Renesas DA14585-00000AT2
Renesas DA14585-00000AT2
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Renesas DA14585-00000AT2

Manufacturer No:

DA14585-00000AT2

Manufacturer:

Renesas

Utmel No:

2038-DA14585-00000AT2

Package:

40-VFQFN Exposed Pad

ECAD Model:

Description:

TxRx + MCU 2.4GHz 3.3V I²C, SPI, UART - 3.7mA - Receiving 3.4mA - Transmitting - 64kB OTP, 128kB ROM, 96kB SRAM 25 40-VFQFN Exposed Pad

Quantity:

Unit Price: $2.738936

Ext Price: $2.74

Delivery:

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Payment:

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In Stock : 4522

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $2.738936

    $2.74

  • 10

    $2.583902

    $25.84

  • 100

    $2.437643

    $243.76

  • 500

    $2.299663

    $1,149.83

  • 1000

    $2.169494

    $2,169.49

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
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  • Vacuum packagingStep2:Vacuum packaging
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DA14585-00000AT2 information

Specifications
Product Details
Renesas DA14585-00000AT2 technical specifications, attributes, parameters and parts with similar specifications to Renesas DA14585-00000AT2.
  • Type
    Parameter
  • Contact Plating

    Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

    Tin
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    40-VFQFN Exposed Pad
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    40-QFN (5x5)
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 125 C
  • Minimum Operating Temperature
    - 40 C
  • Factory Pack QuantityFactory Pack Quantity
    605
  • Mounting Styles
    Cable Mount / Free Hanging
  • Manufacturer
    Aptiv
  • Brand
    Aptiv (formerly Delphi)
  • RoHS
    Details
  • Package
    Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    DA14585
  • Mfr
    Renesas Design Germany GmbH
  • Product Status
    Active
  • MSL
    MSL 3 - 168 hours
  • Qualification
    -
  • Maximum Clock Frequency
    16 MHz
  • Maximum Data Rate
    1 Mbps
  • Supply Voltage-Max
    3.6 V
  • Supply Voltage-Min
    900 mV
  • Supply Current Transmitting
    3.4 mA
  • Interface Type
    I2C, SPI, UART
  • Supply Current Receiving
    3.7 mA
  • Data RAM Type
    SRAM
  • Data RAM Size
    96 kB
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    SmartBond™
  • Type
    TxRx + MCU
  • Number of Positions
    8 Position
  • Gender

    In the context of electronic components, the parameter "Gender" typically refers to the physical characteristics of connectors or interfaces that determine how they can be mated together. Connectors are often designed with specific gender types, such as male or female, to ensure proper alignment and connection between devices. A male connector typically has protruding pins or plugs that fit into a corresponding female connector, which has receptacles or sockets to receive the pins. This design helps prevent incorrect connections and ensures a secure and reliable electrical connection. Understanding the gender of connectors is crucial when designing or assembling electronic systems to ensure compatibility and proper functionality. It is essential to match the gender of connectors correctly to avoid damage and ensure optimal performance of the electronic components.

    Receptacle (Female)
  • Subcategory
    Automotive Connectors
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    Si
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    3.3V
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    2.4GHz
  • Termination Style

    "Termination style" in electronic components refers to the method used to connect the component to a circuit board or other electronic devices. It determines how the component's leads or terminals are designed for soldering or mounting onto the circuit board. Common termination styles include through-hole, surface mount, and wire lead terminations.Through-hole components have leads that are inserted through holes in the circuit board and soldered on the other side. Surface mount components have flat terminals that are soldered directly onto the surface of the circuit board. Wire lead terminations involve attaching wires to the component for connection.The choice of termination style depends on factors such as the type of component, the manufacturing process, and the space available on the circuit board. Different termination styles offer various advantages in terms of ease of assembly, reliability, and space efficiency in electronic designs.

    Crimp
  • Operating Frequency

    Operating frequency is the frequency at which the communications are being made with the total bandwidth occupied by the carrier signal with modulation. Usually bandwidth of the antenna will be wider than the bandwidth of the signal so that more than one center frequency the antenna can be put in to effective use.

    2.4 GHz
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    I2C, I2S, SPI, UART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    64kB OTP, 128kB ROM, 96kB SRAM
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    OTP, ROM
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    64KB
  • Output Power

    That power available at a specified output of a device under specified conditions of operation.

    0 dBm
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    32bit
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    Automotive Connectors
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    Bluetooth v5.0
  • Power - Output

    Power Output in electronic components refers to the amount of electrical power that a device can deliver to a load. It is typically measured in watts and indicates the effectiveness of the component in converting electrical energy into usable work or signal. Power Output can vary based on the component's design, operating conditions, and intended application, making it a critical factor in the performance of amplifiers, power supplies, and other electronic devices. Understanding the Power Output helps in selecting appropriate components for specific applications to ensure efficiency and reliability.

    0dBm
  • RF Family/Standard

    The parameter "RF Family/Standard" in electronic components refers to the specific radio frequency (RF) technology or standard that the component complies with or is designed for. RF technology encompasses a wide range of frequencies used for wireless communication, such as Wi-Fi, Bluetooth, cellular networks, and more. Different RF standards dictate the frequency bands, modulation techniques, data rates, and other specifications for communication systems. Understanding the RF family/standard of a component is crucial for ensuring compatibility and optimal performance in RF applications.

