Vishay BZM55B7V5-TR

Contact plating (finish) provides corrosion protection for base metals and optimizes the mechanical and electrical properties of the contact interfaces.

In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

The Maximum Operating Temperature is the maximum body temperature at which the thermistor is designed to operate for extended periods of time with acceptable stability of its electrical characteristics.

The "Min Operating Temperature" parameter in electronic components refers to the lowest temperature at which the component is designed to operate effectively and reliably. This parameter is crucial for ensuring the proper functioning and longevity of the component, as operating below this temperature may lead to performance issues or even damage. Manufacturers specify the minimum operating temperature to provide guidance to users on the environmental conditions in which the component can safely operate. It is important to adhere to this parameter to prevent malfunctions and ensure the overall reliability of the electronic system.

The maximum power that the MOSFET can dissipate continuously under the specified thermal conditions.

In electrical engineering, impedance is the opposition to alternating current presented by the combined effect of resistance and reactance in a circuit.

The distribution of electrons of an atom or molecule (or other physical structure) in atomic or molecular orbitals.

the process by which an electronic or electrical device produces heat (energy loss or waste) as an undesirable derivative of its primary action.

Max Reverse Leakage Current refers to the maximum amount of current that can flow through a semiconductor device, such as a diode or transistor, when it is reverse biased. This current is an important parameter as it indicates the level of unintended current that can flow when the device is not conducting in the forward direction. High values of reverse leakage current can lead to power loss, reduced efficiency, and may affect the performance and reliability of electronic circuits. It is particularly critical in applications where precise current control and low power consumption are necessary.

Test Current refers to a specified amount of electrical current applied to an electronic component during testing to evaluate its performance and characteristics. This current is typically defined by manufacturers to ensure that the component operates within its designed parameters. By measuring how the component reacts to this test current, engineers can determine its reliability, efficiency, and suitability for specific applications.

The Zener voltage is a crucial parameter in Zener diodes, which are specialized semiconductor devices designed to maintain a constant voltage across their terminals when operated in the reverse-biased mode. The Zener voltage, also known as the breakdown voltage, is the voltage at which the Zener diode starts conducting in the reverse direction. This voltage is carefully controlled during the manufacturing process and is a key characteristic that determines the diode's functionality in voltage regulation and protection circuits. Zener diodes are commonly used in various electronic applications to stabilize voltage levels and protect sensitive components from voltage spikes.

The voltage tolerance level for the electrical auxiliaries is defined by the standard. The maximum and minimum nominal voltages are defined by the tolerance level.

ESD protection, or Electrostatic Discharge protection, is a feature in electronic components designed to prevent damage caused by sudden electrostatic discharges. These discharges can occur when a person or object with an electric charge comes into contact with a sensitive electronic component, leading to a rapid flow of static electricity that can damage or destroy the component. ESD protection mechanisms in electronic components typically involve the use of special materials or circuitry that can safely dissipate or divert the excess charge away from the sensitive components, thus safeguarding the device from potential harm. Implementing effective ESD protection is crucial in ensuring the reliability and longevity of electronic devices, especially in environments where static electricity buildup is common, such as in manufacturing facilities or areas with low humidity.

Radiation hardening is the process of making electronic components and circuits resistant to damage or malfunction caused by high levels of ionizing radiation, especially for environments in outer space (especially beyond the low Earth orbit), around nuclear reactors and particle accelerators, or during nuclear accidents or nuclear warfare.