- Manufacturer
- Packaging
- Series
- Package / Case
- Number of I/Os
- Architecture
- Connectivity
- Core Processor
- Operating Temperature
- Peripherals
- Primary Attributes
- RAM Size
- Moisture Sensitivity Level (MSL)
Attribute column
Categories
Embedded - System On Chip (SoC)
Product | Inventory | Pricing(USD) | Quantity | Datasheet | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Core Architecture | Max Frequency | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Logic Cells | Number of Cores | Bus Compatibility | Flash Size | UV Erasable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 A2F500M3G-1CSG288 Microchip Technology | In Stock | - | - | - | - | - | 288-TFBGA, CSPBGA | - | - | 288-CSP (11x11) | - | A2F500 | 64 kB | 176 | - | - | - | - | 100 MHz | - | - | Microchip Technology | - | - | Yes | - | - | MCU - 31, FPGA - 78 | - | 6000 LE | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | - | - | 0°C ~ 85°C (TJ) | Tray | - | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100MHz | 64KB | - | ARM® Cortex®-M3 | DMA, POR, WDT | 512 kB | EBI/EMI, Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | - | - | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | 1 Core | - | 512KB | - | - | - | - | - | - | ||
M2S010T-1VFG400I Microchip Technology | In Stock | - | - | - | - | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S010 | 64 kB | 90 | MICROSEMI CORP | - | - | M2S010T-1VFG400I | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | Yes | 3 | SMD/SMT | 195 | 1007 LAB | 12084 LE | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 2.5, 3.3 V | - | -40 to 100 °C | Tray | - | SmartFusion2 | e1 | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | CMOS | BOTTOM | BALL | 250 | - | 0.8 mm | compliant | - | - | - | S-PBGA-B400 | 195 | Not Qualified | - | - | 1.2 V | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 195 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1 | - | FPGA - 10K Logic Modules | 12084 | 1 Core | - | 256KB | - | - | 17 mm | 17 mm | - | - | ||
M2S050-FG484I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | FPBGA-484 | - | - | - | - | - | 64 kB | 60 | - | - | - | - | 166 MHz | - | - | - | - | - | Yes | - | SMD/SMT | - | 4695 LAB | 56340 LE | - | - | - | - | - | - | - | - | - | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | - | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | - | ||
 10AS066H3F34I2SG Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 1152-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 492 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | - | Arria 10 SX | - | Active | 3 (168 Hours) | - | - | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B1152 | 492 | Not Qualified | - | 0.93V | 0.9V | 0.87V | - | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 492 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 660K Logic Elements | 660000 | - | - | - | - | 3.65mm | 35mm | 35mm | - | RoHS Compliant | ||
 5CSXFC5C6U23C8N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | - | Active | 3 (168 Hours) | 672 | - | - | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSXFC5 | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 600MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 85K Logic Elements | 85000 | - | - | - | - | 1.85mm | 23mm | 23mm | - | RoHS Compliant | ||
 XCZU3CG-1SFVC784I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XC7Z100-1FFG1156I Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 250 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | - | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 245 | 1V | 1mm | not_compliant | 667MHz | 30 | - | S-PBGA-B1156 | - | - | - | 1.05V | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | - | YES | -1 | 256000 | Kintex™-7 FPGA, 444K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 3.1mm | 35mm | - | - | ROHS3 Compliant | ||
 XCZU3CG-1SBVA484E Xilinx Inc. | 380 | - | Datasheet | 11 Weeks | - | - | 484-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 82 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XCZU9EG-2FFVB1156I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
XCZU4EV-1SFVC784I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 XC7Z045-2FBG676E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | - | - | 676-BBGA, FCBGA | - | - | 676-FCBGA (27x27) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | - | Active | 3 (168 Hours) | - | - | - | 100°C | 0°C | - | - | - | - | - | - | - | - | - | 800MHz | - | XC7Z045 | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 800MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | 733MHz | - | -2 | - | Kintex™-7 FPGA, 350K Logic Cells | - | - | - | - | - | - | - | - | No | ROHS3 Compliant | ||
XCZU9EG-1FFVB1156I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 5CSEBA4U19C7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 484-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 151, FPGA - 66 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | Active | 3 (168 Hours) | 484 | - | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | 66 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 66 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 40K Logic Elements | 40000 | - | - | - | - | 1.9mm | 19mm | 19mm | - | RoHS Compliant | ||
5CSXFC4C6U23C7N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SX | - | Active | 3 (168 Hours) | 672 | - | - | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 40K Logic Elements | 40000 | - | - | - | - | 1.85mm | 23mm | 23mm | - | RoHS Compliant | ||
M2S050-FGG484I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | FPBGA-484 | - | - | - | - | - | 64 kB | 60 | - | - | - | - | 166 MHz | - | - | - | - | - | Yes | - | SMD/SMT | - | 4695 LAB | 56340 LE | - | - | - | - | - | - | - | - | - | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0.489749 oz | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | - | ||
M2S010-VFG256I Atmel (Microchip Technology) | In Stock | - | - | - | - | - | VFPBGA-256 | - | - | - | - | - | 64 kB | 119 | - | - | - | - | 166 MHz | - | + 100 C | - | - | - 40 C | Yes | - | SMD/SMT | 138 I/O | 1007 LAB | 12084 LE | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | - | - | - | - | - | - | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | 256 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | - | ||
XCZU15EG-L1FFVB1156I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | 1156-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 328 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | NOT SPECIFIED | - | R-PBGA-B1156 | - | - | - | 0.742V | - | 0.698V | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
 5CSXFC5D6F31C8N Intel | In Stock | - | Datasheet | 8 Weeks | - | - | 896-BGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 288 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2015 | Cyclone® V SX | - | Active | 3 (168 Hours) | 896 | - | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 1mm | - | - | NOT SPECIFIED | 5CSXFC5 | S-PBGA-B896 | 288 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | 1.07V | - | 600MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 288 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 85K Logic Elements | 85000 | - | - | - | - | 2mm | 31mm | 31mm | - | RoHS Compliant | ||
 XC7Z030-2SBG485E Xilinx Inc. | In Stock | - | Datasheet | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-FBGA, FCBGA | - | 485 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | Active | 4 (72 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | 800MHz | NOT SPECIFIED | - | - | - | Not Qualified | - | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | - | YES | - | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | N | 2.44mm | 19mm | - | - | ROHS3 Compliant | ||
XCZU2EG-2SFVC784I Xilinx Inc. | In Stock | - | Datasheet | 11 Weeks | - | - | 784-BFBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 784 | - | - | - | - | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | - | NOT SPECIFIED | - | R-PBGA-B784 | - | - | - | 0.876V | - | 0.825V | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant |