

Sensata Technologies L613
Manufacturer No:
L613
Tiny WHSLManufacturer:
Utmel No:
2172-L613
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L613 datasheet pdf and Unclassified product details from Sensata Technologies stock available at Utmel
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- TypeParameter
- Surface Mount
having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.
NO - Number of Terminals6
- Package DescriptionIN-LINE, R-PDIP-T6
- Package StyleIN-LINE
- Package Body MaterialPLASTIC/EPOXY
- Operating Temperature-Min-40 °C
- Operating Temperature-Max125 °C
- Rohs CodeYes
- Manufacturer Part NumberL613
- Package ShapeRECTANGULAR
- ManufacturerCynergy3 Components
- Number of Elements2
- Part Life Cycle CodeObsolete
- Ihs ManufacturerCYNERGY3 COMPONENTS LTD
- Risk Rank5.21
- Part Package CodeMODULE
- ECCN Code
An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.
EAR99 - Additional Feature
Any Feature, including a modified Existing Feature, that is not an Existing Feature.
UL RECOGNIZED - HTS Code
HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.
8541.30.00.80 - SubcategorySilicon Controlled Rectifiers
- Terminal Position
In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.
DUAL - Terminal Form
Occurring at or forming the end of a series, succession, or the like; closing; concluding.
THROUGH-HOLE - Peak Reflow Temperature (Cel)
Peak Reflow Temperature (Cel) is a parameter that specifies the maximum temperature at which an electronic component can be exposed during the reflow soldering process. Reflow soldering is a common method used to attach electronic components to a circuit board. The Peak Reflow Temperature is crucial because it ensures that the component is not damaged or degraded during the soldering process. Exceeding the specified Peak Reflow Temperature can lead to issues such as component failure, reduced performance, or even permanent damage to the component. It is important for manufacturers and assemblers to adhere to the recommended Peak Reflow Temperature to ensure the reliability and functionality of the electronic components.
NOT SPECIFIED - Reach Compliance Code
Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.
unknown - Time@Peak Reflow Temperature-Max (s)
Time@Peak Reflow Temperature-Max (s) refers to the maximum duration that an electronic component can be exposed to the peak reflow temperature during the soldering process, which is crucial for ensuring reliable solder joint formation without damaging the component.
NOT SPECIFIED - Pin Count
a count of all of the component leads (or pins)
6 - JESD-30 Code
JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.
R-PDIP-T6 - Qualification Status
An indicator of formal certification of qualifications.
Not Qualified - Configuration
The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.
BRIDGE, HALF-CONTROLLED, COMMON CATHODE WITH BUILT-IN DIODE - Case Connection
Case Connection refers to the method by which an electronic component's case or housing is connected to the electrical circuit. This connection is important for grounding purposes, mechanical stability, and heat dissipation. The case connection can vary depending on the type of component and its intended application. It is crucial to ensure a secure and reliable case connection to maintain the overall performance and safety of the electronic device.
ISOLATED - Trigger Device Type
Trigger Device Type is a parameter in electronic components that refers to the type of device or mechanism used to initiate a specific action or function within the component. This parameter specifies the specific trigger device, such as a sensor, switch, or signal input, that is required to activate or control the operation of the component. Understanding the trigger device type is crucial for proper integration and operation of the electronic component within a larger system or circuit. By specifying the appropriate trigger device type, engineers and designers can ensure that the component functions correctly and responds to the intended input signals or conditions.
SCR - Non-Repetitive Pk On-state Cur
Non-Repetitive Pk On-state Current, often abbreviated as Non-Repetitive Pk On-state Cur, is a parameter that defines the maximum current that a semiconductor device, such as a thyristor or triac, can withstand for a short duration without sustaining damage. This current level is typically specified under particular conditions and is meant to represent transient events rather than continuous operation. It indicates the device's ability to handle sudden surges in current, which may occur due to load changes or fault conditions, while ensuring that the component does not suffer thermal or electrical breakdown during this brief period.
600 A - Repetitive Peak Reverse Voltage
The Repetitive Peak Reverse Voltage (VRRM) is a key parameter in electronic components, particularly in diodes and rectifiers. It refers to the maximum reverse voltage that a component can withstand in repetitive peak reverse polarity conditions without breaking down. This parameter is crucial for ensuring the reliable operation and longevity of the component in circuits where reverse voltage may be present intermittently or periodically. It is important to select a component with a VRRM rating higher than the maximum reverse voltage expected in the circuit to prevent damage or failure.
800 V - DC Gate Trigger Current-Max
The parameter "DC Gate Trigger Current-Max" refers to the maximum current required to trigger the gate of a semiconductor device, such as a thyristor or a triac. This parameter specifies the maximum current that must be applied to the gate terminal to turn on the device reliably. Exceeding this maximum current may result in improper operation or damage to the component. It is an important parameter to consider when designing circuits that involve triggering these semiconductor devices, as it ensures proper functionality and reliability of the component.
80 mA - Desc. of Screw Terminals
The parameter "Desc. of Screw Terminals" in electronic components refers to the description of the screw terminals used for connecting wires or cables to the component. Screw terminals are commonly found in electronic devices and provide a secure and reliable way to make electrical connections. The description may include details such as the type of screw terminal (e.g., terminal block, barrier strip), the material used (e.g., brass, steel), the size of the terminal, and any specific features or specifications related to the screw terminals. Understanding the description of screw terminals is important for proper installation and connection of the electronic component in a circuit or system.
0 - Desc. of Quick-Connects
The parameter "Desc. of Quick-Connects" in electronic components refers to the description or information provided about the quick-connect terminals or connectors used in the component. Quick-connects are a type of electrical connector that allows for fast and easy connection and disconnection of wires or cables without the need for tools. The description may include details such as the type of quick-connect terminal used, its size, shape, material, and any specific features or specifications related to its use. Understanding this parameter can help users select the appropriate components and ensure proper connections in electronic circuits or systems.
2G-2AK-CA-CK - DC Gate Trigger Voltage-Max
The parameter "DC Gate Trigger Voltage-Max" refers to the maximum voltage required to trigger the gate of a semiconductor device, such as a thyristor or a triac. This voltage level is crucial for initiating the conduction state of the device, allowing current to flow through it. Exceeding this maximum voltage can lead to unintended triggering or damage to the component. Manufacturers specify this parameter to ensure proper operation and reliability of the device in various applications. Designers and engineers need to consider this specification when selecting and using these components in their circuits to prevent malfunctions and ensure optimal performance.
3 V