PHILIPS SEMICONDUCTORS 74LVC573ADB
PHILIPS SEMICONDUCTORS 74LVC573ADB
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PHILIPS SEMICONDUCTORS 74LVC573ADB

Manufacturer No:

74LVC573ADB

Utmel No:

1891-74LVC573ADB

Package:

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ECAD Model:

Description:

74LVC573ADB datasheet pdf and Unclassified product details from PHILIPS SEMICONDUCTORS stock available at Utmel

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In Stock : 132

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
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74LVC573ADB information

Specifications
PHILIPS SEMICONDUCTORS 74LVC573ADB technical specifications, attributes, parameters and parts with similar specifications to PHILIPS SEMICONDUCTORS 74LVC573ADB.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    20
  • Operating Temperature (Min.)
    -40°C
  • Operating Temperature (Max.)
    125°C
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Packing Method

    The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

    TUBE
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Number of Functions
    1
  • Supply Voltage

    Supply voltage refers to the electrical potential difference provided to an electronic component or circuit. It is crucial for the proper operation of devices, as it powers their functions and determines performance characteristics. The supply voltage must be within specified limits to ensure reliability and prevent damage to components. Different electronic devices have specific supply voltage requirements, which can vary widely depending on their design and intended application.

    3.3V
  • Terminal Pitch

    The center distance from one pole to the next.

    0.635mm
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDSO-G20
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    3.3V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    AUTOMOTIVE
  • Load Capacitance

    the amount of capacitance measured or computed across the crystal terminals on the PCB. Frequency Tolerance. Frequency tolerance refers to the allowable deviation from nominal, in parts per million (PPM), at a specific temperature, usually +25°C.

    50pF
  • Number of Bits
    8
  • Output Characteristics

    Output characteristics in electronic components refer to the relationship between the output voltage and output current across a range of input conditions. This parameter is essential for understanding how a device, such as a transistor or operational amplifier, behaves under various loads and operating points. It provides insights into the efficiency, performance, and limitations of the component, helping designers to make informed choices for circuits and applications.

    3-STATE
  • Logic IC Type

    Logic IC Type refers to the type of integrated circuit (IC) that is specifically designed to perform logical operations. These ICs are commonly used in digital electronic devices to process and manipulate binary data according to predefined logic functions. The Logic IC Type parameter typically specifies the specific logic family or technology used in the IC, such as TTL (Transistor-Transistor Logic), CMOS (Complementary Metal-Oxide-Semiconductor), or ECL (Emitter-Coupled Logic). Understanding the Logic IC Type is important for selecting the appropriate IC for a given application, as different logic families have varying characteristics in terms of speed, power consumption, and noise immunity.

    D LATCH
  • Max I(ol)

    Max I(ol) refers to the maximum output current that a specific electronic component, such as a transistor or integrated circuit, can sink or source. This parameter is crucial in determining the capability of the component to drive external loads without being damaged. It is typically specified in the component's datasheet and is important for ensuring proper operation and reliability of the circuit in which the component is used. Designers must ensure that the output current requirements of the circuit do not exceed the specified "Max I(ol)" value to prevent overloading and potential failure of the component.

    0.024 A
  • Prop. Delay@Nom-Sup

    The parameter "Prop. Delay@Nom-Sup" in electronic components refers to the propagation delay at nominal supply voltage. Propagation delay is the time it takes for a signal to travel from the input of a component to the output, typically measured in nanoseconds or picoseconds. The nominal supply voltage is the standard operating voltage specified for the component.This parameter is important because it affects the overall speed and performance of the electronic circuit. A shorter propagation delay means faster signal processing and better overall performance. Designers need to consider the propagation delay at the nominal supply voltage when selecting components for their circuits to ensure proper functionality and meet performance requirements.

    8 ns
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    RoHS Compliant
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