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Texas Instruments IWR6843ABGABLR

Manufacturer No:

IWR6843ABGABLR

Manufacturer:

Texas Instruments

Utmel No:

2502-IWR6843ABGABLR

Package:

161-TFBGA, FCCSP

ECAD Model:

Description:

TxRx + MCU 60GHz ~ 64GHz 1.71V ~ 1.89V, 3.135V ~ 3.465V ADC, GPIO, I2C, SPI 900Mbps - - Receiving - - Transmitting - - 48 161-TFBGA, FCCSP

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Unit Price: $71.217523

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IWR6843ABGABLR information

Specifications
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Product Details
Texas Instruments IWR6843ABGABLR technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments IWR6843ABGABLR.
  • Type
    Parameter
  • Mounting Type

    The "Mounting Type" in electronic components refers to the method used to attach or connect a component to a circuit board or other substrate, such as through-hole, surface-mount, or panel mount.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    161-TFBGA, FCCSP
  • Supplier Device Package

    The parameter "Supplier Device Package" in electronic components refers to the physical packaging or housing of the component as provided by the supplier. It specifies the form factor, dimensions, and layout of the component, which are crucial for compatibility and integration into electronic circuits and systems. The supplier device package information typically includes details such as the package type (e.g., DIP, SOP, QFN), number of pins, pitch, and overall size, allowing engineers and designers to select the appropriate component for their specific application requirements. Understanding the supplier device package is essential for proper component selection, placement, and soldering during the manufacturing process to ensure optimal performance and reliability of the electronic system.

    161-FC/CSP (10.4x10.4)
  • Mfr
    Texas Instruments
  • Package
    Tape & Reel (TR)
  • Product Status
    Active
  • Base Product Number

    "Base Product Number" (BPN) refers to the fundamental identifier assigned to a component by the manufacturer. This number is used to identify a specific product family or series of components that share common features, characteristics, or functionality. The BPN is usually part of a larger part number or order code that includes additional information, such as variations in packaging, tolerance, voltage ratings, and other specifications.

    IWR6843
  • Maximum Clock Frequency
    64 GHz
  • Number of I/Os
    47 I/O
  • Maximum Data Rate
    900 Mbps
  • Maximum Operating Temperature

    the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

    + 105 C
  • Minimum Operating Temperature
    - 40 C
  • Factory Pack QuantityFactory Pack Quantity
    1000
  • Mounting Styles
    SMD/SMT
  • Interface Type
    CAN-FD, GPIOs, I2C, SPI, UARTs
  • Manufacturer
    Texas Instruments
  • Brand
    Texas Instruments
  • RoHS
    Details
  • Data RAM Size
    512 kB
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    -
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C ~ 105°C (TJ)
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Reel
  • Type
    TxRx + MCU
  • Subcategory
    Wireless & RF Integrated Circuits
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    Si
  • Voltage - Supply

    Voltage - Supply refers to the range of voltage levels that an electronic component or circuit is designed to operate with. It indicates the minimum and maximum supply voltage that can be applied for the device to function properly. Providing supply voltages outside this range can lead to malfunction, damage, or reduced performance. This parameter is critical for ensuring compatibility between different components in a circuit.

    1.71V ~ 1.89V, 3.135V ~ 3.465V
  • Frequency

    In electronic components, the parameter "Frequency" refers to the rate at which a signal oscillates or cycles within a given period of time. It is typically measured in Hertz (Hz) and represents how many times a signal completes a full cycle in one second. Frequency is a crucial aspect in electronic components as it determines the behavior and performance of various devices such as oscillators, filters, and communication systems. Understanding the frequency characteristics of components is essential for designing and analyzing electronic circuits to ensure proper functionality and compatibility with other components in a system.

    60GHz ~ 64GHz
  • Operating Frequency

    Operating frequency is the frequency at which the communications are being made with the total bandwidth occupied by the carrier signal with modulation. Usually bandwidth of the antenna will be wider than the bandwidth of the signal so that more than one center frequency the antenna can be put in to effective use.

    60 Hz to 64 GHz
  • Memory Size

    The memory capacity is the amount of data a device can store at any given time in its memory.

    -
  • Output Power

    That power available at a specified output of a device under specified conditions of operation.

    12 dBm
  • Product Type

    a group of products which fulfill a similar need for a market segment or market as a whole.

    RF System on a Chip - SoC
  • Protocol

    In electronic components, the parameter "Protocol" refers to a set of rules and standards that govern the communication between devices. It defines the format, timing, sequencing, and error checking methods for data exchange between different components or systems. Protocols ensure that devices can understand and interpret data correctly, enabling them to communicate effectively with each other. Common examples of protocols in electronics include USB, Ethernet, SPI, I2C, and Bluetooth, each with its own specifications for data transmission. Understanding and adhering to protocols is essential for ensuring compatibility and reliable communication between electronic devices.

    -
  • Power - Output

    Power Output in electronic components refers to the amount of electrical power that a device can deliver to a load. It is typically measured in watts and indicates the effectiveness of the component in converting electrical energy into usable work or signal. Power Output can vary based on the component's design, operating conditions, and intended application, making it a critical factor in the performance of amplifiers, power supplies, and other electronic devices. Understanding the Power Output helps in selecting appropriate components for specific applications to ensure efficiency and reliability.

