Microsemi Corporation SMBJ20CE3/TR13

Lifecycle Status refers to the current stage of an electronic component in its product life cycle, indicating whether it is active, obsolete, or transitioning between these states. An active status means the component is in production and available for purchase. An obsolete status indicates that the component is no longer being manufactured or supported, and manufacturers typically provide a limited time frame for support. Understanding the lifecycle status is crucial for design engineers to ensure continuity and reliability in their projects.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The parameter "Diode Element Material" refers to the specific semiconductor material used in the construction of a diode. This material determines the electrical characteristics and performance of the diode, including its forward voltage drop, reverse breakdown voltage, and switching speed. Common diode element materials include silicon, germanium, and gallium arsenide, each offering different advantages for various applications. The choice of material impacts the diode's efficiency, thermal stability, and overall suitability for specific electronic circuits.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

Occurring at or forming the end of a series, succession, or the like; closing; concluding.

Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

a count of all of the component leads (or pins)

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

During fault, the only circuit breaker closest to the fault point should be tripped. The operating time of relay associated with protection of line should be as minimum as possible in order to prevent unnecessary tripping of circuit breakers associated with other healthy parts of power system.

Voltage - Breakdown (Min) is a parameter used to specify the minimum voltage level at which an electronic component, such as a diode or capacitor, will break down and allow current to flow through it uncontrollably. This breakdown voltage is a critical characteristic that determines the maximum voltage the component can withstand before failing. It is important to ensure that the applied voltage does not exceed this minimum breakdown voltage to prevent damage to the component and maintain proper functionality. Manufacturers provide this specification to help engineers and designers select components that are suitable for their intended applications and operating conditions.

Power - Peak Pulse refers to the maximum transient power level that an electronic component, such as a diode or a transzorber, can safely dissipate during a short-duration pulse. This parameter is critical in determining the component's ability to withstand voltage spikes or surges without failure. It is typically expressed in watts and is measured over a specific duration, usually in microseconds or nanoseconds, to reflect the component's performance under peak conditions. Understanding this parameter helps designers select appropriate components for applications where transient conditions are expected.

Max Reverse Leakage Current refers to the maximum amount of current that can flow through a semiconductor device, such as a diode or transistor, when it is reverse biased. This current is an important parameter as it indicates the level of unintended current that can flow when the device is not conducting in the forward direction. High values of reverse leakage current can lead to power loss, reduced efficiency, and may affect the performance and reliability of electronic circuits. It is particularly critical in applications where precise current control and low power consumption are necessary.

Clamping voltage is a term used in electronic components, particularly in devices like diodes and transient voltage suppressors. It refers to the maximum voltage level at which the component can effectively limit or clamp the voltage across its terminals. When the voltage across the component exceeds the clamping voltage, the component conducts and effectively limits the voltage to that level, protecting the circuit from overvoltage conditions. Clamping voltage is an important parameter to consider when selecting components for applications where voltage spikes or surges may occur, as it determines the level at which the component will start to protect the circuit.

The peak pulse power rating of a TVS diode is defined as the instantaneous power dissipated by a device for a given pulse condition, and is a measure of the power that is dissipated in the TVS junction during a given transient event.

Peak Pulse Power is a parameter used to specify the maximum amount of power that an electronic component can handle during a transient event, such as a surge or spike in voltage or current. It indicates the maximum power dissipation capability of the component for a short duration. This parameter is important for protecting electronic circuits from damage caused by sudden high-energy events. Peak Pulse Power is typically expressed in watts and is crucial for selecting components that can withstand transient overloads without failing. It helps ensure the reliability and longevity of electronic systems in various applications.

In electronic components, the parameter "Direction" refers to the orientation or alignment in which the component is designed to operate effectively. This parameter is particularly important for components such as diodes, transistors, and capacitors, which have specific polarity or orientation requirements for proper functionality. For example, diodes allow current flow in one direction only, so their direction parameter indicates the correct orientation for current flow. Similarly, polarized capacitors have a positive and negative terminal, requiring proper alignment for correct operation. Understanding and adhering to the direction parameter is crucial for ensuring the reliable and efficient performance of electronic components in a circuit.

Test Current refers to a specified amount of electrical current applied to an electronic component during testing to evaluate its performance and characteristics. This current is typically defined by manufacturers to ensure that the component operates within its designed parameters. By measuring how the component reacts to this test current, engineers can determine its reliability, efficiency, and suitability for specific applications.

Bidirectional channels in electronic components refer to pathways or connections that allow signal transmission in both directions. This means that data can flow from one device to another and back again, enabling two-way communication. Such channels are essential in applications like data buses, communication interfaces, and certain types of network protocols, facilitating efficient and dynamic interactions between components.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.