WINBOND W88111AF
WINBOND W88111AF
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WINBOND W88111AF

Manufacturer No:

W88111AF

Manufacturer:

WINBOND

Utmel No:

2736-W88111AF

Package:

-

ECAD Model:

Description:

W88111AF datasheet pdf and Unclassified product details from WINBOND stock available at Utmel

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

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Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:

FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
W88111AF information

Specifications
WINBOND W88111AF technical specifications, attributes, parameters and parts with similar specifications to WINBOND W88111AF.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    YES
  • Number of Terminals
    100
  • Package Description
    QFP,
  • Package Style
    FLATPACK
  • Package Body Material
    PLASTIC/EPOXY
  • Supply Voltage-Nom
    5 V
  • Supply Voltage-Min
    4.75 V
  • Operating Temperature-Max
    70 °C
  • Manufacturer Part Number
    W88111AF
  • Package Code
    QFP
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Winbond Electronics Corp
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    WINBOND ELECTRONICS CORP
  • Supply Voltage-Max
    5.25 V
  • Risk Rank
    5.82
  • Part Package Code
    QFP
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    CMOS
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    QUAD
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    GULL WING
  • Terminal Pitch

    The center distance from one pole to the next.

    0.65 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    100
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PQFP-G100
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • uPs/uCs/Peripheral ICs Type

    The parameter "uPs/uCs/Peripheral ICs Type" refers to the classification of various integrated circuits used in electronic devices. It encompasses microprocessors (uPs), microcontrollers (uCs), and peripheral integrated circuits that provide additional functionalities. This classification helps in identifying the specific type of chip used for processing tasks, controlling hardware, or interfacing with other components in a system. Understanding this parameter is essential for selecting the appropriate electronic components for a given application.

    SECONDARY STORAGE CONTROLLER, CD ROM
  • Seated Height-Max

    Seated Height-Max in electronic components refers to the maximum height at which a component can be comfortably installed or operated when a user is seated. It is particularly relevant in designs involving ergonomic considerations, where the placement of controls, displays, or other interfaces must accommodate users in seated positions. This parameter ensures accessibility and usability, preventing strain or discomfort during operation.

    3.3 mm
  • External Data Bus Width

    The External Data Bus Width refers to the number of bits that can be transmitted simultaneously between a microprocessor and external components, such as memory or peripherals. It determines the amount of data that can be transferred in a single clock cycle. A wider data bus allows for faster data transfer rates and can improve overall system performance. Common data bus widths include 8-bit, 16-bit, 32-bit, and 64-bit, with larger widths generally offering higher throughput but requiring more complex circuitry. The External Data Bus Width is an important parameter to consider when designing or evaluating electronic components to ensure compatibility and optimal performance.

    16
  • Drive Interface Standard

    The "Drive Interface Standard" in electronic components refers to the specific protocol or standard used to connect and communicate with a drive, such as a hard drive or solid-state drive, within a computer system. This parameter determines how the drive interfaces with the rest of the system, including how data is transferred between the drive and the computer. Common examples of drive interface standards include SATA (Serial ATA), PCIe (Peripheral Component Interconnect Express), and NVMe (Non-Volatile Memory Express). The drive interface standard plays a crucial role in determining the speed, compatibility, and overall performance of the storage device within a computer system.

    IDE
  • Host Interface Standard

    The "Host Interface Standard" in electronic components refers to the specific protocol or set of rules that govern the communication between the component and the host device it is connected to. This standard defines how data is exchanged, commands are interpreted, and signals are transmitted between the two entities. Different types of electronic components, such as sensors, displays, or memory modules, may have different host interface standards depending on their intended use and compatibility requirements. Adhering to a common host interface standard ensures seamless interoperability and communication between various components and host devices in a system.

    ATAPI
  • Width
    14 mm
  • Length
    20 mm
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