    12dBm
  • RF Family/Standard

    The parameter "RF Family/Standard" in electronic components refers to the specific radio frequency (RF) technology or standard that the component complies with or is designed for. RF technology encompasses a wide range of frequencies used for wireless communication, such as Wi-Fi, Bluetooth, cellular networks, and more. Different RF standards dictate the frequency bands, modulation techniques, data rates, and other specifications for communication systems. Understanding the RF family/standard of a component is crucial for ensuring compatibility and optimal performance in RF applications.

    -
  • Sensitivity

    Sensitivity in electronic components refers to the degree to which the output of a device responds to changes in input. It indicates how effectively a component translates a specific input signal into an observable output. High sensitivity means that even small variations in input can produce significant changes in output, making the device more responsive to signals. Sensitivity is crucial in applications where precise measurements or signal detection are required.

    -
  • Data Rate (Max)

    Data Rate (Max) refers to the maximum rate at which data can be transferred or processed within an electronic component or device. It is typically measured in bits per second (bps) or megabits per second (Mbps). This parameter is important for determining the speed and efficiency of data transmission or processing in various electronic applications such as computer systems, networking devices, and memory modules. A higher data rate indicates that the component is capable of handling larger volumes of data at a faster pace, leading to improved performance and responsiveness in electronic systems. It is crucial to consider the Data Rate (Max) specification when selecting electronic components to ensure compatibility and optimal functionality for specific applications.

    900Mbps
  • Number of ADC Channels
    6 Channel
  • Serial Interfaces

    A serial interface is a communication interface between two digital systems that transmits data as a series of voltage pulses down a wire. Essentially, the serial interface encodes the bits of a binary number by their "temporal" location on a wire rather than their "spatial" location within a set of wires.

    ADC, GPIO, I2C, SPI
  • Current - Receiving

    Current - Receiving refers to the amount of electrical current that an electronic component or device is capable of accepting from a power source or another component in a circuit. It indicates the maximum current that can be safely received without causing damage or malfunction. This parameter is crucial for ensuring compatibility and reliability in electronic designs, as exceeding the rated receiving current can lead to overheating or failure of the component.

    -
  • Current - Transmitting

    Current - Transmitting is a parameter used to describe the maximum amount of electrical current that an electronic component can handle while in the transmitting mode. This parameter is crucial for components such as transistors, diodes, and integrated circuits that are involved in transmitting signals or power within a circuit. Exceeding the specified current transmitting rating can lead to overheating, component failure, or even damage to the entire circuit. Designers and engineers must carefully consider this parameter when selecting components to ensure the reliability and performance of the electronic system.

    -
  • Modulation

    In electronic components, modulation refers to the process of varying one or more properties of a periodic waveform, known as the carrier signal, in order to encode information. This modulation technique is commonly used in communication systems to transmit data efficiently over long distances. By modulating the carrier signal, information such as audio, video, or data can be embedded onto the signal for transmission and then demodulated at the receiving end to retrieve the original information. There are various types of modulation techniques, including amplitude modulation (AM), frequency modulation (FM), and phase modulation (PM), each with its own advantages and applications in different communication systems.

    -
  • GPIO

    GPIO stands for General Purpose Input/Output. It is a type of electronic pin found on microcontrollers, microprocessors, and other integrated circuits that can be configured to either input or output digital signals. GPIO pins can be used to connect and communicate with external devices such as sensors, LEDs, motors, and more. They provide a flexible way to interact with the physical world by allowing the device to both receive and send digital signals. GPIO pins can be programmed and controlled by software to perform various functions based on the specific requirements of the electronic system.

    48
  • Compliance

    Compliance in electronic components refers to the ability of a component to meet specific industry standards, regulations, or requirements. It ensures that the component operates within specified limits and parameters, such as voltage, current, temperature, or other performance characteristics. Compliance is crucial for ensuring the reliability, safety, and functionality of electronic devices and systems. Components that are compliant with relevant standards are more likely to perform as intended and meet the expectations of manufacturers and end-users. Non-compliance can lead to malfunctions, safety hazards, or legal issues, making it essential for electronic components to adhere to established compliance guidelines.

    IEC 61508
  • Product Category

    a particular group of related products.

    RF System on a Chip - SoC
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Download datasheets and manufacturer documentation for Texas Instruments IWR6843ABGABLR.

IWR6843ABGABLR Overview

As a result of RF transceiver IC's 161-TFBGA, FCCSP package, it helps to save board space on the board. We are using Surface Mount as the RF transceiver's mounting method.With transceiver RF's high efficiency, transceiver RF emerges as a TxRx + MCU.Using advanced packaging techniques Reel, high reliability is ensured.The RF transceiver comes from the well-known - series.Using the frequency of 60GHz ~ 64GHz, RF transceiver operates .

IWR6843ABGABLR Features

161-TFBGA, FCCSP package
Surface Mount for mounting
TxRx + MCU
Reel is used
- series

IWR6843ABGABLR Applications

There are a lot of Texas Instruments
IWR6843ABGABLR RF Transceiver ICs applications.


  • LoT applications
  • Power Amplifier (PA)
  • Low Noise Amplifier (LNA)
  • Transmit
  • Receive
  • Switch
  • Power management
  • Internet of Things (IoT)
  • Secure Payment
  • Home and Security