Taiyo Yuden D6RB1G960E1HB-Z

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

Frequency bands (Low / High) in electronic components refer to the range of frequencies over which the component operates effectively. The low frequency band typically refers to frequencies below a certain threshold, while the high frequency band refers to frequencies above that threshold. Understanding the frequency bands of electronic components is crucial for designing circuits and systems that operate within the desired frequency range. Components such as capacitors, inductors, and transistors may have specific frequency bands in which they exhibit optimal performance, making it important to consider these specifications when selecting components for a particular application.

The parameter "High Band Attenuation (min / max dB)" in electronic components refers to the range of attenuation values within a specific frequency band. Attenuation is the reduction in signal strength as it passes through a component or system. In this context, the high band refers to higher frequencies within the component's operating range. The minimum and maximum dB values indicate the range of attenuation that can be expected at those frequencies, providing insight into the component's performance in attenuating high-frequency signals. Designers and engineers use this parameter to ensure that the component meets the required specifications for signal attenuation in high-frequency applications.

RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.