NXP USA Inc. SA636DK/01,112
NXP USA Inc. SA636DK/01,112
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NXP USA Inc. SA636DK/01,112

Manufacturer No:

SA636DK/01,112

Manufacturer:

NXP USA Inc.

Utmel No:

1786-SA636DK/01,112

Package:

20-LSSOP (0.173, 4.40mm Width)

ECAD Model:

Description:

Cellular, ASK, DECT, FSK, UHF, VHF 500MHz 1-Mixer 12dB Up Converter Nickel/Palladium/Gold (Ni/Pd/Au) 20-LSSOP (0.173, 4.40mm Width)

Quantity:

Unit Price: $7.372931

Ext Price: $7.37

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 51

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $7.372931

    $7.37

  • 10

    $6.955595

    $69.56

  • 100

    $6.561882

    $656.19

  • 500

    $6.190455

    $3,095.23

  • 1000

    $5.840052

    $5,840.05

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Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
SA636DK/01,112 information

Specifications
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Product Details
Product Comparison
NXP USA Inc. SA636DK/01,112 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. SA636DK/01,112.
  • Type
    Parameter
  • Factory Lead Time
    7 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    20-LSSOP (0.173, 4.40mm Width)
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Operating Temperature (Max.)
    85°C
  • Operating Temperature (Min.)
    -40°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tube
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    SA636
  • Published
    2003
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Number of Terminations
    20
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    2.7V~5.5V
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    260
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65mm
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    500MHz
  • Time@Peak Reflow Temperature-Max (s)

    Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.

    30
  • Pin Count

    a count of all of the component leads (or pins)

    20
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDSO-G20
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    INDUSTRIAL
  • Current - Supply

    Current - Supply is a parameter in electronic components that refers to the maximum amount of electrical current that the component can provide to the circuit it is connected to. It is typically measured in units of amperes (A) and is crucial for determining the power handling capability of the component. Understanding the current supply rating is important for ensuring that the component can safely deliver the required current without overheating or failing. It is essential to consider this parameter when designing circuits to prevent damage to the component and ensure proper functionality of the overall system.

    6.5mA
  • Gain

    In electronic components, "Gain" refers to the ratio of the output signal amplitude to the input signal amplitude. It is a measure of the amplification provided by the component, such as a transistor or operational amplifier. Gain is typically expressed in decibels (dB) or as a numerical value, indicating how much the signal is amplified by the component.A higher gain value indicates a greater amplification of the input signal, while a lower gain value indicates less amplification. Gain is an important parameter in designing and analyzing electronic circuits, as it determines the overall performance and functionality of the system. Different components have different gain characteristics, and understanding the gain of a component is crucial for achieving the desired signal processing or amplification in electronic systems.

    11dB
  • Telecom IC Type

    Telecom IC Type refers to integrated circuits specifically designed for telecommunications applications. These components facilitate various functions such as signal processing, data modulation and demodulation, and communication protocol handling. They can be used in devices like mobile phones, modems, and network equipment, ensuring reliable data transmission and reception. Telecom ICs support different standards and technologies, making them essential for modern communication systems.

    TELECOM CIRCUIT
  • RF Type

    The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

    Cellular, ASK, DECT, FSK, UHF, VHF
  • Secondary Attributes

    In electronic components, secondary attributes refer to additional characteristics or properties of a component beyond its primary function or specifications. These attributes may include features such as operating temperature range, tolerance levels, packaging type, and environmental certifications. Secondary attributes are important for ensuring compatibility, reliability, and performance of the component in a specific application or environment. Understanding and considering these secondary attributes is crucial for selecting the right component that meets the requirements of a particular electronic system or design.

    Up Converter
  • Noise Figure

    Noise figure (NF) and noise factor (F) are measures of degradation of the signal-to-noise ratio (SNR), caused by components in a signal chain.

    12dB
  • Number of Mixers

    a device that combines two or more electrical or electronic signals into one or two composite output signals. There are two basic circuits that both use the term mixer, but they are very different types of circuits: additive mixers and multiplicative mixers. Additive mixers are also known as analog adders to distinguish from the related digital adder circuits.

    1
  • Length
    6.5mm
  • Width
    4.4mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
0 Similar Products Remaining
Download datasheets and manufacturer documentation for NXP USA Inc. SA636DK/01,112.

SA636DK/01,112 Overview

Using advanced packaging techniques Tube, high reliability is ensured.The mixer RF has been packed in 20-LSSOP (0.173, 4.40mm Width) for convenient overseas shipping.A RF type of Cellular, ASK, DECT, FSK, UHF, VHF is provided by the RF mixer.The RF fet mixer is mounted by a Surface Mount-axis.The RF mixer comes from the well-known SA636 series.

SA636DK/01,112 Features

Packed in 20-LSSOP (0.173, 4.40mm Width)
Cellular, ASK, DECT, FSK, UHF, VHF Type

SA636DK/01,112 Applications

There are a lot of NXP USA Inc.
SA636DK/01,112 RF Mixers applications.


  • Notebook PC
  • Ultra-Mobile PC
  • Recreational
  • Marine Navigation
  • Avionics
  • GPS
  • GLONASS
  • BeiDou
  • Galileo
  • Wireless communications
The three parts on the right have similar specifications to NXP USA Inc. & SA636DK/01,112.
SA636DK/01,112 Relevant information

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