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refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

An ECCN (Export Control Classification Number) is an alphanumeric code used by the U.S. Bureau of Industry and Security to identify and categorize electronic components and other dual-use items that may require an export license based on their technical characteristics and potential for military use.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

Any Feature, including a modified Existing Feature, that is not an Existing Feature.

Construction in electronic components refers to the design and materials used in the manufacturing of the components. It encompasses the physical structure, arrangement, and integration of various parts like substrates, conductors, and insulators. The construction impacts the performance, reliability, and thermal properties of the component, influencing how it interacts with electrical signals and other components in a circuit. Different construction techniques can also affect the size, weight, and cost of the electronic component.

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

The parameter "Min Input Voltage" in electronic components refers to the minimum voltage level that must be applied to the component for it to operate within its specified parameters. This value is crucial as providing a voltage below this minimum threshold may result in the component malfunctioning or not functioning at all. It is important to adhere to the specified minimum input voltage to ensure the proper operation and longevity of the electronic component. Failure to meet this requirement may lead to potential damage to the component or the overall system in which it is used.

Max Frequency refers to the highest frequency at which an electronic component can operate effectively without degradation of performance. It is a critical parameter for devices such as transistors, capacitors, and oscillators, indicating their limitations in speed and response time. Exceeding the max frequency can lead to issues like signal distortion, heat generation, and potential failure of the component. Understanding this parameter is essential for designing circuits to ensure reliable and efficient operation.

A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

The parameter "RF/Microwave Device Type" in electronic components refers to the specific type or category of devices designed to operate within the radio frequency (RF) and microwave frequency ranges. These devices are engineered to handle high-frequency signals and are commonly used in various applications such as wireless communication, radar systems, satellite communication, and more. Examples of RF/Microwave device types include amplifiers, filters, mixers, oscillators, antennas, and transceivers. Understanding the RF/Microwave device type is crucial for selecting the appropriate component that meets the requirements of a particular RF system or application.

Insertion Loss (dB) is a parameter used to measure the amount of signal loss that occurs when a component is inserted into a transmission line or circuit. It is typically expressed in decibels (dB) and represents the difference in signal power before and after the insertion of the component. A higher insertion loss value indicates greater signal attenuation or reduction in signal strength. Insertion loss is an important consideration in electronic components such as filters, amplifiers, and connectors, as it can impact the overall performance and efficiency of a system. Minimizing insertion loss is often a key design goal to ensure optimal signal integrity and transmission quality.

Input Power-Max (CW) is a parameter used to specify the maximum continuous wave power that an electronic component can handle without being damaged. This parameter is crucial in determining the power handling capability of the component under continuous wave operation. It is typically measured in watts and provides important information for designing circuits and systems to ensure that the component operates within its safe power limits. Exceeding the specified Input Power-Max (CW) can lead to overheating, degradation, or even permanent damage to the component.

Attenuation is the loss of signal strength in networking cables or connections. This typically is measured in decibels (dB) or voltage and can occur due to a variety of factors. It may cause signals to become distorted or indiscernible.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.