Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39212B8092P810
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39212B8092P810
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Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39212B8092P810

Manufacturer No:

B39212B8092P810

Utmel No:

1985-B39212B8092P810

Package:

9-SMD, No Lead

ECAD Model:

Description:

RF DUPLEXER 1.95GHZ/2.14GHZ 9SMD

Quantity:

Unit Price: $2.933782

Ext Price: $2.93

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

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In Stock : 5

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $2.933782

    $2.93

  • 10

    $2.767719

    $27.68

  • 100

    $2.611055

    $261.11

  • 500

    $2.463260

    $1,231.63

  • 1000

    $2.323830

    $2,323.83

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
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B39212B8092P810 information

Specifications
Product Details
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39212B8092P810 technical specifications, attributes, parameters and parts with similar specifications to Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39212B8092P810.
  • Type
    Parameter
  • Factory Lead Time
    9 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    9-SMD, No Lead
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2015
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Type
    Duplexer
  • Frequency Bands (Low / High)

    Frequency bands (Low / High) in electronic components refer to the range of frequencies over which the component operates effectively. The low frequency band typically refers to frequencies below a certain threshold, while the high frequency band refers to frequencies above that threshold. Understanding the frequency bands of electronic components is crucial for designing circuits and systems that operate within the desired frequency range. Components such as capacitors, inductors, and transistors may have specific frequency bands in which they exhibit optimal performance, making it important to consider these specifications when selecting components for a particular application.

    1.92GHz~1.98GHz / 2.11GHz~2.17GHz
  • High Band Attenuation (min / max dB)

    The parameter "High Band Attenuation (min / max dB)" in electronic components refers to the range of attenuation values within a specific frequency band. Attenuation is the reduction in signal strength as it passes through a component or system. In this context, the high band refers to higher frequencies within the component's operating range. The minimum and maximum dB values indicate the range of attenuation that can be expected at those frequencies, providing insight into the component's performance in attenuating high-frequency signals. Designers and engineers use this parameter to ensure that the component meets the required specifications for signal attenuation in high-frequency applications.

    37.00dB / 43.00dB
  • Low Band Attenuation (min / max dB)

    The parameter "Low Band Attenuation (min / max dB)" in electronic components refers to the range of attenuation levels within a specific frequency range, typically in the lower frequency band. Attenuation is the reduction in signal strength as it passes through a component or system. The minimum and maximum dB values indicate the range within which the signal strength is attenuated in the low-frequency range. This parameter is important for determining the performance of the component in filtering out unwanted signals or noise in the lower frequency spectrum. A lower value for low band attenuation indicates better signal retention in the specified frequency range.

    43.00dB / 48.00dB
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Product Description

Description: The B39212B8092P810 is a high-performance RF duplexer designed by Qualcomm RF360, a joint venture between Qualcomm and TDK. This component is specifically engineered to handle the demanding requirements of modern wireless communication systems. The duplexer is optimized for use in frequency bands ranging from 1.92 GHz to 1.98 GHz and 2.11 GHz to 2.17 GHz, making it an ideal solution for various wireless applications.

Features: - Frequency Bands: The B39212B8092P810 supports two distinct frequency bands, ensuring efficient multiplexing and minimizing interference. - Attenuation Performance: It offers high band attenuation ranging from 37 dB to 43 dB and low band attenuation ranging from 43 dB to 48 dB, providing robust signal isolation. - Manufacturing Quality: Compliant with ROHS3 standards, this component ensures environmental sustainability. - Mounting Flexibility: Designed for surface mount technology (SMT), it offers easy integration into modern PCB designs. - Reliability and Durability: With a moisture sensitivity level (MSL) of 3, indicating a storage life of 168 hours, this duplexer is reliable even in challenging environmental conditions. - Packaging Efficiency: Available in tape and reel (TR) packaging, it simplifies inventory management and reduces handling errors.

Applications: 1. Primary Applications: - Wireless communication systems - Cellular base stations - Mobile devices - IoT devices

  1. Secondary Applications:
  2. Satellite communication systems
  3. Radar systems
  4. Medical devices requiring wireless connectivity

Alternative Parts: While the B39212B8092P810 is a unique component due to its specific frequency band support and high attenuation performance, some alternative parts that might be considered include: - Other RF multiplexers from Qualcomm RF360 or TDK - Similar duplexer components from other manufacturers like Murata or Skyworks

Embedded Modules: The B39212B8092P810 is commonly used in various embedded modules designed for wireless communication applications. These modules often include: - Cellular base station modules - Mobile device modules - IoT gateway modules

Conclusion:

The B39212B8092P810 RF duplexer from Qualcomm RF360 is a reliable and efficient component designed for modern wireless communication systems. Its high attenuation performance, robust manufacturing quality, and flexible packaging make it an excellent choice for a wide range of applications in the telecommunications industry.