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ON Semiconductor MC74VHC1G135DFT1G

Manufacturer No:

MC74VHC1G135DFT1G

Manufacturer:

ON Semiconductor

Utmel No:

1807-MC74VHC1G135DFT1G

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ECAD Model:

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MC74VHC1G135DFT1G datasheet pdf and Unclassified product details from ON Semiconductor stock available at Utmel

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MC74VHC1G135DFT1G information

Specifications
Documents & Media
ON Semiconductor MC74VHC1G135DFT1G technical specifications, attributes, parameters and parts with similar specifications to ON Semiconductor MC74VHC1G135DFT1G.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    5
  • Package Description
    TSSOP, TSSOP5/6,.08
  • Package Style
    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
  • Moisture Sensitivity Levels
    1
  • Load Capacitance (CL)
    50 pF
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    TSSOP5/6,.08
  • Operating Temperature-Min
    -55 °C
  • Reflow Temperature-Max (s)
    NOT SPECIFIED
  • Operating Temperature-Max
    125 °C
  • Rohs Code
    Yes
  • Manufacturer Part Number
    MC74VHC1G135DFT1G
  • Supply Voltage-Nom (Vsup)
    3.3 V
  • Package Code
    TSSOP
  • Package Shape
    RECTANGULAR
  • Manufacturer
    ON Semiconductor
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    ON SEMICONDUCTOR
  • Risk Rank
    5.46
  • Part Package Code
    SOT-353
  • Prop.
    12.3 ns
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Subcategory
    Gates
  • Packing Method

    The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

    TAPE AND REEL
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    CMOS
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Peak Reflow Temperature (Cel)

    Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.

    235
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    compliant
  • Pin Count

    a count of all of the component leads (or pins)

    5
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDSO-G5
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Supply Voltage-Max (Vsup)

    The parameter "Supply Voltage-Max (Vsup)" in electronic components refers to the maximum voltage that can be safely applied to the component without causing damage. It is an important specification to consider when designing or using electronic circuits to ensure the component operates within its safe operating limits. Exceeding the maximum supply voltage can lead to overheating, component failure, or even permanent damage. It is crucial to adhere to the specified maximum supply voltage to ensure the reliable and safe operation of the electronic component.

    5.5 V
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    2/5.5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    MILITARY
  • Supply Voltage-Min (Vsup)

    The parameter "Supply Voltage-Min (Vsup)" in electronic components refers to the minimum voltage level required for the component to operate within its specified performance range. This parameter indicates the lowest voltage that can be safely applied to the component without risking damage or malfunction. It is crucial to ensure that the supply voltage provided to the component meets or exceeds this minimum value to ensure proper functionality and reliability. Failure to adhere to the specified minimum supply voltage may result in erratic behavior, reduced performance, or even permanent damage to the component.

    2 V
  • Family

    In electronic components, the parameter "Family" typically refers to a categorization or classification system used to group similar components together based on their characteristics, functions, or applications. This classification helps users easily identify and select components that meet their specific requirements. The "Family" parameter can include various subcategories such as resistors, capacitors, diodes, transistors, integrated circuits, and more. Understanding the "Family" of an electronic component can provide valuable information about its compatibility, performance specifications, and potential uses within a circuit or system. It is important to consider the "Family" parameter when designing or troubleshooting electronic circuits to ensure proper functionality and compatibility with other components.

    AHC/VHC
  • Number of Inputs
    2
  • Output Characteristics

    Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.

    OPEN-DRAIN
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    1.1 mm
  • Logic IC Type

    Logic IC Type refers to the type of integrated circuit (IC) that is specifically designed to perform logical operations. These ICs are commonly used in digital electronic devices to process and manipulate binary data according to predefined logic functions. The Logic IC Type parameter typically specifies the specific logic family or technology used in the IC, such as TTL (Transistor-Transistor Logic), CMOS (Complementary Metal-Oxide-Semiconductor), or ECL (Emitter-Coupled Logic). Understanding the Logic IC Type is important for selecting the appropriate IC for a given application, as different logic families have varying characteristics in terms of speed, power consumption, and noise immunity.

    NAND GATE
  • Max I(ol)

    Max I(ol) refers to the maximum output current that a specific electronic component, such as a transistor or integrated circuit, can sink or source. This parameter is crucial in determining the capability of the component to drive external loads without being damaged. It is typically specified in the component's datasheet and is important for ensuring proper operation and reliability of the circuit in which the component is used. Designers must ensure that the output current requirements of the circuit do not exceed the specified "Max I(ol)" value to prevent overloading and potential failure of the component.

    0.008 A
  • Propagation Delay (tpd)

    Propagation delay (tpd) is a crucial parameter in electronic components, especially in digital circuits. It refers to the time taken for a signal to travel from the input of a component to its output. This delay is caused by various factors such as the internal circuitry, interconnections, and the physical properties of the component. Propagation delay is essential to consider in designing circuits to ensure proper timing and functionality. It is typically measured in nanoseconds or picoseconds and plays a significant role in determining the overall performance and speed of electronic systems.

    19.6 ns
  • Schmitt Trigger

    A Schmitt Trigger is a type of comparator circuit commonly used in electronics to convert an analog input signal into a digital output signal. It has hysteresis, which means that the output switches at different voltage levels depending on whether the input is rising or falling. This hysteresis helps to eliminate noise and provide a more stable output signal. Schmitt Triggers are often used in applications where noise immunity and signal conditioning are important, such as in signal processing, waveform shaping, and digital logic circuits.

    YES
  • Width
    1.25 mm
  • Length
    2 mm
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