Panasonic EXB-18N683JX

Material Type in electronic components refers to the specific material used in the construction of the component. Different materials have varying properties that can affect the performance, durability, and cost of the component. Common materials used in electronic components include metals like copper and aluminum for conductors, silicon for semiconductors, and various types of plastics for insulating and protective purposes. The choice of material type is crucial in designing electronic components to ensure they meet the required specifications and standards for the intended application.

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

Adhesive in electronic components refers to materials used to bond various parts together within an electronic assembly. These adhesives can provide structural integrity and durability to components such as circuit boards, connectors, and housing. They may also offer protective properties against environmental factors, such as moisture and heat, and can enhance electrical insulation. The selection of a suitable adhesive is critical to the performance and reliability of the final electronic product.

a group of products which fulfill a similar need for a market segment or market as a whole.

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The "Shrink Ratio" in electronic components refers to the ratio of the original size of a component to its final size after a shrinking process. This parameter is commonly associated with heat shrink tubing, which is a type of insulation material used to protect and cover wires, cables, and other components. The shrink ratio is typically expressed as a numerical value, such as 2:1 or 3:1, indicating how much the tubing will shrink in size when heat is applied.For example, a heat shrink tubing with a shrink ratio of 2:1 will reduce to half of its original diameter when heated. This property allows the tubing to tightly conform to the shape of the component it is covering, providing insulation, protection, and strain relief. It is important to select the appropriate shrink ratio for the application to ensure a secure and effective fit.

The parameter "Label Width" in electronic components refers to the physical width of the label or marking on the component itself. This measurement is important for identifying and distinguishing different components, especially in cases where multiple components are closely packed together on a circuit board. The label width is typically specified in millimeters or inches and is crucial for ensuring proper placement and readability of the component markings during assembly and maintenance processes. Manufacturers provide this information to help users accurately interpret and handle the components in electronic devices.

Label Height in electronic components refers to the physical dimension that specifies the height of the label or marking on the component. This parameter is important for ensuring proper identification and traceability of the component during manufacturing, assembly, and maintenance processes. The label height is typically measured in millimeters or inches and is specified in the component's datasheet or technical documentation. It is crucial to adhere to the recommended label height to ensure clear and legible markings for easy identification and tracking of the electronic component.