Skyworks Solutions Inc. SKYA21039
Skyworks Solutions Inc. SKYA21039
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Skyworks Solutions Inc. SKYA21039

Manufacturer No:

SKYA21039

Utmel No:

2293-SKYA21039

Package:

8-XFQFN Exposed Pad

ECAD Model:

Description:

802.11a/b/g/n, Bluetooth, WLAN RF Type SP3T - 2.4GHz ~ 2.5GHz Isolation:35dB Insertion Loss:0.75dB - - IIP3:46dBm 3V ~ 5V

Quantity:

Unit Price: $0.639727

Ext Price: $0.64

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 100000

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $0.639727

    $0.64

  • 10

    $0.603516

    $6.04

  • 100

    $0.569355

    $56.94

  • 500

    $0.537127

    $268.56

  • 1000

    $0.506724

    $506.72

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Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
SKYA21039 information

Specifications
Product Details
Skyworks Solutions Inc. SKYA21039 technical specifications, attributes, parameters and parts with similar specifications to Skyworks Solutions Inc. SKYA21039.
  • Type
    Parameter
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    8-XFQFN Exposed Pad
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    8-MLP (1.1x1.1)
  • Mfr
    Skyworks Solutions Inc.
  • Product Status
    Active
  • Switch Configuration
    SP3T
  • Qualification
    AEC-Q100
  • Development Kit
    SKYA21039-EVB
  • Supply Voltage-Max
    5 V
  • Factory Pack QuantityFactory Pack Quantity
    3000
  • Supply Voltage-Min
    3 V
  • Mounting Styles
    SMD/SMT
  • Off Isolation - Typ
    35 dB
  • Manufacturer
    Skyworks
  • Brand
    Skyworks Solutions, Inc.
  • RoHS
    Details
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    -
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Cut Tape
  • Subcategory
    Wireless & RF Integrated Circuits
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    Si
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    3V ~ 5V
  • Circuit

    The parameter "Circuit" in electronic components refers to the interconnected arrangement of various electronic elements such as resistors, capacitors, inductors, and active devices like transistors. It defines the path through which electric current flows and establishes the operational behavior of the components within that system. Circuits can be classified as analog or digital, depending on the type of signals they handle, and can vary in complexity from simple series or parallel configurations to intricate designs used in advanced applications.

    SP3T
  • Test Frequency

    a statistical procedure for assessing data that contain counts or the numbers of occurrences of various categories or classes.

    -
  • Impedance

    In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

    -
  • Topology

    In the context of electronic components, "topology" refers to the arrangement or configuration of the components within a circuit or system. It defines how the components are connected to each other and how signals flow between them. The choice of topology can significantly impact the performance, efficiency, and functionality of the electronic system. Common topologies include series, parallel, star, mesh, and hybrid configurations, each with its own advantages and limitations. Designers carefully select the appropriate topology based on the specific requirements of the circuit to achieve the desired performance and functionality.

    -
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    RF Switch ICs
  • Frequency Range

    A continuous range or spectrum of frequencies that extends from one limiting frequency to another.

    2.4GHz ~ 2.5GHz
  • Insertion Loss

    the loss of signal power resulting from the insertion of a device in a transmission line or optical fiber and is usually expressed in decibels (dB).

    0.75dB
  • Isolation

    Isolation in electronic components refers to the ability of a component to prevent the flow of electrical current between two points that are at different potentials. It is crucial for ensuring safety and preventing electrical hazards in electronic circuits. Isolation can be achieved through various methods such as using insulating materials, physical barriers, or optical isolation techniques. Proper isolation helps to protect sensitive components and circuits from damage due to voltage spikes, noise, or short circuits. It is particularly important in high-voltage applications and when dealing with components that are connected to different power sources.

    35dB
  • RF Type

    The rate of oscillation of electromagnetic radio waves in the range of 3 kHz to 3 GHz, as well as the alternating currents carrying the radio signals.

    802.11a/b/g/n, Bluetooth, WLAN
  • P1dB

    P1dB, or the 1-dB compression point, is a key parameter in electronic components, particularly in amplifiers and RF (radio frequency) devices. It indicates the output power level at which the gain of the device starts to decrease by 1 dB relative to the expected linear gain. At this point, the device is nearing saturation, and its ability to linearly amplify signals diminishes. Understanding P1dB is essential for designers to ensure that devices operate effectively within their linear region under typical operating conditions.

    29dBm
  • Number of Switches

    A modular network switch with three network modules (a total of 24 Ethernet and 14 Fast Ethernet ports) and one power supply.

    Single
  • IIP3

    IIP3 stands for Third-Order Intercept Point and is a measure used in the performance evaluation of linear electronic components, particularly in amplifiers and mixers. It indicates the level at which the third-order intermodulation products, generated by two input signals, will intersect the fundamental output signals in a power vs. power plot. A higher IIP3 value signifies better linearity and reduced distortion, making the device more suitable for applications where signal integrity is critical. IIP3 is an important parameter in designing communication systems to ensure that unwanted interferences do not affect the desired signals.

    46dBm
  • Features

    In the context of electronic components, the term "Features" typically refers to the specific characteristics or functionalities that a particular component offers. These features can vary depending on the type of component and its intended use. For example, a microcontroller may have features such as built-in memory, analog-to-digital converters, and communication interfaces like UART or SPI.When evaluating electronic components, understanding their features is crucial in determining whether they meet the requirements of a particular project or application. Engineers and designers often look at features such as operating voltage, speed, power consumption, and communication protocols to ensure compatibility and optimal performance.In summary, the "Features" parameter in electronic components describes the unique attributes and capabilities that differentiate one component from another, helping users make informed decisions when selecting components for their electronic designs.

    -
  • Product Category

    a particular group of related products.

    RF Switch ICs
0 Similar Products Remaining

SKYA21039 Overview

The RF Switches are designed to provide optimal performance by utilizing the Cut Tape package.- should be the operating temperature when RF Switch is operating.The RF light switch is included in the Wireless & RF Integrated Circuits subcategory of RF light switchs.Known as a RF switching, this RF switching belongs to the - family.The RF switch ic type is 802.11a/b/g/n, Bluetooth, WLAN.It is possible for the RF Switch to supply voltages of 3V ~ 5V.

SKYA21039 Features

Cut Tape package
Wireless & RF Integrated Circuits subcategory
802.11a/b/g/n, Bluetooth, WLAN RF Type

SKYA21039 Applications

There are a lot of Skyworks Solutions Inc.
SKYA21039 RF Switches applications.


  • Digital transceiver front end switch
  • IF switching
  • Tuner modules
  • Antenna diversity switching
  • Cellular/PCS Base Stations
  • ISM
  • Wireless Local Loop
  • Smartphones
  • Tablets
  • Mobile devices