Würth Elektronik 331161702513
Würth Elektronik 331161702513
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Würth Elektronik 331161702513

Manufacturer No:

331161702513

Manufacturer:

Würth Elektronik

Utmel No:

2760-331161702513

Package:

SMD/SMT

Datasheet:

WE-SECF Series

ECAD Model:

Description:

331161702513 datasheet pdf and RFI and EMI - Contacts, Fingerstock and Gaskets product details from Würth Elektronik stock available at Utmel

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FedEx International, 5-7 business days.

The following are some common countries' logistic time.transport
  • Prepare productStep1:Prepare product
  • Vacuum packagingStep2:Vacuum packaging
  • Anti-static bagStep3:Anti-static bag
  • Individual packageStep4:Individual package
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331161702513 information

Specifications
Documents & Media
Product Details
Würth Elektronik 331161702513 technical specifications, attributes, parameters and parts with similar specifications to Würth Elektronik 331161702513.
  • Type
    Parameter
  • Factory Lead Time
    42 Weeks
  • Mount

    In electronic components, the term "Mount" typically refers to the method or process of physically attaching or fixing a component onto a circuit board or other electronic device. This can involve soldering, adhesive bonding, or other techniques to secure the component in place. The mounting process is crucial for ensuring proper electrical connections and mechanical stability within the electronic system. Different components may have specific mounting requirements based on their size, shape, and function, and manufacturers provide guidelines for proper mounting procedures to ensure optimal performance and reliability of the electronic device.

    Surface Mount
  • Package / Case

    refers to the protective housing that encases an electronic component, providing mechanical support, electrical connections, and thermal management.

    SMD/SMT
  • Material

    In electronic components, the parameter "Material" refers to the substance or material used in the construction of the component. The choice of material is crucial as it directly impacts the component's performance, durability, and other characteristics. Different materials have varying properties such as conductivity, resistance to heat, corrosion resistance, and mechanical strength, which determine how the component functions in a circuit. Common materials used in electronic components include metals like copper and aluminum, semiconductors like silicon, insulators like ceramics and plastics, and various alloys. Selecting the appropriate material is essential for designing reliable and efficient electronic components.

    Beryllium Copper
  • Operating Temperature

    The operating temperature is the range of ambient temperature within which a power supply, or any other electrical equipment, operate in. This ranges from a minimum operating temperature, to a peak or maximum operating temperature, outside which, the power supply may fail.

    -40°C~100°C
  • Packaging

    Semiconductor package is a carrier / shell used to contain and cover one or more semiconductor components or integrated circuits. The material of the shell can be metal, plastic, glass or ceramic.

    Tape & Reel (TR)
  • Series

    In electronic components, the "Series" refers to a group of products that share similar characteristics, designs, or functionalities, often produced by the same manufacturer. These components within a series typically have common specifications but may vary in terms of voltage, power, or packaging to meet different application needs. The series name helps identify and differentiate between various product lines within a manufacturer's catalog.

    WE-SECF
  • Part Status

    Parts can have many statuses as they progress through the configuration, analysis, review, and approval stages.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a standardized rating that indicates the susceptibility of electronic components, particularly semiconductors, to moisture-induced damage during storage and the soldering process, defining the allowable exposure time to ambient conditions before they require special handling or baking to prevent failures

    1 (Unlimited)
  • Type
    Shield Finger
  • Plating

    In the context of electronic components, "Plating" refers to a process of depositing a thin layer of metal onto a substrate material. This plating is often used to enhance the component's performance, durability, and conductivity. The plating material can vary depending on the specific requirements of the component, with common choices including gold, silver, tin, and nickel. Plating can also be used for corrosion resistance, solderability, and to improve the overall appearance of the component. Overall, plating plays a crucial role in ensuring the reliability and functionality of electronic components in various applications.

    Gold
  • Attachment Method

    The attachment method in electronic components refers to the technique used to connect a component to a circuit board or assembly. This can include methods such as soldering, bonding, or using connectors. The choice of attachment method can affect the reliability, performance, and manufacturability of the electronic device. Different methods may be suited for specific applications based on factors like mechanical stress, thermal conductivity, and ease of assembly.

    Solder
  • Storage/Refrigeration Temperature

    The parameter "Storage/Refrigeration Temperature" in electronic components refers to the recommended temperature range at which the components should be stored to maintain their integrity and functionality. This parameter indicates the temperature limits within which the components can be safely stored without risking damage or degradation. Storage temperature is crucial for preserving the performance and reliability of electronic components over time, especially for sensitive components such as integrated circuits and semiconductors. Refrigeration temperature may be specified for certain components that require lower temperatures to prevent degradation or prolong shelf life. It is important to adhere to the recommended storage/refrigeration temperature guidelines to ensure the longevity and proper functioning of electronic components.

