ROHM Semiconductor SML-D22MUWT86

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

In electronic components, the parameter "Shape" refers to the physical form or outline of the component. It describes the external appearance of the component, including its dimensions, size, and overall structure. The shape of an electronic component can vary widely depending on its function and design requirements. Common shapes include rectangular, cylindrical, square, and circular, among others. The shape of a component is an important consideration in the design and layout of electronic circuits, as it can impact factors such as space utilization, heat dissipation, and ease of assembly.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

The packing method in electronic components refers to the technique used to package and protect the component during shipping and handling. It encompasses various forms including tape and reel, tray, tube, or bulk packaging, each suited for different types of components and manufacturing processes. The choice of packing method can affect the ease of handling, storage, and the efficiency of assembly in automated processes. Additionally, it plays a crucial role in ensuring the reliability and integrity of the components until they are used in electronic devices.

The center distance from one pole to the next.

The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

The parameter "Voltage - Forward (Vf) (Typ)" in electronic components refers to the typical forward voltage drop across the component when it is conducting current in the forward direction. It is a crucial characteristic of components like diodes and LEDs, indicating the minimum voltage required for the component to start conducting current. The forward voltage drop is typically specified as a typical value because it can vary slightly based on factors such as temperature and manufacturing tolerances. Designers use this parameter to ensure that the component operates within its specified voltage range and to calculate power dissipation in the component.

Optoelectronic Device Type refers to the classification of electronic components that can both detect and emit light. These devices convert electrical signals into light or vice versa, making them essential for applications such as optical communication, sensing, and display technologies. Common types of optoelectronic devices include light-emitting diodes (LEDs), photodiodes, phototransistors, and laser diodes. Understanding the optoelectronic device type is crucial for selecting the appropriate component for a specific application based on factors such as wavelength, power output, and sensitivity.

Current - Test is a parameter in electronic components that refers to the maximum current that the component can handle during testing without being damaged. This parameter is crucial for determining the operational limits of the component and ensuring its reliability under specified conditions. It is typically specified in the component's datasheet and is important for designers and engineers to consider when designing circuits to prevent overloading the component. Testing the component at or below the specified "Current - Test" value helps ensure its proper functioning and longevity in the intended application.

In the context of electronic components, the parameter "Lens Style" typically refers to the design or shape of the lens used in optical components such as LEDs, photodiodes, or sensors. The lens style can affect the light output, beam angle, and overall performance of the component. Common lens styles include flat top, dome, narrow beam, wide beam, and diffused lenses. Choosing the appropriate lens style is important for achieving the desired light distribution and optical characteristics in electronic devices. Manufacturers often provide specifications on the lens style to help users select the most suitable component for their application.

In electronic components, the parameter "Lens Size" typically refers to the physical size of the lens used in optical components such as cameras, sensors, or optical devices. The lens size is an important specification as it determines the field of view, focal length, and light-gathering capabilities of the optical system. A larger lens size generally allows for more light to enter the system, resulting in better image quality and improved performance in low-light conditions. Manufacturers often provide the lens size in millimeters, indicating the diameter of the lens element. It is important to consider the lens size when selecting optical components to ensure they meet the requirements of the intended application.

In photometry, luminous intensity is a measure of the wavelength-weighted power emitted by a light source in a particular direction per unit solid angle, based on the luminosity function, a standardized model of the sensitivity of the human eye.

The Millicandela Rating is a measurement unit used to quantify the luminous intensity of a light-emitting diode (LED) or other light sources. It indicates how bright the light emitted by the component will be in a specific direction. The Millicandela Rating is typically expressed in millicandelas (mcd), with higher values indicating a brighter light output. This parameter is important for determining the visibility and brightness of LEDs in various applications, such as displays, indicators, and lighting systems. Manufacturers provide Millicandela Ratings to help users select the appropriate components for their specific lighting needs.

affect how much visible light reaches people's eyes, how well people see other colors and how well they see contrasts.

Forward Current-Max is a parameter used to specify the maximum amount of current that an electronic component, such as a diode or LED, can safely handle when it is forward-biased. This parameter is crucial for determining the operating limits of the component to prevent damage or failure due to excessive current flow. Exceeding the specified Forward Current-Max can lead to overheating, degradation of the component, or even permanent damage. It is important to carefully consider this parameter when designing circuits to ensure the component operates within its safe limits.

Overall Height is a parameter that refers to the total vertical measurement of an electronic component, typically measured from the bottom of the component to the highest point on top. It is an important specification to consider when designing or selecting components for a project, as it determines the amount of space the component will occupy within a circuit or device. Understanding the overall height of electronic components is crucial for ensuring proper fit and clearance within the overall system design. Manufacturers provide this information in datasheets to help engineers and designers make informed decisions during the product development process.

Height (Max) in electronic components refers to the maximum vertical dimension of a component that can be accommodated in a particular space or within a system. This parameter is critical for ensuring that components fit within designated enclosures, circuit boards, or assemblies without interference. It provides manufacturers and designers with essential information for proper layout and cooling considerations, influencing both mechanical and thermal management in electronic designs.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.