    Bluetooth
  • Sensitivity

    Sensitivity in electronic components refers to the degree to which the output of a device responds to changes in input. It indicates how effectively a component translates a specific input signal into an observable output. High sensitivity means that even small variations in input can produce significant changes in output, making the device more responsive to signals. Sensitivity is crucial in applications where precise measurements or signal detection are required.

    -93dBm
  • Data Rate (Max)

    Data Rate (Max) refers to the maximum rate at which data can be transferred or processed within an electronic component or device. It is typically measured in bits per second (bps) or megabits per second (Mbps). This parameter is important for determining the speed and efficiency of data transmission or processing in various electronic applications such as computer systems, networking devices, and memory modules. A higher data rate indicates that the component is capable of handling larger volumes of data at a faster pace, leading to improved performance and responsiveness in electronic systems. It is crucial to consider the Data Rate (Max) specification when selecting electronic components to ensure compatibility and optimal functionality for specific applications.

    -
  • Number of ADC Channels
    4 Channel
  • Serial Interfaces

    A serial interface is a communication interface between two digital systems that transmits data as a series of voltage pulses down a wire. Essentially, the serial interface encodes the bits of a binary number by their "temporal" location on a wire rather than their "spatial" location within a set of wires.

    I²C, SPI, UART
  • Current - Receiving

    Current - Receiving refers to the amount of electrical current that an electronic component or device is capable of accepting from a power source or another component in a circuit. It indicates the maximum current that can be safely received without causing damage or malfunction. This parameter is crucial for ensuring compatibility and reliability in electronic designs, as exceeding the rated receiving current can lead to overheating or failure of the component.

    3.7mA
  • Current - Transmitting

    Current - Transmitting is a parameter used to describe the maximum amount of electrical current that an electronic component can handle while in the transmitting mode. This parameter is crucial for components such as transistors, diodes, and integrated circuits that are involved in transmitting signals or power within a circuit. Exceeding the specified current transmitting rating can lead to overheating, component failure, or even damage to the entire circuit. Designers and engineers must carefully consider this parameter when selecting components to ensure the reliability and performance of the electronic system.

    3.4mA
  • Modulation

    In electronic components, modulation refers to the process of varying one or more properties of a periodic waveform, known as the carrier signal, in order to encode information. This modulation technique is commonly used in communication systems to transmit data efficiently over long distances. By modulating the carrier signal, information such as audio, video, or data can be embedded onto the signal for transmission and then demodulated at the receiving end to retrieve the original information. There are various types of modulation techniques, including amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM), each with its own advantages and applications in different communication systems.

    -
  • GPIO

    GPIO stands for General Purpose Input/Output. It is a type of electronic pin found on microcontrollers, microprocessors, and other integrated circuits that can be configured to either input or output digital signals. GPIO pins can be used to connect and communicate with external devices such as sensors, LEDs, motors, and more. They provide a flexible way to interact with the physical world by allowing the device to both receive and send digital signals. GPIO pins can be programmed and controlled by software to perform various functions based on the specific requirements of the electronic system.

    25
  • Product

    In the context of electronic components, the parameter "Product" typically refers to the specific item or device being discussed or analyzed. It can refer to a physical electronic component such as a resistor, capacitor, transistor, or integrated circuit. The product parameter may also encompass more complex electronic devices like sensors, displays, microcontrollers, or communication modules.Understanding the product parameter is crucial in electronics as it helps identify the characteristics, specifications, and functionality of the component or device in question. This information is essential for selecting the right components for a circuit design, troubleshooting issues, or comparing different products for a particular application. Manufacturers often provide detailed product datasheets that outline key specifications, performance characteristics, and application guidelines to assist engineers and designers in utilizing the component effectively.

    Connectors
  • Product Category

    a particular group of related products.

    Automotive Connectors
  • Device Core

    Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

    ARM Cortex-M0
  • Width
    5 mm
  • Height
    0.9 mm
  • Length
    5 mm
0 Similar Products Remaining

DA14585-00000AT2 Overview

Using RF transceiver IC's 40-VFQFN Exposed Pad package, it is possible to save board space. This RF transceiver's mounting method is Surface Mount.The system emerges as a TxRx + MCU with transceiver RF's high efficiency.High reliability is achieved with advanced transceiver RF' packaging Bulk.As you can see, this RF transceiver comes from the well-known SmartBond™ series of products.A frequency of 2.4GHz is used to operate RF transceiver.

DA14585-00000AT2 Features

40-VFQFN Exposed Pad package
Surface Mount for mounting
TxRx + MCU
Bulk is used
SmartBond™ series

DA14585-00000AT2 Applications

There are a lot of Renesas
DA14585-00000AT2 RF Transceiver ICs applications.


  • Remote Device Management
  • Low-power IoT applications
  • LoT applications
  • Power Amplifier (PA)
  • Low Noise Amplifier (LNA)
  • Transmit
  • Receive
  • Switch
  • Power management
  • Internet of Things (IoT)