Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39851B8030P810
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39851B8030P810
feed

Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39851B8030P810

Manufacturer No:

B39851B8030P810

Utmel No:

1985-B39851B8030P810

Package:

9-SMD, No Lead

ECAD Model:

Description:

RF DUPLEXER 9SMD NO LEAD

Quantity:

Unit Price: $2.928127

Ext Price: $2.93

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 5

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $2.928127

    $2.93

  • 10

    $2.762384

    $27.62

  • 100

    $2.606023

    $260.60

  • 500

    $2.458512

    $1,229.26

  • 1000

    $2.319351

    $2,319.35

Want a lower wholesale price? Please send RFQ, we will respond immediately.

RFQ Now

Add to RFQ list

User Guide

Purchase & Inquiry
Package
Shipping Information
Shopping Manual
Purchase

You may place an order without registering to Utmel.
We strongly suggest you sign in before purchasing as you can track your order in real time.

Means of Payment

For your convenience, we accept multiple payment methods in USD, including PayPal, Credit Card, and wire transfer.

RFQ (Request for Quotations)

It is recommended to request for quotations to get the latest prices and inventories about the part.
Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

1. You'll receive an order information email in your inbox. (Please remember to check the spam folder if you didn't hear from us).
2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
B39851B8030P810 information

Specifications
Product Details
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39851B8030P810 technical specifications, attributes, parameters and parts with similar specifications to Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39851B8030P810.
  • Type
    Parameter
  • Factory Lead Time
    9 Weeks
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    9-SMD, No Lead
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    B8030
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    3 (168 Hours)
  • Type
    Duplexer
  • Frequency Bands (Low / High)

    Frequency bands (Low / High) in electronic components refer to the range of frequencies over which the component operates effectively. The low frequency band typically refers to frequencies below a certain threshold, while the high frequency band refers to frequencies above that threshold. Understanding the frequency bands of electronic components is crucial for designing circuits and systems that operate within the desired frequency range. Components such as capacitors, inductors, and transistors may have specific frequency bands in which they exhibit optimal performance, making it important to consider these specifications when selecting components for a particular application.

    791MHz~821MHz / 832MHz~862MHz
  • High Band Attenuation (min / max dB)

    The parameter "High Band Attenuation (min / max dB)" in electronic components refers to the range of attenuation values within a specific frequency band. Attenuation is the reduction in signal strength as it passes through a component or system. In this context, the high band refers to higher frequencies within the component's operating range. The minimum and maximum dB values indicate the range of attenuation that can be expected at those frequencies, providing insight into the component's performance in attenuating high-frequency signals. Designers and engineers use this parameter to ensure that the component meets the required specifications for signal attenuation in high-frequency applications.

    39.00dB / 50.00dB
  • Low Band Attenuation (min / max dB)

    The parameter "Low Band Attenuation (min / max dB)" in electronic components refers to the range of attenuation levels within a specific frequency range, typically in the lower frequency band. Attenuation is the reduction in signal strength as it passes through a component or system. The minimum and maximum dB values indicate the range within which the signal strength is attenuated in the low-frequency range. This parameter is important for determining the performance of the component in filtering out unwanted signals or noise in the lower frequency spectrum. A lower value for low band attenuation indicates better signal retention in the specified frequency range.

    44.00dB / 46.00dB
0 Similar Products Remaining

Product Description

Description

The B39851B8030P810 is a high-performance RF duplexer designed by Qualcomm in collaboration with TDK, under the RF360 joint venture. This component is specifically engineered to handle the demanding requirements of modern wireless communication systems. The duplexer is a critical component in ensuring efficient signal transmission and reception across multiple frequency bands.

Features

  • Frequency Bands: The B39851B8030P810 supports two distinct frequency bands: 791 MHz to 821 MHz (low band) and 832 MHz to 862 MHz (high band), making it versatile for various wireless applications.
  • Attenuation Performance: The duplexer exhibits excellent attenuation performance, with a minimum high band attenuation of 39 dB and a maximum of 50 dB. For the low band, it offers a minimum attenuation of 44 dB and a maximum of 46 dB, ensuring robust signal isolation.
  • Mounting Type: Designed for surface mount applications, this component is optimized for easy integration into modern PCB designs.
  • Package & Packaging: The B39851B8030P810 is packaged in a 9-SMD, no-lead format and comes in tape and reel (TR) packaging for convenient handling and assembly.

Applications

  1. Primary Applications:
  2. Cellular Base Stations: The duplexer's ability to handle multiple frequency bands makes it an ideal component for cellular base stations where simultaneous transmission and reception are crucial.
  3. Handsets and Mobile Devices: Its high attenuation performance ensures efficient signal isolation, which is essential for maintaining clear communication in mobile devices.

  4. Secondary Applications:

  5. IoT Devices: The duplexer's frequency range and attenuation capabilities make it suitable for IoT devices that require reliable communication over various frequencies.
  6. Automotive Telematics: Its robust design and frequency coverage make it a viable option for automotive telematics systems where signal integrity is paramount.

Alternative Parts

If the B39851B8030P810 is not available or if you need an alternative solution, consider the following parts: - B39851B8030P810A (Alternate version with slightly different specifications) - Other RF multiplexers from Qualcomm’s RF360 series

Embedded Modules

The B39851B8030P810 is commonly used in various embedded modules designed for wireless communication applications: - Qualcomm’s Snapdragon-based modules - TDK’s RF modules integrated with Qualcomm’s technology

Summary

The B39851B8030P810 is a reliable and efficient RF duplexer engineered by Qualcomm in collaboration with TDK. Its robust design, high attenuation performance, and versatile frequency coverage make it an essential component in modern wireless communication systems. Whether used in cellular base stations, handsets, IoT devices, or automotive telematics systems, this duplexer ensures optimal signal transmission and reception across multiple frequency bands.