TDK ZRGT2230-M
TDK ZRGT2230-M
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TDK ZRGT2230-M

Manufacturer No:

ZRGT2230-M

Manufacturer:

TDK

Utmel No:

2454-ZRGT2230-M

Package:

-

ECAD Model:

Description:

ZRGT2230-M datasheet pdf and Unclassified product details from TDK stock available at Utmel

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User Guide

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
ZRGT2230-M information

Specifications
TDK ZRGT2230-M technical specifications, attributes, parameters and parts with similar specifications to TDK ZRGT2230-M.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    PANEL MOUNT
  • Factory Pack QuantityFactory Pack Quantity
    2500
  • Manufacturer
    Maxim Integrated
  • Brand
    Maxim Integrated
  • RoHS
    Details
  • Manufacturer Series
    ZRGT-M
  • Risk Rank
    5.84
  • Ihs Manufacturer
    TDK CORP
  • Part Life Cycle Code
    Obsolete
  • Approvals
    UL; CSA; NEMKO
  • Manufacturer Part Number
    ZRGT2230-M
  • Rohs Code
    Yes
  • Operating Temperature-Max
    85 °C
  • Operating Temperature-Min
    -25 °C
  • Leakage Current-Max
    1 mA
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    MouseReel
  • JESD-609 Code

    The "JESD-609 Code" in electronic components refers to a standardized marking code that indicates the lead-free solder composition and finish of electronic components for compliance with environmental regulations.

    e3
  • Terminal Finish

    Terminal Finish refers to the surface treatment applied to the terminals or leads of electronic components to enhance their performance and longevity. It can improve solderability, corrosion resistance, and overall reliability of the connection in electronic assemblies. Common finishes include nickel, gold, and tin, each possessing distinct properties suitable for various applications. The choice of terminal finish can significantly impact the durability and effectiveness of electronic devices.

    Tin (Sn)
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Physical Dimension

    The parameter "Physical Dimension" in electronic components refers to the measurable size and shape characteristics of a component. This includes dimensions such as length, width, height, and diameter, which are critical for ensuring proper fit and integration into electronic circuits and systems. Physical dimensions also influence the component's performance, thermal management, and overall reliability in application environments. Understanding these dimensions is essential for designers to maintain compatibility with circuit boards and reduce issues related to space constraints.

    L120.0XB105.0XH80.0 (mm)/L4.724XB4.134XH3.15 (inch)
  • Operating Frequency

    Operating frequency is the frequency at which the communications are being made with the total bandwidth occupied by the carrier signal with modulation. Usually bandwidth of the antenna will be wider than the bandwidth of the signal so that more than one center frequency the antenna can be put in to effective use.

    60Hz Hz
  • Filter Type

    Filter Type in electronic components refers to the classification of filters based on their frequency response characteristics. Common types include low-pass, high-pass, band-pass, and band-stop filters, each serving different functions in signal processing. Low-pass filters allow signals below a certain cutoff frequency to pass while attenuating higher frequencies, whereas high-pass filters do the opposite. Band-pass filters permit frequencies within a specific range, while band-stop filters block frequencies within a designated range. The choice of filter type influences the performance and behavior of electronic circuits in various applications.

    THREE PHASE EMI FILTER
  • Rated Current

    Rated Current in electronic components refers to the maximum current that the component is designed to handle continuously without overheating or causing damage. It is an important specification that helps determine the safe operating conditions of the component within a circuit. Exceeding the rated current can lead to overheating, increased resistance, and potential failure of the component. It is crucial to consider the rated current when designing circuits to ensure the reliability and longevity of the electronic components.

    30 A
  • Rated Voltage

    Rated Voltage in electronic components refers to the maximum voltage that the component is designed to safely operate at continuously without being damaged. It is an important specification that helps determine the compatibility and reliability of the component within a circuit. Exceeding the rated voltage can lead to overheating, electrical breakdown, or even permanent damage to the component. It is crucial to always operate electronic components within their specified rated voltage range to ensure proper functionality and longevity of the component.

    250 V
  • Insulation Resistance-Min

    Insulation Resistance-Min is a parameter that specifies the minimum level of insulation resistance that an electronic component must maintain in order to function properly. Insulation resistance refers to the ability of the component's insulation material to resist the flow of electrical current. A higher insulation resistance value indicates better insulation quality and helps prevent leakage currents or short circuits. This parameter is crucial for ensuring the reliability and safety of electronic components, especially in applications where electrical isolation is important, such as in power supplies or high-voltage circuits. Manufacturers typically provide a minimum insulation resistance value to guarantee the component's performance under specified operating conditions.

    100 MΩ
  • High Pot

    High Pot is a term used in electronic components to refer to the high potential or high voltage that a component can withstand without breaking down or experiencing electrical failure. This parameter is often specified in datasheets for components such as capacitors, resistors, and insulators to indicate the maximum voltage that can be applied across the component without causing damage. High Pot testing is a common quality control measure used to ensure the reliability and safety of electronic components in various applications. It is important to adhere to the specified high pot ratings to prevent electrical breakdown and ensure the proper functioning of electronic circuits.

    2000 V
  • Product Category

    a particular group of related products.

    Maxim
  • Length
    120 mm
  • Height
    80 mm
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