Micron Technology Inc. MT16HTF25664AZ-800M1
Micron Technology Inc. MT16HTF25664AZ-800M1
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Micron Technology Inc. MT16HTF25664AZ-800M1

Manufacturer No:

MT16HTF25664AZ-800M1

Utmel No:

1616-MT16HTF25664AZ-800M1

Package:

240-UDIMM

Datasheet:

MT16HTFyyy64AZ

ECAD Model:

Description:

MODULE DDR2 SDRAM 2GB 240UDIMM

Quantity:

Unit Price: $18.613574

Ext Price: $18.61

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

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In Stock : 56

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $18.613574

    $18.61

  • 10

    $17.559975

    $175.60

  • 100

    $16.566015

    $1,656.60

  • 500

    $15.628316

    $7,814.16

  • 1000

    $14.743694

    $14,743.69

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
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MT16HTF25664AZ-800M1 information

Specifications
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Product Details
Product Comparison
Micron Technology Inc. MT16HTF25664AZ-800M1 technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT16HTF25664AZ-800M1.
  • Type
    Parameter
  • Factory Lead Time
    12 Weeks
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    240-UDIMM
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Pins
    240
  • Memory Types
    DDR2 SDRAM
  • Published
    2014
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Number of Terminations
    240
  • ECCN Code

    An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

    EAR99
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    70°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    0°C
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    AUTO/SELF REFRESH; WD-MAX
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.32.00.36
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    NO LEAD
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    1.8V
  • Terminal Pitch

    The center distance from one pole to the next.

    1mm
  • Operating Supply Voltage

    The voltage level by which an electrical system is designated and to which certain operating characteristics of the system are related.

    1.8V
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    1.9V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    1.7V
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    2GB
  • Number of Ports

    A port is identified for each transport protocol and address combination by a 16-bit unsigned number,.

    1
  • Speed

    In electronic components, "Speed" typically refers to the rate at which data can be processed or transferred within the component. It is a measure of how quickly the component can perform its functions, such as executing instructions or transmitting signals. Speed is often specified in terms of frequency, such as clock speed in processors or data transfer rate in memory modules. Higher speed components can perform tasks more quickly, leading to improved overall performance in electronic devices. It is an important parameter to consider when designing or selecting electronic components for specific applications.

    800MT/s
  • Operating Mode

    A phase of operation during the operation and maintenance stages of the life cycle of a facility.

    SYNCHRONOUS
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    64b
  • Organization

    In the context of electronic components, the parameter "Organization" typically refers to the arrangement or structure of the internal components within a device or system. It can describe how various elements such as transistors, resistors, capacitors, and other components are physically arranged and interconnected on a circuit board or within a semiconductor chip.The organization of electronic components plays a crucial role in determining the functionality, performance, and efficiency of a device. It can impact factors such as signal propagation, power consumption, thermal management, and overall system complexity. Engineers carefully design the organization of components to optimize the operation of electronic devices and ensure reliable performance.Different types of electronic components may have specific organizational requirements based on the intended application and design considerations. For example, integrated circuits may have a highly compact and intricate organization to maximize functionality within a small footprint, while larger electronic systems may have a more modular and distributed organization to facilitate maintenance and scalability.

    256MX64
  • Memory Width

    Memory width refers to the number of bits that can be read or written to memory at one time. It is an important specification in electronic components, particularly in memory devices like RAM and cache. A wider memory width allows for greater data throughput, enabling faster performance as more data can be processed simultaneously. Memory width can vary among different types of memory and can impact both the complexity and efficiency of data handling within electronic systems.

    64
  • Memory Density

    Memory density in electronic components refers to the amount of data that can be stored in a given physical space or memory module. It is typically measured in bits or bytes per unit area, such as bits per square inch. Higher memory density means that more data can be stored in a smaller space, which is important for devices with limited physical size or power constraints. Memory density is a key factor in determining the capacity and performance of memory devices, such as RAM, ROM, and flash memory, and is a critical consideration in the design and manufacturing of electronic products.

    17179869184 bit
  • Max Frequency

    Max Frequency refers to the highest frequency at which an electronic component can operate effectively without degradation of performance. It is a critical parameter for devices such as transistors, capacitors, and oscillators, indicating their limitations in speed and response time. Exceeding the max frequency can lead to issues like signal distortion, heat generation, and potential failure of the component. Understanding this parameter is essential for designing circuits to ensure reliable and efficient operation.

    400MHz
  • Access Mode

    Distinct operation recognized by the protection mechanisms as a possible operation on an object.

    DUAL BANK PAGE BURST
  • Length
    133.35mm
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    30.5mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Micron Technology Inc. MT16HTF25664AZ-800M1.

Product Description

Description

The MT16HTF25664AZ-800M1 is a 2GB DDR2 SDRAM memory module designed by Micron Technology Inc. This module is part of the Memory - Modules category and is specifically optimized for high-speed data transfer applications. With its robust design and reliable performance, it has been a popular choice in various industries since its introduction in 2014.

Features

  • Operating Supply Voltage: 1.8V, with a maximum supply voltage of 1.9V and a minimum supply voltage of 1.7V.
  • Organization: 256M x 64 bits, providing a total memory density of 17,179,869,184 bits.
  • Package/Case: 240-pin UDIMM (Unbuffered Dual In-Line Memory Module).
  • Speed: 800MT/s (Megatransfers per second), ensuring fast data transfer rates.
  • Access Mode: Dual Bank Page Burst, allowing efficient access to memory locations.
  • Additional Features: Auto/SELF Refresh and WD-MAX (Write Data Max) for enhanced reliability and performance.
  • Data Bus Width: 64 bits, supporting high-bandwidth data transfer.
  • Temperature Grade: Commercial, with an operating temperature range from 0°C to 70°C.
  • Moisture Sensitivity Level (MSL): 3 (168 Hours), indicating moderate sensitivity to moisture.

Applications

  1. Primary Applications:
  2. Servers and data centers requiring high-speed memory solutions.
  3. Workstations and desktop computers needing reliable and fast memory modules.

  4. Secondary Applications:

  5. Embedded systems requiring high-performance memory.
  6. Industrial control systems where fast data access is crucial.

Alternative Parts

Due to its obsolescence, alternative parts may be necessary for new designs or upgrades. Some alternatives could include newer versions of DDR2 SDRAM modules from Micron Technology Inc., such as the MT16HTF25664AZ-667M1 or other compatible modules from different manufacturers.

Embedded Modules

The MT16HTF25664AZ-800M1 is commonly used in various embedded systems including:

  • Server boards
  • Workstation motherboards
  • Industrial control systems
  • High-performance computing systems

This module's high-speed capabilities make it an ideal choice for applications requiring rapid data access and processing.

Conclusion

The MT16HTF25664AZ-800M1 remains a reliable option for applications requiring high-speed DDR2 SDRAM memory despite its obsolescence status. Its robust design and reliable performance make it suitable for a wide range of industrial and commercial applications where fast data transfer rates are essential. However, users should consider alternative parts due to its obsolete status to ensure compatibility with newer systems or components.

The three parts on the right have similar specifications to Micron Technology Inc. & MT16HTF25664AZ-800M1.
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