WINBOND W91340N
WINBOND W91340N
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WINBOND W91340N

Manufacturer No:

W91340N

Manufacturer:

WINBOND

Utmel No:

2736-W91340N

Package:

-

ECAD Model:

Description:

W91340N datasheet pdf and Unclassified product details from WINBOND stock available at Utmel

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User Guide

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
  • Packaging boxStep5:Packaging box
  • Barcode shipping labelStep6:Barcode shipping label
W91340N information

Specifications
WINBOND W91340N technical specifications, attributes, parameters and parts with similar specifications to WINBOND W91340N.
  • Type
    Parameter
  • Surface Mount

    having leads that are designed to be soldered on the side of a circuit board that the body of the component is mounted on.

    NO
  • Number of Terminals
    18
  • Package Description
    DIP, DIP18,.3
  • Package Style
    IN-LINE
  • Package Body Material
    PLASTIC/EPOXY
  • Package Equivalence Code
    DIP18,.3
  • Operating Temperature-Min
    -20 °C
  • Supply Voltage-Nom
    2.5 V
  • Operating Temperature-Max
    70 °C
  • Manufacturer Part Number
    W91340N
  • Package Code
    DIP
  • Package Shape
    RECTANGULAR
  • Manufacturer
    Winbond Electronics Corp
  • Part Life Cycle Code
    Obsolete
  • Ihs Manufacturer
    WINBOND ELECTRONICS CORP
  • Risk Rank
    5.84
  • Part Package Code
    DIP
  • Additional Feature

    Any Feature, including a modified Existing Feature, that is not an Existing Feature.

    SELECTABLE MAKE/BREAK RATIO 33.3:66.7
  • HTS Code

    HTS (Harmonized Tariff Schedule) codes are product classification codes between 8-1 digits. The first six digits are an HS code, and the countries of import assign the subsequent digits to provide additional classification. U.S. HTS codes are 1 digits and are administered by the U.S. International Trade Commission.

    8542.39.00.01
  • Subcategory
    Telephone Circuits
  • Technology

    In the context of electronic components, the parameter "Technology" refers to the specific manufacturing process and materials used to create the component. This includes the design, construction, and materials used in the production of the component. The technology used can greatly impact the performance, efficiency, and reliability of the electronic component. Different technologies may be used for different types of components, such as integrated circuits, resistors, capacitors, and more. Understanding the technology behind electronic components is important for selecting the right components for a particular application and ensuring optimal performance.

    CMOS
  • Terminal Position

    In electronic components, the term "Terminal Position" refers to the physical location of the connection points on the component where external electrical connections can be made. These connection points, known as terminals, are typically used to attach wires, leads, or other components to the main body of the electronic component. The terminal position is important for ensuring proper connectivity and functionality of the component within a circuit. It is often specified in technical datasheets or component specifications to help designers and engineers understand how to properly integrate the component into their circuit designs.

    DUAL
  • Terminal Form

    Occurring at or forming the end of a series, succession, or the like; closing; concluding.

    THROUGH-HOLE
  • Number of Functions
    1
  • Terminal Pitch

    The center distance from one pole to the next.

    2.54 mm
  • Reach Compliance Code

    Reach Compliance Code refers to a designation indicating that electronic components meet the requirements set by the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation in the European Union. It signifies that the manufacturer has assessed and managed the chemical substances within the components to ensure safety and environmental protection. This code is vital for compliance with regulations aimed at minimizing risks associated with hazardous substances in electronic products.

    unknown
  • Pin Count

    a count of all of the component leads (or pins)

    18
  • JESD-30 Code

    JESD-30 Code refers to a standardized descriptive designation system established by JEDEC for semiconductor-device packages. This system provides a systematic method for generating designators that convey essential information about the package's physical characteristics, such as size and shape, which aids in component identification and selection. By using JESD-30 codes, manufacturers and engineers can ensure consistency and clarity in the specification of semiconductor packages across various applications and industries.

    R-PDIP-T18
  • Qualification Status

    An indicator of formal certification of qualifications.

    Not Qualified
  • Power Supplies

    an electronic circuit that converts the voltage of an alternating current (AC) into a direct current (DC) voltage.?

    2.5 V
  • Temperature Grade

    Temperature grades represent a tire's resistance to heat and its ability to dissipate heat when tested under controlled laboratory test conditions.

    COMMERCIAL
  • Supply Current-Max

    Supply Current-Max refers to the maximum amount of current that an electronic component or circuit can draw from its power supply under specified operating conditions. It is a critical parameter that determines the power consumption and thermal performance of the device. Exceeding this limit can lead to overheating, potential damage, or failure of the component. Knowing the Supply Current-Max helps in designing circuits that ensure proper operation and reliability.

    0.0006 mA
  • Telecom IC Type

    Telecom IC Type refers to integrated circuits specifically designed for telecommunications applications. These components facilitate various functions such as signal processing, data modulation and demodulation, and communication protocol handling. They can be used in devices like mobile phones, modems, and network equipment, ensuring reliable data transmission and reception. Telecom ICs support different standards and technologies, making them essential for modern communication systems.

    TELEPHONE DIALER CIRCUIT
  • Crystal Frequency

    Crystal frequency refers to the resonant frequency at which a crystal oscillator vibrates and generates a stable and precise clock signal in electronic components. Crystals are commonly used in electronic devices to provide accurate timing for various functions such as data processing, communication, and synchronization. The crystal frequency is typically specified in hertz (Hz) and is a crucial parameter that determines the overall performance and reliability of the electronic system. Choosing the appropriate crystal frequency is essential to ensure proper operation and synchronization of the components within the system.

    3.58 MHz
  • Make-break Ratio

    The make-break ratio is a parameter used to describe the operational characteristics of a switch or relay in electronic components. It represents the relationship between the time a circuit is closed (make) and the time it is open (break) during the operation of the component. A high make-break ratio indicates that the switch remains closed for a longer duration compared to the time it spends open, while a low ratio signifies the opposite. This parameter is crucial for understanding the performance and suitability of a component in specific applications.

    2:3
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