Vicor Corporation 30089
Vicor Corporation 30089
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Vicor Corporation 30089

Manufacturer No:

30089

Manufacturer:

Vicor Corporation

Utmel No:

2656-30089

Package:

200

Datasheet:

30089 Drawing

ECAD Model:

Description:

HEATSINK VI-200 HORIZ. 0.9"

Quantity:

Unit Price: $26.573965

Ext Price: $26.57

Delivery:

DHLTNTUPSFedExSF-Express

Payment:

paypalvisadiscovermastercard

In Stock : 145

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $26.573965

    $26.57

  • 10

    $25.069778

    $250.70

  • 100

    $23.650734

    $2,365.07

  • 500

    $22.312013

    $11,156.01

  • 1000

    $21.049069

    $21,049.07

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User Guide

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IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

Shipping Method

Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
30089 information

Specifications
Documents & Media
Product Details
Vicor Corporation 30089 technical specifications, attributes, parameters and parts with similar specifications to Vicor Corporation 30089.
  • Type
    Parameter
  • Factory Lead Time
    16 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Horizontal
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    200
  • Body Material

    The parameter "Body Material" in electronic components refers to the material used to construct the physical body or casing of the component. This material plays a crucial role in determining the component's durability, thermal conductivity, electrical insulation properties, and resistance to environmental factors such as moisture, heat, and mechanical stress. Common body materials for electronic components include plastics, ceramics, metals, and composites. Selecting the appropriate body material is essential to ensure the reliable performance and longevity of the electronic component in various operating conditions.

    Aluminium
  • Published
    2005
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    Not Applicable
  • Type
    Passive
  • Depth

    In electronic components, "Depth" typically refers to the measurement of the distance from the front to the back of the component. It is an important parameter to consider when designing or selecting components for a project, as it determines how much space the component will occupy within a circuit or device. The depth of a component can impact the overall size and layout of the circuit board or enclosure in which it will be installed. It is usually specified in millimeters or inches and is crucial for ensuring proper fit and functionality within the intended application.

    60.96mm
  • Accessory Type

    Accessory Type in electronic components refers to additional items or attachments that enhance the functionality or usability of primary components. These can include connectors, adapters, mounting hardware, and protective casings. Accessory Types are essential for ensuring compatibility and achieving optimal performance in electronic systems.

    Heat Sink
  • Height
    22.86mm
  • Length
    116.84mm
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
  • Lead Free

    Lead Free is a term used to describe electronic components that do not contain lead as part of their composition. Lead is a toxic material that can have harmful effects on human health and the environment, so the electronics industry has been moving towards lead-free components to reduce these risks. Lead-free components are typically made using alternative materials such as silver, copper, and tin. Manufacturers must comply with regulations such as the Restriction of Hazardous Substances (RoHS) directive to ensure that their products are lead-free and environmentally friendly.

    Lead Free
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Download datasheets and manufacturer documentation for Vicor Corporation 30089.

Product Description

30089 Heat Sink by Vicor Corporation

The Vicor Corporation's 30089 heat sink is a high-performance, lead-free aluminum accessory designed for board mount applications. This passive heat sink is engineered to efficiently dissipate heat from electronic components, ensuring optimal thermal management and reliability in various electronic systems.

Features

  • Material: The heat sink is constructed from high-quality aluminum, providing excellent thermal conductivity and durability.
  • Dimensions: With dimensions of 116.84mm in length, 60.96mm in depth, and 22.86mm in height, this heat sink offers a compact yet effective solution for thermal management.
  • Mounting: The horizontal mounting option allows for easy integration into a wide range of electronic assemblies.
  • Compliance: The product is ROHS3 compliant and lead-free, ensuring it meets stringent environmental regulations.
  • Quantity: Available in packages of 200 units, making it suitable for both small-scale prototyping and large-scale production needs.

Applications

  1. Primary Applications:
  2. Industrial Control Systems: The 30089 heat sink is ideal for use in industrial control systems where high reliability and efficient thermal management are crucial.
  3. Medical Devices: Its compact size and high thermal conductivity make it suitable for medical devices requiring precise temperature control.
  4. Automotive Electronics: The heat sink can be used in automotive electronics to manage heat generated by components such as power modules and ICs.

  5. Secondary Applications:

  6. Telecommunications Equipment: It can be used in telecommunications equipment to ensure stable operation under varying environmental conditions.
  7. Aerospace Systems: The 30089 heat sink's durability and thermal efficiency make it a viable option for aerospace systems where reliability is paramount.

Alternative Parts

If the 30089 heat sink is not available or meets specific requirements, alternative parts include:

  • 30090 Heat Sink by Vicor Corporation: This variant offers slightly different dimensions but maintains the same high-quality construction and thermal performance.
  • Other Manufacturers' Products: Other manufacturers like Amkor Technology or Würth Elektronik offer similar heat sinks with varying dimensions and materials that could be considered as alternatives depending on specific needs.

Embedded Modules

The 30089 heat sink is commonly used in various embedded modules designed for efficient thermal management:

  • Power Modules: Integrated power modules often utilize this heat sink to manage heat generated by high-power components.
  • IC Cooling Systems: Some IC cooling systems incorporate this heat sink to provide a compact yet effective cooling solution.
  • Board-Level Cooling Solutions: It is frequently used in board-level cooling solutions where space is limited but thermal performance is critical.

In summary, the Vicor Corporation's 30089 heat sink is a reliable and efficient accessory designed for board mount applications, offering excellent thermal management capabilities while meeting stringent environmental regulations. Its versatility makes it suitable for a wide range of electronic systems across various industries.