OSRAM LCWW5SM-JYKZ-4J8K

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

a process by which the operating system makes files and directories on a storage device (such as hard drive, CD-ROM, or network share) available for users to access via the computer's file system.

In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

Package Cooled refers to a type of thermal management in electronic components where the device packaging is designed to dissipate heat efficiently. This involves integrating cooling features such as heat sinks or specialized materials that enhance heat transfer away from the component. The goal is to maintain optimal operating temperatures and improve reliability and performance of the electronic device. It is commonly used in high-power applications where excessive heat generation can affect functionality.

Material Finish in electronic components refers to the surface treatment applied to the component to enhance its performance, durability, and reliability. The finish can protect the component from environmental factors such as moisture, corrosion, and mechanical stress. Common material finishes include gold plating, tin plating, silver plating, and organic coatings. The choice of material finish depends on the specific requirements of the application, such as conductivity, solderability, and cost-effectiveness. Proper material finish selection is crucial to ensure the long-term functionality and quality of electronic components.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

The attachment method in electronic components refers to the technique used to connect a component to a circuit board or assembly. This can include methods such as soldering, bonding, or using connectors. The choice of attachment method can affect the reliability, performance, and manufacturability of the electronic device. Different methods may be suited for specific applications based on factors like mechanical stress, thermal conductivity, and ease of assembly.

The parameter "Height Off Base (Height of Fin)" in electronic components refers to the distance between the base of the component and the top of any fins or protrusions on the component. This measurement is important for determining the overall dimensions and clearance requirements of the component within a circuit or system. It helps in ensuring proper fit and alignment of the component during installation and assembly. Manufacturers provide this specification to assist designers and engineers in selecting the appropriate components for their applications based on the available space and mechanical constraints.

Thermal Resistance @ Forced Air Flow is a measure of how effectively an electronic component can dissipate heat when subjected to airflow. It quantifies the resistance to heat transfer from the component to the surrounding air in scenarios where forced ventilation is employed, such as with fans. This parameter is crucial for evaluating thermal performance, as it impacts the component's operating temperature and reliability under conditions of active cooling. Lower thermal resistance values indicate better heat dissipation capabilities, essential for maintaining optimal performance in high-power applications.

the angle at which a display can be viewed with acceptable visual performance.

Optoelectronic Device Type refers to the classification of electronic components that can both detect and emit light. These devices convert electrical signals into light or vice versa, making them essential for applications such as optical communication, sensing, and display technologies. Common types of optoelectronic devices include light-emitting diodes (LEDs), photodiodes, phototransistors, and laser diodes. Understanding the optoelectronic device type is crucial for selecting the appropriate component for a specific application based on factors such as wavelength, power output, and sensitivity.

Lenses are classified by the curvature of the two optical surfaces. A lens is biconvex (or double convex, or just convex) if both surfaces are convex. If both surfaces have the same radius of curvature, the lens is equiconvex. A lens with two concave surfaces is biconcave (or just concave).

Forward Current-Max is a parameter used to specify the maximum amount of current that an electronic component, such as a diode or LED, can safely handle when it is forward-biased. This parameter is crucial for determining the operating limits of the component to prevent damage or failure due to excessive current flow. Exceeding the specified Forward Current-Max can lead to overheating, degradation of the component, or even permanent damage. It is important to carefully consider this parameter when designing circuits to ensure the component operates within its safe limits.

Forward Voltage-Max refers to the maximum voltage that can be applied to a semiconductor device, such as a diode or LED, in the forward-biased condition without causing damage. It indicates the highest voltage level that allows the device to operate efficiently while conducting current. Exceeding this parameter may lead to thermal runaway or failure of the component. This value is crucial for ensuring proper circuit design and reliability.

Overall Height is a parameter that refers to the total vertical measurement of an electronic component, typically measured from the bottom of the component to the highest point on top. It is an important specification to consider when designing or selecting components for a project, as it determines the amount of space the component will occupy within a circuit or device. Understanding the overall height of electronic components is crucial for ensuring proper fit and clearance within the overall system design. Manufacturers provide this information in datasheets to help engineers and designers make informed decisions during the product development process.

Thermal Resistance @ Natural refers to the ability of an electronic component to dissipate heat under natural convection conditions without forced airflow. It is measured in degrees Celsius per watt and represents the temperature rise of the component above the ambient temperature for each watt of power dissipated. This parameter is crucial for understanding how effectively a component can manage heat during operation, ensuring reliability and performance. Manufacturers provide this value to help designers assess thermal management strategies in circuit designs.

Power Dissipation at Temperature Rise refers to the maximum amount of power an electronic component, such as a semiconductor or resistor, can dissipate while maintaining a specified increase in temperature above its ambient environment. This parameter is crucial for ensuring the reliability and longevity of components, as excessive heat can lead to failure. It is typically expressed in watts and is determined by the thermal characteristics of the component and its cooling mechanisms. Proper management of power dissipation is essential for optimal performance in electronic circuits.

Color@Wavelength refers to the specific color or hue emitted by an electronic component, such as an LED or laser diode, when activated. This parameter is defined by the wavelength of light produced, measured in nanometers (nm). Different wavelengths correspond to different colors in the visible spectrum, impacting the applications and visual output of the component. It is a crucial specification for designers and engineers when selecting components for visual indicators, displays, or lighting applications.

In electronic components, the parameter "Diameter" typically refers to the measurement of the width of a circular component, such as a resistor, capacitor, or inductor. It is a crucial dimension that helps determine the physical size and fit of the component within a circuit or on a circuit board. The diameter is usually measured in millimeters (mm) or inches (in) and is important for ensuring proper placement and soldering of the component during assembly. Understanding the diameter of electronic components is essential for selecting the right size for a specific application and ensuring compatibility with other components and the overall design of the circuit.