Sharp Microelectronics PC2SD11NXPAF
Sharp Microelectronics PC2SD11NXPAF
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Sharp Microelectronics PC2SD11NXPAF

Manufacturer No:

PC2SD11NXPAF

Utmel No:

2201-PC2SD11NXPAF

Package:

SMD/SMT

ECAD Model:

Description:

OPTOISOLATOR 5KV TRIAC 6SMD

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
PC2SD11NXPAF information

Specifications
Documents & Media
Product Comparison
Sharp Microelectronics PC2SD11NXPAF technical specifications, attributes, parameters and parts with similar specifications to Sharp Microelectronics PC2SD11NXPAF.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    SMD/SMT
  • Number of Pins
    6
  • Number of Elements
    1
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape (CT)
  • Published
    2004
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Discontinued
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    100°C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -30°C
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    UL RECOGNIZED
  • Output Voltage

    Output voltage is a crucial parameter in electronic components that refers to the voltage level produced by the component as a result of its operation. It represents the electrical potential difference between the output terminal of the component and a reference point, typically ground. The output voltage is a key factor in determining the performance and functionality of the component, as it dictates the level of voltage that will be delivered to the connected circuit or load. It is often specified in datasheets and technical specifications to ensure compatibility and proper functioning within a given system.

    400V
  • Max Output Current

    The maximum current that can be supplied to the load.

    100mA
  • Configuration

    The parameter "Configuration" in electronic components refers to the specific arrangement or setup of the components within a circuit or system. It encompasses how individual elements are interconnected and their physical layout. Configuration can affect the functionality, performance, and efficiency of the electronic system, and may influence factors such as signal flow, impedance, and power distribution. Understanding the configuration is essential for design, troubleshooting, and optimizing electronic devices.

    SINGLE
  • Output Current

    The rated output current is the maximum load current that a power supply can provide at a specified ambient temperature. A power supply can never provide more current that it's rated output current unless there is a fault, such as short circuit at the load.

    100mA
  • Turn On Delay Time

    Turn-on delay, td(on), is the time taken to charge the input capacitance of the device before drain current conduction can start.

    100 μs
  • Optoelectronic Device Type

    Optoelectronic Device Type refers to the classification of electronic components that can both detect and emit light. These devices convert electrical signals into light or vice versa, making them essential for applications such as optical communication, sensing, and display technologies. Common types of optoelectronic devices include light-emitting diodes (LEDs), photodiodes, phototransistors, and laser diodes. Understanding the optoelectronic device type is crucial for selecting the appropriate component for a specific application based on factors such as wavelength, power output, and sensitivity.

    TRIAC OUTPUT OPTOCOUPLER
  • Forward Current

    Current which flows upon application of forward voltage.

    50mA
  • Max Input Voltage

    Max Input Voltage refers to the maximum voltage level that an electronic component can safely handle without getting damaged. This parameter is crucial for ensuring the proper functioning and longevity of the component. Exceeding the specified maximum input voltage can lead to overheating, electrical breakdown, or permanent damage to the component. It is important to carefully adhere to the manufacturer's guidelines regarding the maximum input voltage to prevent any potential issues and maintain the reliability of the electronic device.

    1.4V
  • Output Current per Channel

    Output Current per Channel is a specification commonly found in electronic components such as amplifiers, audio interfaces, and power supplies. It refers to the maximum amount of electrical current that can be delivered by each individual output channel of the component. This parameter is important because it determines the capacity of the component to drive connected devices or loads. A higher output current per channel means the component can deliver more power to connected devices, while a lower output current may limit the performance or functionality of the component in certain applications. It is crucial to consider the output current per channel when selecting electronic components to ensure they can meet the power requirements of the intended system or setup.

    100mA
  • Forward Voltage

    the amount of voltage needed to get current to flow across a diode.

    1.2V
  • Nominal Input Voltage

    The actual voltage at which a circuit operates can vary from the nominal voltage within a range that permits satisfactory operation of equipment. The word “nominal” means “named”.

    1.2V
  • Reverse Breakdown Voltage

    Reverse Breakdown Voltage is the maximum reverse voltage a semiconductor device can withstand before it starts to conduct heavily in the reverse direction. It is a critical parameter in diodes and other components, indicating the threshold at which the material's insulating properties fail. Beyond this voltage, the device may enter a breakdown region, leading to potential damage if not properly managed. This parameter is essential for ensuring safe operation and reliability in electronic circuits.

    6V
  • Hold Current

    the minimum current which must pass through a circuit in order for it to remain in the 'ON' state.

    100μA
  • Isolation Voltage

    Isolation voltage refers to a test of the ability of an insulator to minimize the flow of electric current with a high applied voltage.

    5V
  • Input Trigger Current-Nom

    The parameter "Input Trigger Current-Nom" in electronic components refers to the nominal current level required to trigger a specific function or operation within the component. This parameter is crucial for determining the threshold at which the component will respond to an input signal or command. It helps in ensuring that the component functions reliably and consistently within its specified operating conditions. Understanding the Input Trigger Current-Nom is essential for designing circuits and systems that rely on precise triggering mechanisms for proper operation.

    10mA
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    Non-RoHS Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
0 Similar Products Remaining
Download datasheets and manufacturer documentation for Sharp Microelectronics PC2SD11NXPAF.
The three parts on the right have similar specifications to Sharp Microelectronics & PC2SD11NXPAF.
  • Image
    Part Number
    Manufacturer
    Package / Case
    Number of Pins
    Isolation Voltage
    Output Voltage
    Output Current
    Max Output Current
    Forward Voltage
    Forward Current
    Availability
    Price
    Quantity
    Compare Two Parts
    Compare Three Parts
  • MOC3022S

    MOC3022S

    SMD/SMT

    6

    5 V

    400 V

    100 mA

    100 mA

    1.2 V

    50 mA

    0
    -