Mini-Circuits TCD-20-4-75X+

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

Power - Max is a parameter that specifies the maximum amount of power that an electronic component can handle without being damaged. It is typically measured in watts and indicates the upper limit of power that can be safely supplied to the component. Exceeding the maximum power rating can lead to overheating, malfunction, or permanent damage to the component. It is important to consider the power-max rating when designing circuits or systems to ensure proper operation and longevity of the electronic components.

a group of products which fulfill a similar need for a market segment or market as a whole.

the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

Isolation in electronic components refers to the ability of a component to prevent the flow of electrical current between two points that are at different potentials. It is crucial for ensuring safety and preventing electrical hazards in electronic circuits. Isolation can be achieved through various methods such as using insulating materials, physical barriers, or optical isolation techniques. Proper isolation helps to protect sensitive components and circuits from damage due to voltage spikes, noise, or short circuits. It is particularly important in high-voltage applications and when dealing with components that are connected to different power sources.

In telecommunications, return loss is a measure in relative terms of the power of the signal reflected by a discontinuity in a transmission line or optical fiber.

The parameter "Coupler Type" in electronic components refers to the method by which signals are transferred between two circuits or systems. It defines the physical and functional characteristics of the coupling mechanism, which can be electrical, optical, or mechanical. Common examples include capacitive, inductive, or transformer couplers in electrical applications and fiber optic couplers in optical applications. The choice of coupler type affects factors such as signal integrity, impedance matching, and cross-talk.

Coupling Factor (CF) measures the coupling between classes excluding coupling due to inheritance. It is the ratio between the number of actually coupled pairs of classes in a scope (e.g., package) and the possible number of coupled pairs of classes. CF is primarily applicable to object-oriented systems.

a particular group of related products.