Silicon Labs EFR32BG22C224F512IM32-C
Silicon Labs EFR32BG22C224F512IM32-C
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Silicon Labs EFR32BG22C224F512IM32-C

Manufacturer No:

EFR32BG22C224F512IM32-C

Manufacturer:

Silicon Labs

Utmel No:

2258-EFR32BG22C224F512IM32-C

Package:

32-VFQFN Exposed Pad

ECAD Model:

Description:

TxRx + MCU 2.4GHz ~ 2.4835GHz 1.71V ~ 3.8V ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART 2Mbps 3.6mA ~ 4.5mA - Receiving 4.1mA ~ 8.5mA - Transmitting 2FSK, DSSS, GFSK, GMSK, MSK, OQPSK 512kB Flash, 32kB RAM 18 32-VFQFN Exposed Pad

Quantity:

Unit Price: $4.876398

Ext Price: $4.88

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In Stock : 875

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $4.876398

    $4.88

  • 10

    $4.600375

    $46.00

  • 100

    $4.339977

    $434.00

  • 500

    $4.094318

    $2,047.16

  • 1000

    $3.862564

    $3,862.56

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  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
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EFR32BG22C224F512IM32-C information

Specifications
Product Details
Silicon Labs EFR32BG22C224F512IM32-C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs EFR32BG22C224F512IM32-C.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    32-VFQFN Exposed Pad
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    32-QFN (4x4)
  • Mfr
    Silicon Labs
  • Package
    Tube
  • Product Status
    Active
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    EFR32BG22C224
  • Operating Temperature (Max.)
    125C
  • Package Type
    QFN EP
  • Operating Supply Voltage (Max)
    3.8(V)
  • Operating Supply Voltage (Typ)
    3(V)
  • Rad Hardened
    No
  • Operating Supply Voltage (Min)
    1.71(V)
  • Operating Temperature (Min.)
    -40C
  • Mounting
    Surface Mount
  • MSL
    MSL 2 - 1 year
  • Qualification
    -
  • Family Name
    EFR32BG22 Wireless Gecko SoC
  • Moisture Sensitive
    Yes
  • Maximum Clock Frequency
    76.8 MHz
  • Number of I/Os
    18 I/O
  • Maximum Data Rate
    2 Mbps
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 125 C
  • Supply Voltage-Max
    3.8 V
  • Unit Weight
    0.097003 oz
  • Minimum Operating Temperature
    - 40 C
  • Factory Pack QuantityFactory Pack Quantity
    490
  • Supply Voltage-Min
    1.71 V
  • Mounting Styles
    SMD/SMT
  • Supply Current Transmitting
    8.2 mA
  • Interface Type
    EUART, I2C, PDM, USART
  • Supply Current Receiving
    3.6 mA
  • Manufacturer
    Silicon Laboratories
  • Brand
    Silicon Labs
  • Data RAM Type
    RAM
  • RoHS
    Details
  • Data RAM Size
    32 kB
  • Risk Rank
    2
  • Ihs Manufacturer
    SILICON LABORATORIES INC
  • Part Life Cycle Code
    Active
  • Manufacturer Part Number
    EFR32BG22C224F512IM32-C
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 125°C (TA)
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tray
  • Type
    TxRx + MCU
  • Subcategory
    Wireless & RF Integrated Circuits
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    Si
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.71V ~ 3.8V
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    2.4GHz ~ 2.4835GHz
  • Pin Count

    a count of all of the component leads (or pins)

    32
  • Operating Frequency

    Operating frequency is the frequency at which the communications are being made with the total bandwidth occupied by the carrier signal with modulation. Usually bandwidth of the antenna will be wider than the bandwidth of the signal so that more than one center frequency the antenna can be put in to effective use.

    2.4 GHz
  • Interface

    In electronic components, the term "Interface" refers to the point at which two different systems, devices, or components connect and interact with each other. It can involve physical connections such as ports, connectors, or cables, as well as communication protocols and standards that facilitate the exchange of data or signals between the connected entities. The interface serves as a bridge that enables seamless communication and interoperability between different parts of a system or between different systems altogether. Designing a reliable and efficient interface is crucial in ensuring proper functionality and performance of electronic components and systems.

    EUART, I2C, PDM, USART
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    512kB Flash, 32kB RAM
  • Program Memory Type

    Program memory typically refers to flash memory when it is used to hold the program (instructions). Program memory may also refer to a hard drive or solid state drive (SSD). Contrast with data memory.

    Flash
  • Program Memory Size

    Program Memory Size refers to the amount of memory available in an electronic component, such as a microcontroller or microprocessor, that is used to store program instructions. This memory is non-volatile, meaning that the data stored in it is retained even when the power is turned off. The program memory size determines the maximum amount of code that can be stored and executed by the electronic component. It is an important parameter to consider when selecting a component for a specific application, as insufficient program memory size may limit the functionality or performance of the device.

    512KB
  • Output Power

    That power available at a specified output of a device under specified conditions of operation.

    6 dBm
  • Data Bus Width

    The data bus width in electronic components refers to the number of bits that can be transferred simultaneously between the processor and memory. It determines the amount of data that can be processed and transferred in a single operation. A wider data bus allows for faster data transfer speeds and improved overall performance of the electronic device. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with higher numbers indicating a larger capacity for data transfer. The data bus width is an important specification to consider when evaluating the speed and efficiency of a computer system or other electronic device.

    32bit
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    RF System on a Chip - SoC
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    Bluetooth v5.2
  • Telecom IC Type

    Telecom IC Type refers to integrated circuits specifically designed for telecommunications applications. These components facilitate various functions such as signal processing, data modulation and demodulation, and communication protocol handling. They can be used in devices like mobile phones, modems, and network equipment, ensuring reliable data transmission and reception. Telecom ICs support different standards and technologies, making them essential for modern communication systems.

