit area, such as bits per square inch. Higher memory density means that more data can be stored in a smaller space, which is important for devices with limited physical size or power constraints. Memory density is a key factor in determining the capacity and performance of memory devices, such as RAM, ROM, and flash memory, and is a critical consideration in the design and manufacturing of electronic products.

    17179869184 bit
  • Max Frequency

    Max Frequency refers to the highest frequency at which an electronic component can operate effectively without degradation of performance. It is a critical parameter for devices such as transistors, capacitors, and oscillators, indicating their limitations in speed and response time. Exceeding the max frequency can lead to issues like signal distortion, heat generation, and potential failure of the component. Understanding this parameter is essential for designing circuits to ensure reliable and efficient operation.

    800MHz
  • I/O Type

    "I/O Type" in electronic components refers to the type of input/output interface that the component uses to communicate with other devices or systems. This parameter specifies whether the component uses analog or digital signals for input and output operations. Analog signals are continuous and can have an infinite number of values, while digital signals are discrete and have only two possible values (0 or 1).Understanding the I/O Type of an electronic component is crucial for ensuring compatibility and proper communication with other components in a circuit or system. It helps determine the type of signals that the component can send and receive, as well as the protocols and standards that need to be followed for successful data exchange.In summary, the I/O Type parameter of electronic components defines the nature of the signals used for input and output operations, whether they are analog or digital, and plays a key role in establishing seamless communication within electronic systems.

    COMMON
  • Refresh Cycles

    Refresh cycles refer to the process of refreshing data stored in electronic components, such as dynamic random-access memory (DRAM). DRAM cells store data in the form of electrical charges, which can leak over time due to the nature of the technology. To prevent data loss or corruption, DRAM requires periodic refreshing of the stored information. The refresh cycle involves reading and then immediately rewriting the data back to the same location, ensuring that the charge is restored to its original state. The frequency of refresh cycles is typically specified by the manufacturer and is an important parameter to consider when designing systems that rely on DRAM for data storage.

    8192
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for Micron Technology Inc. MT16HTF25664AZ-800H1.

Product Description: MT16HTF25664AZ-800H1 Memory Module

1. Description

The MT16HTF25664AZ-800H1 is a 2GB DDR2 SDRAM memory module designed by Micron Technology Inc. This module is part of the commercial-grade memory modules, suitable for a wide range of applications requiring high-speed data transfer and reliable performance. Published in 2011, this module has been a reliable choice for many systems over the years.

2. Features

  • Speed: The MT16HTF25664AZ-800H1 operates at a speed of 800MT/s, ensuring fast data transfer rates.
  • Voltage: It operates on a supply voltage of 1.8V, making it compatible with various system configurations.
  • Standby Current: The maximum standby current is 0.112A, minimizing power consumption when not in use.
  • RoHS Compliance: This module is ROHS3 compliant, adhering to environmental regulations for lead-free components.
  • Refresh Cycles: It supports up to 8192 refresh cycles, ensuring data integrity over time.
  • Package/Case: The module is packaged in a 240-pin UDIMM (Unbuffered Dual In-Line Memory Module) format.
  • Output Characteristics: It features 3-state output characteristics for easy integration into various systems.
  • Organization: The memory organization is 256M x 64 bits, providing ample storage capacity.

3. Applications

Primary Applications: - Server Systems: Ideal for server environments where high-speed memory is crucial for efficient data processing and storage. - Workstations: Suitable for workstations requiring robust memory solutions to handle demanding tasks such as video editing or software development. - Embedded Systems: Can be used in embedded systems where reliability and speed are paramount.

Secondary Applications: - Desktop Computers: Can be used in desktop computers to enhance performance by providing additional memory capacity. - Laptops: May be used in laptops where upgrading memory is necessary to improve overall system performance.

4. Alternative Parts

If the MT16HTF25664AZ-800H1 is not available or has been discontinued, alternative parts could include: - Other Micron Technology DDR2 SDRAM modules with similar specifications (e.g., MT16HTF25664AZ-667H1). - Modules from other manufacturers that offer similar performance characteristics (e.g., Kingston KVR2E4D4/4G).

5. Embedded Modules

The MT16HTF25664AZ-800H1 memory module is used in various embedded systems due to its reliability and high-speed performance. Some examples include: - Industrial control systems requiring fast data processing capabilities. - Medical devices needing robust memory solutions for storing patient data efficiently. - Automotive systems where reliability under various environmental conditions is essential.

In summary, the MT16HTF25664AZ-800H1 memory module offers a reliable and high-performance solution for various applications requiring DDR2 SDRAM technology. Although it has been obsoleted, its features make it still relevant for many legacy systems or those requiring compatibility with older hardware configurations.

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