SMC Corporation AP7S 3PW TW4 TW6 TW4
SMC Corporation AP7S 3PW TW4 TW6 TW4
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SMC Corporation AP7S 3PW TW4 TW6 TW4

Manufacturer No:

AP7S 3PW TW4 TW6 TW4

Manufacturer:

SMC Corporation

Utmel No:

2300-AP7S 3PW TW4 TW6 TW4

Package:

-

ECAD Model:

Description:

VACUUM GENERATOR

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User Guide

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
AP7S 3PW TW4 TW6 TW4 information

Specifications
SMC Corporation AP7S 3PW TW4 TW6 TW4 technical specifications, attributes, parameters and parts with similar specifications to SMC Corporation AP7S 3PW TW4 TW6 TW4.
  • Type
    Parameter
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Through Hole
  • Manufacturer Part Number
    599-06620
  • Manufacturer
    Siemens Building Technologies
  • RoHS
    Compliant
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Bulk
  • Tolerance

    In electronic components, "tolerance" refers to the acceptable deviation or variation from the specified or ideal value of a particular parameter, such as resistance, capacitance, or voltage. It indicates the range within which the actual value of the component can fluctuate while still being considered acceptable for use in a circuit. Tolerance is typically expressed as a percentage or a specific value and is important for ensuring the accuracy and reliability of electronic devices. Components with tighter tolerances are more precise but may also be more expensive. It is crucial to consider tolerance when selecting components to ensure proper functionality and performance of the circuit.

    20 %
  • Termination

    Termination in electronic components refers to the practice of matching the impedance of a circuit to prevent signal reflections and ensure maximum power transfer. It involves the use of resistors or other components at the end of transmission lines or connections. Proper termination is crucial in high-frequency applications to maintain signal integrity and reduce noise.

    Radial
  • Max Operating Temperature

    The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    125 °C
  • Min Operating Temperature

    The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

    -40 °C
  • Composition

    Parameter "Composition" in electronic components refers to the specific materials and substances used in the construction of the component. It encompasses the chemical and physical elements that make up the component, influencing its electrical, thermal, and mechanical properties. The composition can affect the performance, reliability, and durability of the component in various applications. Understanding the composition is essential for optimizing the design and functionality of electronic devices.

    Ceramic
  • Capacitance

    Capacitance is a fundamental electrical property of electronic components that describes their ability to store electrical energy in the form of an electric field. It is measured in farads (F) and represents the ratio of the amount of electric charge stored on a component to the voltage across it. Capacitors are passive components that exhibit capacitance and are commonly used in electronic circuits for various purposes such as filtering, energy storage, timing, and coupling. Capacitance plays a crucial role in determining the behavior and performance of electronic systems by influencing factors like signal propagation, frequency response, and power consumption.

    1 nF
  • Depth

    In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

    5 mm
  • Lead Pitch

    Lead pitch in electronic components refers to the distance between the center of one lead (or pin) of a component to the center of the adjacent lead. It is an important parameter to consider when designing and assembling electronic circuits, as it determines the spacing required on a circuit board for proper placement and soldering of the component. Lead pitch is typically specified in millimeters or inches and can vary depending on the type of component, such as integrated circuits, resistors, capacitors, and connectors. Choosing the correct lead pitch ensures proper alignment and connection of components on a circuit board, ultimately affecting the functionality and reliability of the electronic device.

    7.5 mm
  • Dielectric

    Dielectric is a term used in the context of electronic components to refer to a material's ability to store electrical energy in an electric field. It is a key parameter in capacitors, insulators, and other electronic devices. Dielectric materials have high electrical resistance and low conductivity, allowing them to separate and insulate conductive materials while still allowing the passage of electric fields. The dielectric constant, also known as relative permittivity, is a measure of a material's ability to store electrical energy and is an important factor in determining the capacitance of a component. Overall, the dielectric property plays a crucial role in the design and performance of various electronic components.

    K4000
  • Lead Diameter

    The parameter "Lead Diameter" in electronic components refers to the diameter of the metal wires or leads that are attached to the component for electrical connection. These leads are typically made of materials like copper or aluminum and are used to connect the component to a circuit board or other electronic devices. The lead diameter is an important specification as it determines the size of the holes needed in the circuit board for proper insertion and soldering of the component. It also affects the overall mechanical strength and durability of the component, as thicker leads are generally more robust and less prone to damage during handling or assembly.

    600 µm
  • Voltage

    Voltage is a measure of the electric potential difference between two points in an electrical circuit. It is typically represented by the symbol "V" and is measured in volts. Voltage is a crucial parameter in electronic components as it determines the flow of electric current through a circuit. It is responsible for driving the movement of electrons from one point to another, providing the energy needed for electronic devices to function properly. In summary, voltage is a fundamental concept in electronics that plays a key role in the operation and performance of electronic components.

    400 V
  • Lead/Base Style

    The parameter "Lead/Base Style" in electronic components refers to the physical configuration of the leads or terminals of the component in relation to its base or body. This parameter describes how the leads are attached to the component and how they are positioned in relation to the base. Common lead/base styles include through-hole, surface mount, gull-wing, J-lead, and many others. Understanding the lead/base style is important for proper installation and connection of the component in a circuit, as different styles may require different soldering techniques or mounting considerations.

    Straight
  • Connection Type

    In electronic components, the parameter "Connection Type" refers to the method used to establish an electrical connection between the component and the circuit or system it is being used in. This parameter describes the physical interface or terminal configuration of the component that allows for the flow of electrical signals or power. Common connection types include through-hole, surface mount, wire leads, solder pads, and various types of connectors.The connection type is an important consideration when selecting electronic components as it determines how the component will be mounted or integrated into the circuit board or system. Different connection types have different advantages and limitations in terms of ease of assembly, reliability, space requirements, and electrical performance. Understanding the connection type of a component is crucial for proper installation and ensuring the overall functionality and performance of the electronic system.

    Flanged
  • Height Seated (Max)

    Height Seated (Max) is a parameter in electronic components that refers to the maximum allowable height of the component when it is properly seated or installed on a circuit board or within an enclosure. This specification is crucial for ensuring proper fit and alignment within the overall system design. Exceeding the maximum seated height can lead to mechanical interference, electrical shorts, or other issues that may impact the performance and reliability of the electronic device. Manufacturers provide this information to help designers and engineers select components that will fit within the designated space and function correctly in the intended application.

    13.0048 mm
  • Radiation Hardening

    Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.

    No
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