    -4°F~212°F - 40°C~100°C
  • Height
    0.512 13.00mm
  • Length
    0.276 7.00mm
  • Width
    0.098 2.50mm
  • Plating Thickness

    Plating thickness in electronic components refers to the measurement of the thickness of the metal plating applied to various surfaces of the component. This plating is typically done to enhance the component's conductivity, corrosion resistance, and solderability. The plating thickness is an important parameter as it directly affects the performance and reliability of the electronic component. Manufacturers specify the required plating thickness to ensure that the component meets the desired electrical and mechanical properties for its intended application. Testing and quality control measures are often employed to verify that the plating thickness meets the specified requirements.

    Flash
  • Thickness

    Thickness in electronic components refers to the measurement of how thick a particular material or layer is within the component structure. It can pertain to various aspects, such as the thickness of a substrate, a dielectric layer, or conductive traces. This parameter is crucial as it impacts the electrical, mechanical, and thermal properties of the component, influencing its performance and reliability in electronic circuits.

    13mm
  • REACH SVHC

    The parameter "REACH SVHC" in electronic components refers to the compliance with the Registration, Evaluation, Authorization, and Restriction of Chemicals (REACH) regulation regarding Substances of Very High Concern (SVHC). SVHCs are substances that may have serious effects on human health or the environment, and their use is regulated under REACH to ensure their safe handling and minimize their impact.Manufacturers of electronic components need to declare if their products contain any SVHCs above a certain threshold concentration and provide information on the safe use of these substances. This information allows customers to make informed decisions about the potential risks associated with using the components and take appropriate measures to mitigate any hazards.Ensuring compliance with REACH SVHC requirements is essential for electronics manufacturers to meet regulatory standards, protect human health and the environment, and maintain transparency in their supply chain. It also demonstrates a commitment to sustainability and responsible manufacturing practices in the electronics industry.

    Unknown
  • RoHS Status

    RoHS means “Restriction of Certain Hazardous Substances” in the “Hazardous Substances Directive” in electrical and electronic equipment.

    ROHS3 Compliant
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Download datasheets and manufacturer documentation for Würth Elektronik 331161702513.

Product Description

Description

The Würth Elektronik WE-SECF Series Shield Finger Contact, part number 331161702513, is a high-quality surface mount component designed to provide effective shielding against Radio Frequency Interference (RFI) and Electromagnetic Interference (EMI). Made from beryllium copper, this contact features a gold plating for enhanced reliability and durability. The component's compact dimensions make it ideal for use in various electronic applications where RFI/EMI protection is crucial.

Features

  • Material: Beryllium Copper for excellent electrical conductivity and mechanical strength.
  • Attachment Method: Solderable for easy integration into PCBs.
  • Dimensions: Height of 0.512 mm (13.00 mm), Length of 0.276 mm (7.00 mm), and Width of 0.098 mm (2.50 mm).
  • Operating Temperature Range: -40°C to 100°C, ensuring reliable performance across a wide temperature range.
  • Mounting Type: Surface Mount (SMD/SMT) for efficient use in modern electronic designs.
  • Packaging: Available in Tape & Reel (TR) format for convenient handling and storage.
  • Plating: Gold plating with a flash thickness for improved corrosion resistance and conductivity.
  • Compliance: ROHS3 compliant, ensuring environmental sustainability.

Applications

  1. Primary Applications:
  2. Use in high-frequency circuits such as radio transmitters, receivers, and antennas to mitigate RFI/EMI.
  3. Integration into PCBs for shielding sensitive components from electromagnetic interference.

  4. Secondary Applications:

  5. Use in medical devices where RFI/EMI shielding is critical for patient safety.
  6. Incorporation into automotive electronics to reduce electromagnetic interference that could affect vehicle systems.

Alternative Parts

If the WE-SECF Series Shield Finger Contact is not available or if you need alternative options, consider the following alternatives from Würth Elektronik:

  • WE-SF Series Shield Finger Contacts
  • WE-SF-xx Series Shield Finger Contacts

These alternatives offer similar performance characteristics but may have slight variations in dimensions or plating thicknesses.

Embedded Modules

The WE-SECF Series Shield Finger Contact can be used in various embedded modules designed for RFI/EMI protection:

  1. RF/IF Modules: Used in radio frequency and intermediate frequency circuits to shield sensitive components from electromagnetic interference.
  2. EMC Modules: Integrated into electromagnetic compatibility modules to ensure compliance with regulatory standards for electromagnetic emissions.
  3. High-Frequency PCBs: Embedded into printed circuit boards used in high-frequency applications such as wireless communication systems.

By incorporating the WE-SECF Series Shield Finger Contact into your design, you can ensure robust protection against RFI/EMI while maintaining the reliability and efficiency required by modern electronic systems.