    TELECOM CIRCUIT
  • Power - Output

    Power Output in electronic components refers to the amount of electrical power that a device can deliver to a load. It is typically measured in watts and indicates the effectiveness of the component in converting electrical energy into usable work or signal. Power Output can vary based on the component's design, operating conditions, and intended application, making it a critical factor in the performance of amplifiers, power supplies, and other electronic devices. Understanding the Power Output helps in selecting appropriate components for specific applications to ensure efficiency and reliability.

    6dBm
  • RF Family/Standard

    The parameter "RF Family/Standard" in electronic components refers to the specific radio frequency (RF) technology or standard that the component complies with or is designed for. RF technology encompasses a wide range of frequencies used for wireless communication, such as Wi-Fi, Bluetooth, cellular networks, and more. Different RF standards dictate the frequency bands, modulation techniques, data rates, and other specifications for communication systems. Understanding the RF family/standard of a component is crucial for ensuring compatibility and optimal performance in RF applications.

    Bluetooth
  • Sensitivity

    Sensitivity in electronic components refers to the degree to which the output of a device responds to changes in input. It indicates how effectively a component translates a specific input signal into an observable output. High sensitivity means that even small variations in input can produce significant changes in output, making the device more responsive to signals. Sensitivity is crucial in applications where precise measurements or signal detection are required.

    -106.7dBm
  • Data Rate (Max)

    Data Rate (Max) refers to the maximum rate at which data can be transferred or processed within an electronic component or device. It is typically measured in bits per second (bps) or megabits per second (Mbps). This parameter is important for determining the speed and efficiency of data transmission or processing in various electronic applications such as computer systems, networking devices, and memory modules. A higher data rate indicates that the component is capable of handling larger volumes of data at a faster pace, leading to improved performance and responsiveness in electronic systems. It is crucial to consider the Data Rate (Max) specification when selecting electronic components to ensure compatibility and optimal functionality for specific applications.

    2Mbps
  • Serial Interfaces

    A serial interface is a communication interface between two digital systems that transmits data as a series of voltage pulses down a wire. Essentially, the serial interface encodes the bits of a binary number by their "temporal" location on a wire rather than their "spatial" location within a set of wires.

    ADC, I2C, I2S, PWM, SPI, IrDA, UART, USART
  • Current - Receiving

    Current - Receiving refers to the amount of electrical current that an electronic component or device is capable of accepting from a power source or another component in a circuit. It indicates the maximum current that can be safely received without causing damage or malfunction. This parameter is crucial for ensuring compatibility and reliability in electronic designs, as exceeding the rated receiving current can lead to overheating or failure of the component.

    3.6mA ~ 4.5mA
  • Current - Transmitting

    Current - Transmitting is a parameter used to describe the maximum amount of electrical current that an electronic component can handle while in the transmitting mode. This parameter is crucial for components such as transistors, diodes, and integrated circuits that are involved in transmitting signals or power within a circuit. Exceeding the specified current transmitting rating can lead to overheating, component failure, or even damage to the entire circuit. Designers and engineers must carefully consider this parameter when selecting components to ensure the reliability and performance of the electronic system.

    4.1mA ~ 8.5mA
  • Number of Timers
    4 x 16 bit, 1 x 32 bit
  • Modulation

    In electronic components, modulation refers to the process of varying one or more properties of a periodic waveform, known as the carrier signal, in order to encode information. This modulation technique is commonly used in communication systems to transmit data efficiently over long distances. By modulating the carrier signal, information such as audio, video, or data can be embedded onto the signal for transmission and then demodulated at the receiving end to retrieve the original information. There are various types of modulation techniques, including amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM), each with its own advantages and applications in different communication systems.

    2FSK, DSSS, GFSK, GMSK, MSK, OQPSK
  • GPIO

    GPIO stands for General Purpose Input/Output. It is a type of electronic pin found on microcontrollers, microprocessors, and other integrated circuits that can be configured to either input or output digital signals. GPIO pins can be used to connect and communicate with external devices such as sensors, LEDs, motors, and more. They provide a flexible way to interact with the physical world by allowing the device to both receive and send digital signals. GPIO pins can be programmed and controlled by software to perform various functions based on the specific requirements of the electronic system.

    18
  • Product Category

    a particular group of related products.

    RF System on a Chip - SoC
  • Device Core

    Used in casting and moulding processes to produce internal cavities and reentrant angles (an interior angle that is greater than 18°).

    ARM Cortex-M33F
  • Width
    4 mm
  • Height
    0.85 mm
  • Length
    4 mm
0 Similar Products Remaining

EFR32BG22C224F512IM32-C Overview

There is a 32-VFQFN Exposed Pad package on the board that RF transceiver IC is used to save space. RF transceiver's mounting is done according to the Surface Mount method.With transceiver RF's high efficiency and reliable performance, it emerges as a TxRx + MCU.A high level of reliability is provided by using an advanced transceiver RF' packaging Tray.In the 2.4GHz ~ 2.4835GHz frequency range, RF transceiver operates .

EFR32BG22C224F512IM32-C Features

32-VFQFN Exposed Pad package
Surface Mount for mounting
TxRx + MCU
Tray is used

EFR32BG22C224F512IM32-C Applications

There are a lot of Silicon Labs
EFR32BG22C224F512IM32-C RF Transceiver ICs applications.


  • Security Systems
  • M2M Communication
  • Remote Device Management
  • Low-power IoT applications
  • LoT applications
  • Power Amplifier (PA)
  • Low Noise Amplifier (LNA)
  • Transmit
  • Receive
  • Switch
EFR32BG22C224F512IM32-C Relevant information