ROHM Semiconductor SML-212U2TT86A
ROHM Semiconductor SML-212U2TT86A
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ROHM Semiconductor SML-212U2TT86A

Manufacturer No:

SML-212U2TT86A

Manufacturer:

ROHM Semiconductor

Utmel No:

2078-SML-212U2TT86A

Package:

0805 (2012 Metric)

Datasheet:

SML-210 Series

ECAD Model:

Description:

LED RED CLEAR 0805 SMD

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
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SML-212U2TT86A information

Specifications
Documents & Media
Product Comparison
ROHM Semiconductor SML-212U2TT86A technical specifications, attributes, parameters and parts with similar specifications to ROHM Semiconductor SML-212U2TT86A.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    0805 (2012 Metric)
  • Number of Pins
    2
  • Wavelength-dominant
    615nm
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Published
    2003
  • Size / Dimension

    In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

    2.00mm Lx1.25mm W
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e4
  • Pbfree Code

    The "Pbfree Code" parameter in electronic components refers to the code or marking used to indicate that the component is lead-free. Lead (Pb) is a toxic substance that has been widely used in electronic components for many years, but due to environmental concerns, there has been a shift towards lead-free alternatives. The Pbfree Code helps manufacturers and users easily identify components that do not contain lead, ensuring compliance with regulations and promoting environmentally friendly practices. It is important to pay attention to the Pbfree Code when selecting electronic components to ensure they meet the necessary requirements for lead-free applications.

    yes
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Not For New Designs
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    2 (1 Year)
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Gold (Au) - with Nickel (Ni) barrier
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    100°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40°C
  • Color
    Red
  • Base Part Number

    The "Base Part Number" (BPN) in electronic components serves a similar purpose to the "Base Product Number." It refers to the primary identifier for a component that captures the essential characteristics shared by a group of similar components. The BPN provides a fundamental way to reference a family or series of components without specifying all the variations and specific details.

    SML-212
  • Case Code (Metric)

    Case Code (Metric) in electronic components refers to a standardized system that specifies the dimensions of surface-mount devices (SMD) in millimeters, consisting of a four-digit number where the first two digits represent the width and the last two digits represent the height of the component, measured in tenths of a millimeter. The metric case codes are standardized by organizations such as the EIA and IEC, and are often compared to the Imperial code which uses inches, allowing for easier identification and selection of components across different regions and industries. This coding system is widely used in the design and manufacturing of electronic devices, particularly in applications requiring compact and efficient component layouts, and is essential for engineers and designers to ensure proper component selection and facilitate the assembly process in electronic manufacturing.

    2012
  • Case Code (Imperial)

    The term "Case Code (Imperial)" in electronic components refers to a standardized system used to specify the physical dimensions and package types of components, particularly capacitors and resistors. This code helps manufacturers and engineers identify the size and form factor of the component, ensuring compatibility with circuit designs and PCB layouts. In the context of electronic components, the Case Code (Imperial) typically follows a numerical format that indicates the length and width of the component in inches. For example, a Case Code of 1206 signifies a component that measures 0.12 inches by 0.06 inches. This coding system is essential for selecting the correct components for specific applications, as it provides a quick reference to the physical characteristics of the part, including its footprint and mounting style.

    0805
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    Standard
  • Voltage - Forward (Vf) (Typ)

    The parameter "Voltage - Forward (Vf) (Typ)" in electronic components refers to the typical forward voltage drop across the component when it is conducting current in the forward direction. It is a crucial characteristic of components like diodes and LEDs, indicating the minimum voltage required for the component to start conducting current. The forward voltage drop is typically specified as a typical value because it can vary slightly based on factors such as temperature and manufacturing tolerances. Designers use this parameter to ensure that the component operates within its specified voltage range and to calculate power dissipation in the component.

    2V
  • Viewing Angle

    the angle at which a display can be viewed with acceptable visual performance.

    140 °
  • Forward Current

    Current which flows upon application of forward voltage.

    20mA
  • Lens Style

    In the context of electronic components, the parameter "Lens Style" typically refers to the design or shape of the lens used in optical components such as LEDs, photodiodes, or sensors. The lens style can affect the light output, beam angle, and overall performance of the component. Common lens styles include flat top, dome, narrow beam, wide beam, and diffused lenses. Choosing the appropriate lens style is important for achieving the desired light distribution and optical characteristics in electronic devices. Manufacturers often provide specifications on the lens style to help users select the most suitable component for their application.

    Rectangle with Flat Top
  • Lens Size

    In electronic components, the parameter "Lens Size" typically refers to the physical size of the lens used in optical components such as cameras, sensors, or optical devices. The lens size is an important specification as it determines the field of view, focal length, and light-gathering capabilities of the optical system. A larger lens size generally allows for more light to enter the system, resulting in better image quality and improved performance in low-light conditions. Manufacturers often provide the lens size in millimeters, indicating the diameter of the lens element. It is important to consider the lens size when selecting optical components to ensure they meet the requirements of the intended application.

    1.40mmx1.25mm
  • Luminous Intensity

    In photometry, luminous intensity is a measure of the wavelength-weighted power emitted by a light source in a particular direction per unit solid angle, based on the luminosity function, a standardized model of the sensitivity of the human eye.

    140 mcd
  • Millicandela Rating

    The Millicandela Rating is a measurement unit used to quantify the luminous intensity of a light-emitting diode (LED) or other light sources. It indicates how bright the light emitted by the component will be in a specific direction. The Millicandela Rating is typically expressed in millicandelas (mcd), with higher values indicating a brighter light output. This parameter is important for determining the visibility and brightness of LEDs in various applications, such as displays, indicators, and lighting systems. Manufacturers provide Millicandela Ratings to help users select the appropriate components for their specific lighting needs.

    140mcd
  • Lens Transparency

    Lens Transparency in electronic components refers to the ability of a lens to allow light to pass through it without significant absorption or scattering. It is a measure of how much light is transmitted through the lens material, impacting the performance of optical devices such as sensors and cameras. High lens transparency is crucial for ensuring clear images and accurate data capture in various applications.

    Clear
  • Lens Color

    affect how much visible light reaches people's eyes, how well people see other colors and how well they see contrasts.

    Colorless
  • Number of LEDs
    1
  • Reverse Voltage-Max

    Reverse Voltage-Max is a parameter in electronic components that specifies the maximum voltage that can be applied in the reverse direction across the component without causing damage. This parameter is particularly important for components like diodes and transistors, which are designed to allow current flow in one direction only. Exceeding the Reverse Voltage-Max can lead to the breakdown of the component and potentially cause a short circuit or permanent damage. It is crucial to carefully consider this parameter when designing circuits to ensure the reliable operation and longevity of the electronic components.

    5V
  • Height
    800μm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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