Taiwan Semiconductor Corporation SMAJ120CHR3G

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The parameter "Applications" in electronic components refers to the specific uses or functions for which a component is designed. It encompasses various fields such as consumer electronics, industrial automation, telecommunications, automotive, and medical devices. Understanding the applications helps in selecting the right components for a particular design based on performance, reliability, and compatibility requirements. This parameter also guides manufacturers in targeting their products to relevant markets and customer needs.

During fault, the only circuit breaker closest to the fault point should be tripped. The operating time of relay associated with protection of line should be as minimum as possible in order to prevent unnecessary tripping of circuit breakers associated with other healthy parts of power system.

Voltage - Breakdown (Min) is a parameter used to specify the minimum voltage level at which an electronic component, such as a diode or capacitor, will break down and allow current to flow through it uncontrollably. This breakdown voltage is a critical characteristic that determines the maximum voltage the component can withstand before failing. It is important to ensure that the applied voltage does not exceed this minimum breakdown voltage to prevent damage to the component and maintain proper functionality. Manufacturers provide this specification to help engineers and designers select components that are suitable for their intended applications and operating conditions.

Power - Peak Pulse refers to the maximum transient power level that an electronic component, such as a diode or a transzorber, can safely dissipate during a short-duration pulse. This parameter is critical in determining the component's ability to withstand voltage spikes or surges without failure. It is typically expressed in watts and is measured over a specific duration, usually in microseconds or nanoseconds, to reflect the component's performance under peak conditions. Understanding this parameter helps designers select appropriate components for applications where transient conditions are expected.

The parameter "Current - Peak Pulse (10/1000μs)" in electronic components refers to the maximum current that a device can handle during a transient overvoltage event with a specific waveform, typically a 10/1000μs pulse. This parameter is important for surge protection devices such as transient voltage suppressors (TVS) and varistors, as it indicates the device's ability to divert excess current away from sensitive components and protect them from damage. A higher peak pulse current rating signifies better surge protection capability, making the component more suitable for applications exposed to high-voltage transients or lightning strikes. Designers should carefully consider this parameter when selecting surge protection components to ensure reliable operation and protection of their electronic circuits.

Voltage - Clamping (Max) @ Ipp refers to the maximum voltage that a component, such as a transient voltage suppressor or diode, can clamp when subjected to a specific peak current (Ipp). It indicates the upper limit of voltage that the component will allow to pass through, effectively protecting sensitive circuits from overvoltage conditions. This parameter is crucial for ensuring that devices are safeguarded against voltage spikes without being damaged. Designers use this specification to select appropriate components for overvoltage protection in their applications.

Voltage - Reverse Standoff (Typ) refers to the maximum reverse voltage that a semiconductor device, such as a diode or a transient voltage suppressor, can withstand without entering into breakdown. It is typically specified as a nominal value and indicates the voltage level at which the device transitions from its non-conducting state to a conducting state when reverse-biased. Exceeding this voltage can lead to permanent damage or failure of the component. This parameter is crucial for ensuring the safe operating limits of electronic circuits, particularly in protecting sensitive components from voltage spikes.

Bidirectional channels in electronic components refer to pathways or connections that allow signal transmission in both directions. This means that data can flow from one device to another and back again, enabling two-way communication. Such channels are essential in applications like data buses, communication interfaces, and certain types of network protocols, facilitating efficient and dynamic interactions between components.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.