Samsung Semiconductor, Inc. SPMWH1228MD7WNUYVK

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

Thermal resistance of a package in electronic components refers to the ability of a package to dissipate heat generated by the component. It is quantified as the temperature rise of the package per unit of power dissipated, typically expressed in degrees Celsius per watt. A lower thermal resistance value indicates better heat dissipation capabilities, ensuring the component operates within safe temperature limits. This parameter is critical for maintaining performance, reliability, and longevity of electronic devices by preventing overheating.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

In electronic components, the parameter "Size / Dimension" refers to the physical dimensions of the component, such as its length, width, and height. These dimensions are crucial for determining how the component will fit into a circuit or system, as well as for ensuring compatibility with other components and the overall design requirements. The size of a component can also impact its performance characteristics, thermal properties, and overall functionality within a given application. Engineers and designers must carefully consider the size and dimensions of electronic components to ensure proper integration and functionality within their designs.

The parameter "Voltage - Forward (Vf) (Typ)" in electronic components refers to the typical forward voltage drop across the component when it is conducting current in the forward direction. It is a crucial characteristic of components like diodes and LEDs, indicating the minimum voltage required for the component to start conducting current. The forward voltage drop is typically specified as a typical value because it can vary slightly based on factors such as temperature and manufacturing tolerances. Designers use this parameter to ensure that the component operates within its specified voltage range and to calculate power dissipation in the component.

the angle at which a display can be viewed with acceptable visual performance.

Current - Test is a parameter in electronic components that refers to the maximum current that the component can handle during testing without being damaged. This parameter is crucial for determining the operational limits of the component and ensuring its reliability under specified conditions. It is typically specified in the component's datasheet and is important for designers and engineers to consider when designing circuits to prevent overloading the component. Testing the component at or below the specified "Current - Test" value helps ensure its proper functioning and longevity in the intended application.

Lumens/Watt @ Current - Test is a measurement used to evaluate the efficiency of light-emitting components, such as LEDs, under specific test conditions. It indicates the amount of luminous flux produced (in lumens) for every watt of electrical power consumed by the device at a given current level. This metric helps in assessing the brightness and energy efficiency of lighting solutions, allowing for better comparisons between different products and technologies. Higher values signify more efficient light sources that produce more light for less energy consumed.

The Color Rendering Index (CRI) is a measurement of how accurately a light source can render colors compared to natural light. It is a scale from 0 to 100, with higher values indicating better color rendering. A CRI value of 100 means the light source can accurately reproduce all colors. A high CRI is important in applications where color accuracy is crucial, such as in photography, art galleries, and retail settings. It helps ensure that colors appear true and vibrant under the light source.

The parameter "Current - Max" in electronic components refers to the maximum amount of electrical current that a component can safely handle without risking damage or degradation. Exceeding this current can lead to overheating, reduced performance, or failure of the component. This specification is crucial for ensuring reliable operation and longevity of electronic circuits and devices. It is typically specified in amperes (A) and is a key factor in circuit design and component selection.

Flux at 25°C, Current - Test refers to the amount of electrical current that flows through a material or component when tested under specified conditions at a temperature of 25 degrees Celsius. It indicates the performance and reliability of the electronic component under normal operating conditions. This parameter is crucial for evaluating the heat dissipation and efficiency of the component in various electronic applications.

The parameter "Flux @ 85°C, Current - Test" in electronic components refers to the measurement of the flow of electric current through a circuit or component when subjected to an elevated temperature of 85 degrees Celsius. It is often used to assess the performance and reliability of electronic materials and soldering processes under thermal stress. This parameter is critical for ensuring that components will function correctly in high-temperature environments, providing insights into their durability and operational effectiveness.

Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.