NXP USA Inc. BGA2031/1,115
NXP USA Inc. BGA2031/1,115
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NXP USA Inc. BGA2031/1,115

Manufacturer No:

BGA2031/1,115

Manufacturer:

NXP USA Inc.

Utmel No:

1786-BGA2031/1,115

Package:

6-TSSOP, SC-88, SOT-363

Datasheet:

BGA2031

ECAD Model:

Description:

23dB CDMA, PCS WIDE BAND LOW POWER Tape & Reel (TR) 1.8GHz 3V~3.3V 1.4 Surface Mount

Quantity:

Unit Price: $0.475324

Ext Price: $0.48

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 7

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $0.475324

    $0.48

  • 10

    $0.448419

    $4.48

  • 100

    $0.423037

    $42.30

  • 500

    $0.399091

    $199.55

  • 1000

    $0.376501

    $376.50

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
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BGA2031/1,115 information

Specifications
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Product Details
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NXP USA Inc. BGA2031/1,115 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. BGA2031/1,115.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    6-TSSOP, SC-88, SOT-363
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2001
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Obsolete
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    6
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin (Sn)
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.33.00.01
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    3V~3.3V
  • Construction

    Construction in electronic components refers to the design and materials used in the manufacturing of the components. It encompasses the physical structure, arrangement, and integration of various parts like substrates, conductors, and insulators. The construction impacts the performance, reliability, and thermal properties of the component, influencing how it interacts with electrical signals and other components in a circuit. Different construction techniques can also affect the size, weight, and cost of the electronic component.

    COMPONENT
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    1.8GHz
  • Pin Count

    a count of all of the component leads (or pins)

    6
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    3V
  • Test Frequency

    a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

    1.9GHz
  • Current - Supply

    Current - Supply is a parameter in electronic components that refers to the maximum amount of electrical current that the component can provide to the circuit it is connected to. It is typically measured in units of amperes (A) and is crucial for determining the power handling capability of the component. Understanding the current supply rating is important for ensuring that the component can safely deliver the required current without overheating or failing. It is essential to consider this parameter when designing circuits to prevent damage to the component and ensure proper functionality of the overall system.

    37mA~63mA
  • Gain

    In electronic components, "Gain" refers to the ratio of the output signal amplitude to the input signal amplitude. It is a measure of the amplification provided by the component, such as a transistor or operational amplifier. Gain is typically expressed in decibels (dB) or as a numerical value, indicating how much the signal is amplified by the component.A higher gain value indicates a greater amplification of the input signal, while a lower gain value indicates less amplification. Gain is an important parameter in designing and analyzing electronic circuits, as it determines the overall performance and functionality of the system. Different components have different gain characteristics, and understanding the gain of a component is crucial for achieving the desired signal processing or amplification in electronic systems.

    23dB
  • RF/Microwave Device Type

    The parameter "RF/Microwave Device Type" in electronic components refers to the specific type or category of devices designed to operate within the radio frequency (RF) and microwave frequency ranges. These devices are engineered to handle high-frequency signals and are commonly used in various applications such as wireless communication, radar systems, satellite communication, and more. Examples of RF/Microwave device types include amplifiers, filters, mixers, oscillators, antennas, and transceivers. Understanding the RF/Microwave device type is crucial for selecting the appropriate component that meets the requirements of a particular RF system or application.

    WIDE BAND LOW POWER
  • VSWR-Max

    VSWR-Max stands for Voltage Standing Wave Ratio Maximum, which is a parameter used in electronic components, particularly in RF and microwave applications. It measures how effectively power is transmitted from a source through a transmission line to a load, indicating the level of reflected power due to impedance mismatches. A lower VSWR-Max value signifies better impedance matching and higher efficiency, while a higher value indicates poor matching, leading to greater signal reflections and potential performance issues. Manufacturers specify VSWR-Max to help ensure components operate within acceptable limits for optimal functionality.

    1.4
  • RF Type

    The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

    CDMA, PCS
  • Input Power-Max (CW)

    Input Power-Max (CW) is a parameter used to specify the maximum continuous wave power that an electronic component can handle without being damaged. This parameter is crucial in determining the power handling capability of the component under continuous wave operation. It is typically measured in watts and provides important information for designing circuits and systems to ensure that the component operates within its safe power limits. Exceeding the specified Input Power-Max (CW) can lead to overheating, degradation, or even permanent damage to the component.

    10dBm
  • Characteristic Impedance

    Characteristic impedance is a fundamental property of transmission lines and refers to the specific impedance that a transmission line presents to an electrical wave propagating along it. It is determined by the physical parameters of the transmission line, including its inductance and capacitance per unit length. When the line is terminated with a load that matches its characteristic impedance, maximum power transfer occurs, minimizing reflections and signal losses. In high-frequency applications, maintaining the characteristic impedance is crucial for signal integrity and performance.

    50Ohm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for NXP USA Inc. BGA2031/1,115.

BGA2031/1,115 Overview

RF Amplifier with cost-effective WIDE BAND LOW POWER RF/Microwave Device Type.An RF amplifier with the CDMA, PCS RF type.High reliability can be achieved by using the advanced RF Amp' packaging Tape & Reel (TR).Due to its 6-TSSOP, SC-88, SOT-363 packaging, it is convenient to ship overseas.Surface Mount is the recommended mount Amplifiers RF direction.Amplifiers RFs that can supply 3V~3.3V volts are available.It operates on a supply RF Amplifiers' current of 37mA~63mA for its operation.Various 6 terminations.

BGA2031/1,115 Features

WIDE BAND LOW POWER RF/Microwave Amplifier
RF Type CDMA, PCS
3V~3.3V voltage
37mA~63mA current

BGA2031/1,115 Applications

There are a lot of NXP USA Inc.
BGA2031/1,115 RF Amplifiers applications.


  • Recreational
  • Marine Navigation
  • Avionics
  • GPS
  • GLONASS
  • BeiDou
  • Galileo
  • Wireless communications
  • ISM applications
  • Wireless infrastructure
The three parts on the right have similar specifications to NXP USA Inc. & BGA2031/1,115.
BGA2031/1,115 Relevant information

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